Electronic element mounting substrate and electronic device
An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.
1. An electronic element mounting substrate comprising:
a first ceramic substrate that comprises a first main surface, has a rectangular shape, and comprises a mounting portion for an electronic element on the first main surface; and
a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, comprises a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, wherein a first thermal conductivity in a first planar direction of the first main surface is less than both a second thermal conductivity in a second planar direction of the first main surface and a third thermal conductivity in a thickness direction perpendicular to the first and second planar directions, wherein the third thermal conductivity is equivalent to the second thermal conductivity, and wherein
the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and
the second substrate comprises a recessed portion on the fourth main surface.
2. The electronic element mounting substrate according to claim 1 , wherein
the recessed portion overlaps the mounting portion in perspective plan view.
3. The electronic element mounting substrate according to claim 1 , further comprising
a third substrate that is located on the fourth main surface, has a rectangular shape, comprises a fifth main surface facing the fourth main surface and a sixth main surface opposite to the fifth main surface, and comprises a through-hole penetrating in a thickness direction, and facing the recessed portion.
4. The electronic element mounting substrate according to claim 3 , wherein
the through-hole overlaps the mounting portion in perspective plan view.
5. An electronic device comprising:
the electronic element mounting substrate according to claim 1 ;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a heat transfer member in the recessed portion.
6. The electronic element mounting substrate according to claim 2 , further comprising
a third substrate that is located on the fourth main surface, has a rectangular shape, comprises a fifth main surface facing the fourth main surface and a sixth main surface opposite to the fifth main surface, and comprises a through-hole penetrating in a thickness direction, and facing the recessed portion.
7. The electronic element mounting substrate according to claim 6 , wherein
the through-hole overlaps the mounting portion in perspective plan view.
8. An electronic device comprising:
the electronic element mounting substrate according to claim 2 ;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a heat transfer member in the recessed portion.
9. An electronic device comprising:
the electronic element mounting substrate according to claim 3 ;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a heat transfer member in the recessed portion.
10. An electronic device comprising:
the electronic element mounting substrate according to claim 4 ;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a heat transfer member in the recessed portion.
11. An electronic device comprising:
the electronic element mounting substrate according to claim 6 ;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a heat transfer member in the recessed portion.
12. An electronic device comprising:
the electronic element mounting substrate according to claim 7 ;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a heat transfer member in the recessed portion.