IP Library › Granted Patent US 11,387,036
Granted Patent B2
US 11,387,036 · App. 16/823,557 · Granted Jul 12, 2022

Inductor device

Inventors: Hsiao-Tsung Yen (Hsinchu, TW); Ka-Un Chan (Hsinchu, TW)
Assignee: REALTEK SEMICONDUCTOR CORPORATION
H01F27/2804H01F17/0013H01F27/2828H01F27/29H01F2017/004H01F2017/0073H01F2027/2809H01F2027/2819
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Quick Facts
Patent No.
US 11,387,036
App. No.
16/823,557
Granted
Jul 12, 2022
Kind
B2
Abstract

An inductor device includes a first wire, a second wire, a third wire, a fourth wire, and an eight-shaped inductor structure. The first wire includes at least two first sub-wires. The second wire includes at least two second sub-wires. The third wire includes at least two third sub-wires. The fourth wire includes at least two fourth sub-wires. The first wire is disposed in a first area. The second wire is disposed in a second area. The third wire is disposed in the first area and at least partially overlapped with the first wire in a vertical direction. The fourth wire is disposed in the second area and at least partially overlapped with the second wire in the vertical direction. The eight-shaped inductor structure is disposed on an outer side of the third wire and the fourth wire.

Claims (25)

1. An inductor device, comprising:

a first wire disposed in a first area, wherein the first wire comprises at least two first sub-wires;

a second wire disposed in a second area, wherein the second wire comprises at least two second sub-wires;

a third wire disposed in the first area and being at least partially overlapped with the first wire in a vertical direction, wherein the third wire comprises at least two third sub-wires;

a fourth wire disposed in the second area and being at least partially overlapped with the second wire in the vertical direction, wherein the fourth wire comprises at least two fourth sub-wires; and

an eight-shaped inductor structure disposed on an outer side of the third wire and the fourth wire.

2. The inductor device of claim 1 , wherein one of the at least two first sub-wires is coupled to one of the at least two third sub-wires.

3. The inductor device of claim 1 , wherein one of the at least two second sub-wires is coupled to one of the at least two fourth sub-wires.

4. The inductor device of claim 1 , wherein one of the at least two first sub-wires is coupled to one of the at least two second sub-wires.

5. The inductor device of claim 1 , wherein each of the at least two first sub-wires is wound into a plurality of turns.

6. The inductor device of claim 5 , wherein the at least two first sub-wires are not directly coupled to each other.

7. The inductor device of claim 6 , wherein each of the at least two second sub-wires is wound into a plurality of turns.

8. The inductor device of claim 7 , wherein the at least two second sub-wires are not directly coupled to each other.

9. The inductor device of claim 1 , wherein each of the at least two third sub-wires is wound into a plurality of turns.

10. The inductor device of claim 9 , wherein the at least two third sub-wires are directly coupled to each other.

11. The inductor device of claim 10 , wherein each of the at least two fourth sub-wires is wound into a plurality of turns.

12. The inductor device of claim 11 , wherein the at least two fourth sub-wires are not directly coupled to each other.

13. The inductor device of claim 1 , wherein one of the at least two third sub-wires is coupled with one of the at least two first sub-wires on a first side of the first area in an interlaced manner, and another one of the at least two third sub-wires is coupled with another one of the at least two first sub-wires on a second side of the first area in an interlaced manner.

14. The inductor device of claim 13 , wherein the first side of the first area is opposite to the second side of the first area.

15. The inductor device of claim 1 , wherein the third wire is disposed above the first wire or below the first wire.

16. The inductor device of claim 1 , wherein one of the at least two fourth sub-wires is coupled with one of the at least two second sub-wires on a first side of the second area in an interlaced manner, and another one of the at least two fourth sub-wires is coupled with another one of the at least two second sub-wires on a second side of the second area in an interlaced manner.

17. The inductor device of claim 16 , wherein the first side of the second area is opposite to the second side of the second area.

18. The inductor device of claim 1 , wherein the fourth wire is disposed above the second wire or below the second wire.

19. The inductor device of claim 1 , wherein the first wire and the second wire are located on a same layer, the third wire and the fourth wire are located on a same layer.

20. The inductor device of claim 19 , wherein the first wire is located on a different layer from the third wire, and the second wire is located on a different layer from the fourth wire.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2020
From: YEN, HSIAO-TSUNG; CHAN, KA-UN
To: REALTEK SEMICONDUCTOR CORPORATION
Reel/Frame 052164/0933 →
Priority Claims (1)
TW 108145177 · Dec 10, 2019 · national
Continuity (3)
Provisional Application 62826286 · Mar 29, 2019
Provisional Application 62871263 · Jul 8, 2019
Related Publication 20200312521A1 · Oct 1, 2020