Multilayer electronic component
A multilayer electronic component includes a body including dielectric layers and a capacitance forming portion and upper and lower cover portions respectively disposed on and below the capacitance forming portion, and including first and second surfaces opposing each other in a layering direction, an external electrode disposed on the third or fourth surface, connected to the first or second internal electrode, and including an electrode layer extending to a portion of each of the first and second surfaces and a conductive resin layer covering the electrode layer. Tp/Rmax is 30 or higher, in which Rmax is defined as a maximum surface roughness of each of the first and second surfaces on an end of the conductive resin layer, and Tp is defined as a thickness of each of the upper and lower cover portions.
1. A multilayer electronic component, comprising:
a body including dielectric layers and a capacitance forming portion including first and second internal electrodes alternately layered in a layering direction with a respective one of the dielectric layers interposed therebetween and upper and lower cover portions respectively disposed on and below the capacitance forming portion, the body including first and second surfaces opposing each other in the layering direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
a first external electrode disposed on the third surface, connected to the first internal electrode, and including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer covering the first electrode layer; and
a second external electrode disposed on the fourth surface, connected to the second internal electrode, and including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer covering the second electrode layer, wherein Tp/Rmax is 30 or higher, in which Rmax is defined as a maximum surface roughness of each of the first and second surfaces on ends of the first and second conductive resin layers, and Tp is defined as a thickness of each of the upper and lower cover portions.
2. The multilayer electronic component of claim 1 , wherein Tp is 10 μm or greater and 300 μm or less.
3. The multilayer electronic component of claim 1 , wherein Rmax is 9 μm or less.
4. The multilayer electronic component of claim 1 , wherein Tp/Ra is 50 or higher, in which Ra is defined as arithmetical average roughness of each of the first and second surfaces on the ends of the first and second conductive resin layers.
5. The multilayer electronic component of claim 4 , wherein Ra is 7 μm or less.
6. The multilayer electronic component of claim 4 , wherein an arithmetical average roughness of each of the first and second surfaces in contact with the first and second electrode layers is greater than Ra.
7. The multilayer electronic component of claim 1 , wherein the body includes first and second margin portions disposed on both side surfaces of the capacitance forming portion, respectively.
8. The multilayer electronic component of claim 7 , wherein Wm/R2max is 30 or higher, in which Wm is defined as a dimension, in a direct connecting the fifth and sixth surfaces, of each of the first and second margin portions, and R2max is defined as a maximum surface roughness of each of the fifth and sixth surfaces on the ends of the first and second conductive resin layers.
9. The multilayer electronic component of claim 7 , wherein Wm/R2a is 50 or higher, in which Wm is defined as a dimension, in a direct connecting the fifth and sixth surfaces, of each of the first and second margin portions, and R2a is defined as an arithmetical average roughness of each of the fifth and sixth surfaces on the ends of the first and second conductive resin layers.
10. The multilayer electronic component of claim 9 , wherein an arithmetical average roughness of each of the fifth and sixth surfaces in contact with the first and second electrode layers is greater than R2a.
11. The multilayer electronic component of claim 1 , wherein the first and second electrode layers include a conductive metal and glass.
12. The multilayer electronic component of claim 1 , wherein the first and second conductive resin layers include a conductive metal and a base resin.
13. The multilayer electronic component of claim 1 , wherein Tp/Rmax is 35.09 or higher.
14. A multilayer electronic component, comprising:
a body including dielectric layers and a capacitance forming portion including first and second internal electrodes alternately layered in a layering direction with a respective one of the dielectric layers interposed therebetween and upper and lower cover portions respectively disposed on and below the capacitance forming portion, the body including first and second surfaces opposing each other in the layering direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
a first external electrode disposed on the third surface, connected to the first internal electrode, and including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer covering the first electrode layer; and
a second external electrode disposed on the fourth surface, connected to the second internal electrode, and including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer covering the second electrode layer,
wherein Tp/Ra is 50 or higher, in which Ra is defined as arithmetical average roughness of each of the first and second surfaces on the ends of the first and second conductive resin layers and Tp is defined as a thickness of each of the upper and lower cover portions.
15. The multilayer electronic component of claim 14 , wherein Tp/Ra is 59.78 or higher.
16. The multilayer electronic component of claim 14 , wherein Ra is 7 μm or less.
17. The multilayer electronic component of claim 14 , wherein Tp is 10 μm or greater and 300 μm or less.
18. The multilayer electronic component of claim 14 , wherein an arithmetical average roughness of each of the first and second surfaces in contact with the first and second electrode layers is greater than Ra.
19. The multilayer electronic component of claim 14 , wherein the body includes first and second margin portions disposed on both side surfaces of the capacitance forming portion, respectively, and
Wm/R2max is 30 or higher, in which Wm is defined as a dimension, in a direct connecting the fifth and sixth surfaces, of each of the first and second margin portions, and R2max is defined as a maximum surface roughness of each of the fifth and sixth surfaces on the ends of the first and second conductive resin layers.
20. The multilayer electronic component of claim 14 , wherein the body includes first and second margin portions disposed on both side surfaces of the capacitance forming portion, respectively, and
Wm/R2a is 50 or higher, in which Wm is defined as a dimension, in a direct connecting the fifth and sixth surfaces, of each of the first and second margin portions, and R2a is defined as an arithmetical average roughness of each of the fifth and sixth surfaces on the ends of the first and second conductive resin layers.