Microelectronic devices, and related memory devices and electronic systems
A microelectronic device includes a memory array region, a control logic region overlying the memory array region, and a pad region overlying the control logic region. The memory array region includes a stack structure including vertically alternating conductive structures and insulating structures; vertically extending strings of memory cells within the stack structure; at least one source structure vertically underlying the stack structure and coupled to the vertically extending strings of memory cells; and digit line structures vertically overlying the stack structure and coupled to the vertically extending strings of memory cells. The control logic region includes control logic devices configured to effectuate control operations for the vertically extending strings of memory cells. The pad region includes conductive pad structures coupled to the control logic devices. Memory devices and electronic systems are also described.
1 . A microelectronic device, comprising:
a memory array region comprising:
a stack structure comprising vertically alternating conductive structures and insulating structures;
vertically extending strings of memory cells within the stack structure;
at least one source structure vertically underlying the stack structure and coupled to the vertically extending strings of memory cells; and
digit line structures vertically overlying the stack structure and coupled to the vertically extending strings of memory cells;
a control logic region overlying the memory array region comprising;
control logic devices partially vertically underlying a base semiconductor structure, the control logic devices configured to effectuate control operations for the vertically extending strings of memory cells;
dielectric-filled trenches vertically extending into portions of the base semiconductor structure from a lowermost boundary of the base semiconductor structure; and
conductive contact structures vertically extending through the base semiconductor structure and entirely through some of the dielectric-filled trenches; and
a pad region overlying the control logic region and comprising conductive pad structures coupled to at least some of the control logic devices.
2 . The microelectronic device of claim 1 , wherein the control logic region comprises:
the control logic devices individually including control logic circuitry comprising:
transistors partially vertically underlying the base semiconductor structure; and
conductive routing structures vertically underlying and coupled to the transistors; and
the conductive contact structures coupled to the conductive pad structures and to the conductive routing structures of the control logic circuitry of the at least some of the control logic devices.
3 . The microelectronic device of claim 2 , wherein the conductive pad structures individually horizontally overlap at least some of the transistors of the control logic circuitry of the at least some of the control logic devices.
4 . The microelectronic device of claim 1 , wherein the control logic region further comprises some of the dielectric-filled trenches horizontally interposed between horizontally neighboring pairs of transistors of a control logic circuitry of the at least some of the control logic devices.
5 . The microelectronic device of claim 1 , wherein upper surfaces of the conductive contact structures vertically overlie an upper surface of the base semiconductor structure.
6 . The microelectronic device of claim 5 , wherein lower surfaces of the conductive pad structures physically contact the upper surfaces of the conductive contact structures and vertically overlie the upper surface of the base semiconductor structure.
7 . The microelectronic device of claim 1 , wherein the conductive pad structures individually have at least one of the conductive contact structures in physical contact therewith.
8 . The microelectronic device of claim 1 , wherein the conductive pad structures individually horizontally overlap the stack structure.
9 . The microelectronic device of claim 8 , wherein the conductive contact structures individually horizontally overlap the stack structure.
10 . The microelectronic device of claim 1 , further comprising an interconnect region vertically interposed between the memory array region and the control logic region, the interconnect region comprising structures coupling the digit line structures of the memory array region to the control logic devices of the control logic region.
11 . The microelectronic device of claim 10 , wherein the structures comprise:
digit line contact structures vertically overlying and coupled to the digit line structures;
additional conductive pad structures vertically overlying and coupled to the digit line contact structures; and
conductive routing structures vertically interposed between the additional conductive pad structures and the control logic devices of the control logic region, at least some of the conductive routing structures coupled to at least some of the additional conductive pad structures and one or more of the control logic devices.
12 . The microelectronic device of claim 10 , wherein the memory array region further comprises deep contact structures within a horizontal area of the stack structure and vertically extending completely through the stack structure, the deep contact structures coupled to the at least one source structure of the memory array region and to some of the structures of the interconnect region.
13 . The microelectronic device of claim 12 , wherein the memory array region further comprises additional deep contact structures outside of the horizontal area of the stack structure and vertically extending across an entire vertical height of the stack structure, the additional deep contact structures coupled to the at least one source structure of the memory array region and to some others of the structures of the interconnect region.
