Metalens unit, semiconductor fault analysis device, and semiconductor fault analysis method

1. A metalens unit comprising:

a metalens having a first surface abutting on an observation target and a second surface opposing the first surface; and

a holding portion holding the metalens,

wherein the metalens comprises:

a base portion provided between the first surface and the second surface;

a plurality of first antennas provided between the first surface and the base portion, the plurality of first antennas each having a first refractive index and a first-antenna end surface constituting a part of the first surface; and

a first intermediate portion provided between the first surface and the base portion such that a part is positioned between the plurality of first antennas, the first intermediate portion having a second refractive index different from the first refractive index and a first-intermediate-portion end surface constituting a remaining part of the first surface, and

wherein a first antenna portion including the plurality of first antennas and the first intermediate portion is formed such that a one-dimensional arrangement constituted by the first-antenna end surfaces of which centers of gravity are positioned on at least one first reference line on the first surface among the first-antenna end surfaces of the plurality of first antennas includes an arrangement pattern in which at least one of a size of the first-antenna end surface, a shape of the first-antenna end surface, and a first arrangement pitch is changed along the first reference line.

2. The metalens unit according to claim 1 ,

wherein the first intermediate portion is formed integrally with the base portion, and

wherein each of the first-antenna end surfaces of the plurality of first antennas is arranged on the first surface in an exposed state.

3. The metalens unit according to claim 1 ,

wherein each of the plurality of first antennas has a shape protruding from the base portion toward the first surface, and

the first intermediate portion is formed by a liquid filling between the plurality of first antennas.

4. The metalens unit according to claim 1 , wherein each of the plurality of first antennas is comprised of silicon.

5. The metalens unit according to claim 1 , wherein the plurality of first antennas is arranged such that the first-antenna end surfaces of the plurality of first antennas form a two-dimensional matrix on the first surface.

6. The metalens unit according to claim 5 ,

wherein light having a wavelength of a range of 100 nm or more and 5200 nm or less is inputted to the metalens, and

the plurality of first antennas is arranged such that the first arrangement pitch is shorter than the wavelength.

7. The metalens unit according to claim 1 ,

wherein the metalens comprises:

a plurality of second antennas provided between the second surface and the base portion, the second antennas each having a third refractive index and a second-antenna end surface constituting at least a part of the second surface; and

a second intermediate portion provided between the first surface and the base portion such that a part is positioned between the plurality of second antennas, the second intermediate portion having a fourth refractive index different from the third refractive index, and

wherein a second antenna portion constituted by the plurality of second antennas and the second intermediate portion is formed such that a one-dimensional arrangement constituted by the second-antenna end surfaces of which centers of gravity are positioned on at least one second reference line on the second surface among the second-antenna end surfaces of the plurality of second antennas includes an arrangement pattern in which at least one of a size of the second-antenna end surface, a shape of the second-antenna end surface, and a second arrangement pitch is changed along the second reference line.

8. A semiconductor fault analysis device comprising the metalens unit according to claim 1 .

9. The semiconductor fault analysis device according to claim 8 , further comprising an objective lens arranged on a side opposite to the first surface with respect to the metalens.

10. A semiconductor fault analysis method comprising:

an installation step of installing a semiconductor device as an observation target at a predetermined position;

an abutment step of preparing a metalens having a first surface and a second surface opposing each other and causing the metalens to abut on the semiconductor device such that the first surface faces the semiconductor device; and

a fault analysis step of executing fault analysis of the semiconductor device by observing the semiconductor device by using the metalens,

wherein the metalens prepared in the abutment step comprises:

a base portion provided between the first surface and the second surface opposing to the first surface;

a plurality of first antennas provided between the first surface and the base portion, the plurality of first antennas each having a first refractive index and a first-antenna end surface constituting a part of the first surface; and

a first intermediate portion provided between the first surface and the base portion such that a part is positioned between the plurality of first antennas, the first intermediate portion having a second refractive index different from the first refractive index and a first-intermediate-portion end surface constituting a remaining part of the first surface, and

wherein a first antenna portion constituted by the plurality of first antennas and the first intermediate portion is formed such that a one-dimensional arrangement constituted by the first-antenna end surfaces of which centers of gravity are positioned on at least one first reference line on the first surface among the first-antenna end surfaces of the plurality of first antennas includes an arrangement pattern in which at least one of a size of the first antenna-end surface, a shape of the first-antenna end surface, and a first arrangement pitch is changed along the first reference line.

11. The semiconductor fault analysis method according to claim 10 ,

wherein the first intermediate portion is formed integrally with the base portion, and

wherein each of the first-antenna end surfaces of the plurality of first antennas is arranged on the first surface in an exposed state.

12. The semiconductor fault analysis method according to claim 10 ,

wherein each of the plurality of first antennas has a shape protruding from the base portion toward the first surface, and

wherein a space formed between the semiconductor device and the base portion is filled with a liquid forming the first intermediate portion in the abutment step.

13. The semiconductor fault analysis method according to claim 10 , wherein each of the plurality of first antennas is comprised of silicon.

14. The semiconductor fault analysis method according to claim 10 , wherein the plurality of first antennas is arranged such that a two-dimensional matrix is formed on the first surface.

15. The semiconductor fault analysis method according to claim 14 ,

wherein light having a wavelength of a range of 100 nm or more and 5200 nm or less is inputted to the metalens in the fault analysis step, and

wherein the plurality of first antennas is arranged such that the first arrangement pitch is shorter than the wavelength.

16. The semiconductor fault analysis method according to claim 10 ,

wherein the metalens comprises:

a plurality of second antennas provided between the second surface and the base portion, the second antennas each having a third refractive index and a second-antenna end surface constituting at least a part of the second surface; and

a second intermediate portion provided between the second surface and the base portion such that a part is positioned between the plurality of second antennas, the second intermediate portion having a fourth refractive index different from the third refractive index, and

wherein a second antenna portion constituted by the plurality of second antennas and the second intermediate portion is formed such that a one-dimensional arrangement constituted by the second-antenna end surfaces of which centers of gravity are positioned on at least one second reference line on the second surface among the second-antenna end surfaces of the plurality of second antennas includes an arrangement pattern in which at least one of a size of the second-antenna end surface, a shape of the second-antenna end surface, and a second arrangement pitch is changed along the second reference line.