IP Library › Granted Patent US 11,383,478
Granted Patent B2
US 11,383,478 · App. 16/344,754 · Granted Jul 12, 2022

Metallic lustrous member with electromagnetic wave transmissibility, article using the member, and metal thin film

Inventors: Hajime Nishio (Ibaraki, JP); Hironobu Machinaga (Ibaraki, JP); Xiaolei Chen (Ibaraki, JP); Toshihiro Tsurusawa (Ibaraki, JP); Manami Kurose (Ibaraki, JP)
Assignee: NITTO DENKO CORPORATION
B32B3/14B32B9/00B32B9/041B32B15/04B32B15/08C23C14/086C23C28/345C23C14/185C23C14/35Y10T428/24917
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Quick Facts
Patent No.
US 11,383,478
App. No.
16/344,754
Granted
Jul 12, 2022
Kind
B2
Abstract

A metallic lustrous member with electromagnetic wave transmissibility, which is capable of being easily produced even when using not only chromium (Cr) or indium (In) but also any of some other metals such as aluminum (Al), as a material for a metal layer thereof. A metallic lustrous member with electromagnetic wave transmissibility, which is capable of using silver (Ag), zinc (Zn), lead (Pb) or copper (Cu), or an alloy thereof, as a material for a metal layer thereof, in addition to aluminum (Al). The metallic lustrous member with electromagnetic wave transmissibility, comprises an indium oxide-containing layer provided along a surface of a substrate, and a metal layer laminated on the indium oxide-containing layer, wherein the metal layer includes, in at least part thereof, a plurality of portions which are in a discontinuous state.

Claims (22)

1. A metallic lustrous member with electromagnetic wave transmissibility, comprising:

a substrate;

a continuous indium oxide-containing layer on a surface of the substrate; and

a metal layer consisting of aluminum (Al) and optionally one of the following: zinc (Zn), lead (Pb), copper (Cu) or silver (Ag) and alloys thereof, formed by sputtering on the continuous indium oxide-containing layer,

wherein

the metal layer is formed having a plurality of portions which are in a discontinuous state on the continuous indium oxide-containing layer.

2. The member as recited in claim 1 , wherein the indium oxide-containing layer is made of one selected from the group consisting of indium oxide (In 2 O 3 ), indium tin oxide (ITO) and indium zinc oxide (IZO).

3. The member as recited in claim 1 , wherein the indium oxide-containing layer has a thickness of 1 nm to 1000 nm.

4. The member as recited in claim 1 , wherein the metal layer has a thickness of 20 nm to 100 nm.

5. The member as recited in claim 1 , wherein a ratio of the thickness of the metal layer to the thickness of the indium oxide-containing layer (the thickness of the metal layer/the thickness of the indium oxide-containing layer) is from 0.02 to 100.

6. The member as recited in claim 1 , wherein a laminate of the metal layer and the indium oxide-containing layer has a sheet resistance of 100 to 100,000Ω/□.

7. The member as recited in claim 1 , wherein each of the portions is formed in an island shape.

8. The member as recited in claim 1 , wherein the substrate is one selected from the group consisting of a substrate film, a resin molded substrate, a glass substrate, and an article body to be imparted with metallic luster.

9. An article which uses the substrate film, the resin molded substrate or the glass substrate, as recited in claim 8 .

10. A metal thin film provided along a surface of a substrate, wherein

the substrate comprises a base portion and a continuous indium oxide-containing layer on the base portion,

the metal thin film is formed by sputtering on the continuous indium oxide-containing layer,

the metal thin film has a thickness of 20 nm to 100 nm, and

the metal thin film is formed having a plurality of island-shaped portions which are in a discontinuous state on the continuous indium oxide-containing layer, and

the metal thin film consists of aluminum (Al) and optionally one of the following: zinc (Zn), lead (Pb), copper (Cu) or silver (Ag) and alloys thereof.

11. An article in which the metallic lustrous member as recited in claim 1 is provided on a body of the article.

12. The member as recited in claim 1 , wherein the indium oxide-containing layer is provided on the surface of the substrate by sputtering.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2019
From: NISHIO, HAJIME; MACHINAGA, HIRONOBU; CHEN, XIAOLEI; TSURUSAWA, TOSHIHIRO; KUROSE, MANAMI
To: NITTO DENKO CORPORATION
Reel/Frame 048987/0204 →
Priority Claims (1)
JP JP2016-208000 · Oct 24, 2016 · national
Continuity (1)
Related Publication 20190275759A1 · Sep 12, 2019
Cited By (1)
US 12,320,490