14 . The microelectronic device of claim 1 , wherein at least one of the conductive contact structures is individually at least partially positioned within a horizontal area of the vertically extending strings of memory cells of the memory array region.
15 . A memory device, comprising:
a memory array region comprising:
a stack structure comprising tiers each including conductive material and insulative material vertically neighboring the conductive material;
strings of memory cells extending through the stack structure;
one or more source structures underlying the stack structure and coupled to the strings of memory cells; and
data line structures overlying the stack structure and coupled to the strings of memory cells;
an interconnect region overlying the memory array region and comprising:
conductive pad structures overlying and coupled to the data line structures; and
conductive routing structures overlying and coupled to the conductive pad structures;
a control logic region overlying the interconnect region and comprising:
dielectric-filled trenches vertically extending at least partially through a base semiconductor structure;
conductive contact structures extending completely through the base semiconductor structure and the dielectric-filled trenches; and
complementary metal-oxide-semiconductor (CMOS) circuitry at least partially underlying the base semiconductor structure and coupled to the conductive contact structures; and
a pad region overlying the control logic region and comprising additional conductive pad structures coupled to the conductive contact structures.
16 . The memory device of claim 15 , wherein the conductive contact structures comprise conductively filled vias vertically extending from the additional conductive pad structures, through semiconductor material of the base semiconductor structure, through isolation material underlying the base semiconductor structure, and to additional conductive routing structures of the CMOS circuitry.
17 . The memory device of claim 15 , wherein the base semiconductor structure comprises a silicon wafer.
18 . The memory device of claim 15 , wherein additional conductive pad structures and the conductive contact structures are individually at least partially positioned within a horizontal area of the CMOS circuitry.
19 . The memory device of claim 15 , wherein additional conductive pad structures and the conductive contact structures are individually at least partially positioned within a horizontal area of the stack structure.
20 . The memory device of claim 15 , wherein:
upper surfaces of the conductive contact structures vertically overlie an upper surface of the base semiconductor structure; and
lower surfaces of the additional conductive pad structures are vertically offset from the upper surface of the base semiconductor structure by a vertical height of portions of the conductive contact structures vertically overlying the upper surface of the base semiconductor structure.
21 . The memory device of claim 15 , wherein:
the base semiconductor structure has a non-planar lower boundary and a substantially planar upper boundary; and
transistors of the CMOS circuitry are vertically positioned along the non-planar lower boundary of the base semiconductor structure.
22 . The memory device of claim 21 , wherein the transistors of the CMOS circuitry individually comprise:
two conductively doped regions of the base semiconductor structure;
a channel region within the base semiconductor structure and horizontally interposed between the two conductively doped regions of the base semiconductor structure;
a gate electrode vertically underlying and horizontally overlapping the channel region; and
a gate dielectric material vertically interposed between and horizontally overlapping the channel region and the gate electrode.
23 . The memory device of claim 21 , wherein the conductive contact structures are individually horizontally positioned between horizontally neighboring pairs of the transistors of the CMOS circuitry.
24 . An electronic system, comprising:
an input device;
an output device;
a processor device operably coupled to the input device and the output device; and
a memory device operably coupled to the processor device and comprising:
a stack structure comprising conductive structures vertically interleaved with insulative structures;
a source structure underlying the stack structure;
digit lines overlying the stack structure;
strings of memory cells vertically extending through the stack structure and in electrical communication with the source structure and the digit lines;
control logic circuitry overlying and in electrical communication with the strings of memory cells;
semiconductor material at least partially overlying the control logic circuitry;
conductive pad structures overlying the semiconductor material; and
conductive contact structures in electrical communication with the conductive pad structures and the control logic circuitry, the conductive contact structures vertically extending from the conductive pad structures, through the semiconductor material, and to the control logic circuitry, some of the conductive contact structures at least partially positioned within horizontal areas of some of the strings of memory cells.
25 . The electronic system of claim 24 , wherein the memory device comprises a 3D NAND Flash memory device.