IP Library › Granted Patent US 11,387,566
Granted Patent B2
US 11,387,566 · App. 16/619,624 · Granted Jul 12, 2022

Electromagnetic wave absorber and molded article with electromagnetic wave absorber

Inventors: Hiroichi Ukei (Osaka, JP); Takehiro Ui (Osaka, JP); Hironobu Machinaga (Osaka, JP); Kazuto Yamagata (Osaka, JP); Yuuki Takeda (Osaka, JP)
Assignee: NITTO DENKO CORPORATION
H01Q17/00B32B7/025B32B15/046B32B15/08B32B2307/202B32B2307/204B32B2307/208B32B2457/00
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Quick Facts
Patent No.
US 11,387,566
App. No.
16/619,624
Granted
Jul 12, 2022
Kind
B2
Abstract

An electromagnetic wave absorber ( 1 a) includes a first layer ( 10 ) and an electrically conductive layer ( 20 ). The first layer ( 10 ) is a dielectric layer or a magnetic layer. The electrically conductive layer ( 20 ) is provided on at least one surface of the first layer. A product of a Young's modulus of the first layer ( 10 ) and a thickness of the first layer ( 10 ) is 0.1 to 1000 MPa·mm. The first layer ( 10 ) has a relative permittivity of 1 to 10.

Claims (22)

1. An electromagnetic wave absorber comprising:

a first layer that is a dielectric layer or a magnetic layer; and

an electrically conductive layer that is provided on at least one surface of the first layer, wherein

a product of a Young's modulus of the first layer and a thickness of the first layer is 0.1 to 1000 MPa·mm, and

the first layer has a relative permittivity of 1 to 10.

2. The electromagnetic wave absorber according to claim 1 , wherein the Young's modulus of the first layer is 2000 MPa or less.

3. The electromagnetic wave absorber according to claim 1 , wherein the first layer contains a polymer material.

4. The electromagnetic wave absorber according to claim 1 , wherein the first layer is a foam.

5. The electromagnetic wave absorber according to claim 1 , wherein at least one of a dielectric substance and a magnetic substance is dispersed in the first layer.

6. The electromagnetic wave absorber according to claim 1 , wherein a product of a Young's modulus of the electrically conductive layer and a thickness of the electrically conductive layer is 12000 MPa·mm or less.

7. The electromagnetic wave absorber according to claim 1 , wherein the electrically conductive layer contains a metal.

8. The electromagnetic wave absorber according to claim 1 , wherein

the electrically conductive layer includes a support and an electrically conductive functional layer that has electrical conductivity and is in contact with the support, and

the support is disposed between the first layer and the electrically conductive functional layer and the support protects the electrically conductive functional layer.

9. The electromagnetic wave absorber according to claim 1 , further comprising a resistive layer that is provided on at least one surface of the first layer, wherein

the first layer is the dielectric layer and disposed between the resistive layer and the electrically conductive layer.

10. The electromagnetic wave absorber according to claim 9 , wherein the resistive layer has a sheet resistance of 200 to 600 Ω/□.

11. The electromagnetic wave absorber according to claim 1 , wherein the electromagnetic wave absorber exhibits an electromagnetic wave absorption of 20 dB or more in a bandwidth of 2 GHz or more included in a frequency band of 50 to 100 GHz.

12. The electromagnetic wave absorber according to claim 1 , further comprising an adhesive layer disposed on an external side of the electrically conductive layer.

13. A molded article with an electromagnetic wave absorber, comprising:

a molded article; and

the electromagnetic wave absorber according to claim 1 attached to the molded article.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2019
From: UKEI, HIROICHI; UI, TAKEHIRO; MACHINAGA, HIRONOBU; YAMAGATA, KAZUTO; TAKEDA, YUUKI
To: NITTO DENKO CORPORATION
Reel/Frame 051190/0851 →
Priority Claims (1)
JP JP2017-116292 · Jun 13, 2017 · national
Continuity (1)
Related Publication 20200161771A1 · May 21, 2020
Cited By (1)
US 12,695,207