IP Library › Granted Patent US 11,384,451
Granted Patent B2
US 11,384,451 · App. 16/962,712 · Granted Jul 12, 2022

Crucible for crystal growth as well as method for releasing thermal stress in silicon carbide crystal

Inventors: Pan Gao (Shanghai, CN); Jun Xin (Shanghai, CN); Haikuan Kong (Shanghai, CN); Xuechao Liu (Shanghai, CN); Yanqing Zheng (Shanghai, CN); Erwei Shi (Shanghai, CN)
Assignee: ANHUI WEIXIN CHANGJIANG SEMICONDUCTOR MATERIAL CO., LTD.
C30B35/002C30B29/36
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Quick Facts
Patent No.
US 11,384,451
App. No.
16/962,712
Granted
Jul 12, 2022
Kind
B2
Abstract

The invention relates to a crucible for crystal growth and a method for releasing thermal stress of silicon carbide crystals. The crucible is a crucible in contact with the side surface of the prepared crystals, and the crucible has an annular non-closed splicing structure. The crucible for the crystal growth has the annular non-closed splicing structure, so that the crystals can be prevented from being hooped, hot stress concentrated in the crystals in the growth process of the crystals can be effectively released, the fracturing rate of the crystals can be reduced, and the finished product rate of the crystals can be increased.

Claims (9)

1. A method for releasing thermal stress of a silicon carbide crystal during growth of the silicon carbide crystal, comprising:

depositing and growing a silicon carbide single crystal on a surface of a seed crystal by a physical vapor transport method;

contacting a side surface of the silicon carbide crystal during the growth in a growth zone chamber with a crucible having an annular non-closed splicing structure comprising splicing parts so that the crystal is prevented from being hooped and thermal stress concentrated in the crystal during the growth of the crystal is released; and

controlling a gap or tolerance of a splicing area between the splicing parts to be 1 to 3 mm.

2. The method of claim 1 , wherein in the physical vapor transport method, a crystal growing furnace is depressurized to a vacuum degree of 1.0×10 −2 Pa or lower, and filled with an inert atmosphere until the growth pressure reaches 6 to 40 Torr, and the growth temperature is 2,000 to 2,400° C.

3. The method of claim 1 , wherein the thickness of the splicing parts of the crucible in direct contact with the side surface of the crystal during the growth is 1 to 10 mm.

4. The method of claim 1 , wherein the crucible is a graphite crucible, a silicon carbide crucible, or a titanium carbide crucible.

5. The method of claim 1 , wherein the crucible has a single-layer structure, and the splicing parts form a concave-convex engagement type splicing structure.

6. The method of claim 1 , wherein the crucible has a multi-layer nested structure, wherein at least the innermost layer has the annular non-closed splicing structure, and the annular non-closed splicing structure is at least one of a direct joint type splicing structure and a concave-convex engagement type splicing structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2020
From: SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES
To: ANHUI WEIXIN CHANGJIANG SEMICONDUCTOR MATERIAL CO., LTD.
Reel/Frame 054752/0108 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2020
From: GAO, PAN; XIN, JUN; KONG, HAIKUAN; LIU, XUECHAO; ZHENG, YANQING; SHI, ERWEI
To: SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES
Reel/Frame 053230/0742 →
Priority Claims (1)
CN 201810069412.9 · Jan 24, 2018 · national
Continuity (1)
Related Publication 20200354856A1 · Nov 12, 2020