Sensor device with auxiliary structure for calibrating the sensor device

1. A sensor device, comprising:

an electrically conductive chip carrier, wherein the electrically conductive chip carrier comprises an auxiliary structure, wherein the auxiliary structure comprises a first precalibration current terminal and a second precalibration current terminal; and

a magnetic field sensor chip arranged on a mounting surface of the electrically conductive chip carrier, wherein the magnetic field sensor chip comprises a first sensor element,

wherein a shape of the auxiliary structure is configured such that a first electrical precalibration current flowing from the first precalibration current terminal to the second precalibration current terminal through the auxiliary structure induces a first precalibration magnetic field at a location of the first sensor element, and

wherein during measurement operation of the sensor device, no precalibration current flows between the first precalibration current terminal and the second precalibration current terminal.

2. The sensor device as claimed in claim 1 , wherein a measurement magnetic field induced by a measurement current at the location of the first sensor element is orders of magnitude stronger than the first precalibration magnetic field induced by the first electrical precalibration current.

3. The sensor device as claimed in claim 1 , wherein:

the auxiliary structure comprises a notch, and

the first electrical precalibration current flows along a current path running around the notch.

4. The sensor device as claimed in claim 1 , wherein:

the first sensor element comprises a Hall sensor element, and

in a view perpendicular to the mounting surface of the electrically conductive chip carrier, the auxiliary structure and the first sensor element are free of overlap.

5. The sensor device as claimed in claim 1 , wherein:

the first sensor element comprises a magnetoresistive sensor element or a vertical Hall sensor element or a fluxgate sensor element, and

in a view perpendicular to the mounting surface of the electrically conductive chip carrier, the auxiliary structure and the first sensor element completely overlap.

6. The sensor device as claimed in claim 1 , wherein the magnetic field sensor chip is a differential magnetic field sensor chip and comprises a second sensor element.

7. The sensor device as claimed in claim 6 , wherein the first electrical precalibration current induces a second precalibration magnetic field at a location of the second sensor element, wherein the second precalibration magnetic field at the location of the second sensor element is directed oppositely to the first precalibration magnetic field at the location of the first sensor element.

8. The sensor device as claimed in claim 6 , wherein:

in a view perpendicular to the mounting surface of the electrically conductive chip carrier, the first electrical precalibration current flows along a current path, and

the current path crosses an imaginary connecting line from the first sensor element to the second sensor element.

9. The sensor device as claimed in claim 6 , wherein:

the shape of the auxiliary structure is configured such that the first electrical precalibration current has an S-shaped course in a view perpendicular to the mounting surface of the electrically conductive chip carrier, and

the first sensor element and the second sensor element are arranged in the S-shaped course.

10. The sensor device as claimed in claim 6 , wherein:

the shape of the auxiliary structure is configured such that the first electrical precalibration current has a U-shaped course in a view perpendicular to the mounting surface of the electrically conductive chip carrier,

the first sensor element is arranged within the U-shaped course, and

the second sensor element is arranged outside the U-shaped course.

11. The sensor device as claimed in claim 6 , wherein:

the auxiliary structure comprises a third precalibration current terminal, and

the shape of the auxiliary structure is configured such that a second precalibration current flowing from the first precalibration current terminal to the third precalibration current terminal through the auxiliary structure induces a second precalibration magnetic field at a location of the second sensor element, and

the first precalibration magnetic field and the second precalibration magnetic field have opposite directions.

12. The sensor device as claimed in claim 11 , wherein the shape of the auxiliary structure is configured such that in a view perpendicular to the mounting surface of the electrically conductive chip carrier, the first electrical precalibration current has a course around the first sensor element and the second precalibration current has a course around the second sensor element.

13. The sensor device as claimed in claim 11 , wherein:

the shape of the auxiliary structure is configured such that the first electrical precalibration current and the second precalibration current each have a course in a view perpendicular to the mounting surface of the electrically conductive chip carrier, and

the first sensor element and the second sensor element lie outside each course.

14. The sensor device as claimed in claim 6 , wherein:

the auxiliary structure comprises a third precalibration current terminal and a fourth precalibration current terminal, and

the shape of the auxiliary structure is configured such that a further precalibration current flowing from the third precalibration current terminal to the fourth precalibration current terminal through the auxiliary structure induces a further precalibration magnetic field at a location of the second sensor element.

15. The sensor device as claimed in claim 14 , wherein:

the shape of the auxiliary structure is configured such that in a view perpendicular to the mounting surface of the electrically conductive chip carrier, the first electrical precalibration current has a first U-shaped course and the further precalibration current has a further U-shaped course, and

the first sensor element lies within the first U-shaped course and the second sensor element lies within the further U-shaped course.

16. The sensor device as claimed in claim 1 , wherein:

the electrically conductive chip carrier comprises a leadframe having a plurality of terminal conductors, and

the first precalibration current terminal and the second precalibration current terminal each comprise a terminal conductor of the leadframe.

17. The sensor device as claimed in claim 1 , furthermore comprising:

an encapsulation material, wherein the electrically conductive chip carrier and the magnetic field sensor chip are at least partly encapsulated by the encapsulation material.

18. A method for calibrating the sensor device as claimed in claim 1 , wherein the method comprises:

feeding at least one precalibration current into at least one precalibration current terminal of the auxiliary structure;

measuring at least one precalibration magnetic field induced by the precalibration current at at least one of different current frequencies or at different temperatures; and

calibrating the sensor device based on measured values of the at least one precalibration magnetic field.

19. The method as claimed in claim 18 , wherein the calibrating is carried out after encapsulating the electrically conductive chip carrier and the magnetic field sensor chip by an encapsulation material.

20. A sensor device, comprising:

a chip carrier comprising a plurality of terminal conductors;

a magnetic field sensor chip arranged on the chip carrier, wherein the magnetic field sensor chip comprises at least one sensor element;

an encapsulation material, wherein the chip carrier and the magnetic field sensor chip are at least partly encapsulated by the encapsulation material; and

a current line, arranged on the magnetic field sensor chip, electrically connected to the plurality of terminal conductors via connectors, wherein a shape of the current line is configured such that an electrical current flowing through the current line induces a magnetic field at a location of the sensor element.

21. The sensor device as claimed in claim 20 , wherein:

the chip carrier comprises a leadframe having a terminal conductor projecting from the encapsulation material, and

the terminal conductor is configured to feed an electrical current into the current line via the terminal conductor.