Radio-frequency module and communication apparatus
A radio-frequency module is capable of being connected to an external substrate and includes a mounting substrate having a main face and a main face, which are opposed to each other, multiple ground terminals with which the mounting substrate is electrically connected to the external substrate, a PA mounted on the main face, and an LNA mounted on the main face. A communication apparatus includes the radio-frequency module.
1. A radio-frequency module comprising:
a mounting substrate having a first main face and a second main face, which are opposed to each other;
a transmission power amplifier mounted on the first main face;
a low noise reception amplifier mounted on the second main face;
a transmission filter mounted on the first main face; and
a reception filter mounted on the first main face,
wherein, in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, a footprint of the low noise reception amplifier at least partially overlaps a footprint of the reception filter, and
a footprint of the transmission power amplifier does not overlap a footprint of the low noise reception amplifier.
2. The radio-frequency module of claim 1 , wherein the radio-frequency module is configured to be electrically connected to an external substrate.
3. The radio-frequency module of claim 1 , further comprising:
an antenna connection terminal;
and
an antenna switch that is connected to the antenna connection terminal and is configured to controllably switch between connection and non-connection states between the antenna connection terminal and the transmission power amplifier,
wherein the antenna switch is arranged on the second main face.
4. The radio-frequency module of claim 3 , further comprising:
an impedance matching circuit arranged on the first main face, and connected to an output terminal of the transmission power amplifier.
5. The radio-frequency module of claim 4 , further comprising:
a. reception switch connected to an input terminal of the low noise reception amplifier, and arranged on the second main face.
6. The radio-frequency module according to claim 5 ,
wherein, in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, a footprint of the impedance matching circuit does not overlap with a footprint of the reception switch.
7. The radio-frequency module according to claim 4 ,
wherein, in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, a footprint of the impedance matching circuit does not overlap with a footprint of the antenna switch.
8. The radio-frequency module according to claim 4 , further comprising:
a plurality of external connection terminals arranged on the second main face, the plurality of external connection terminals includes a ground terminal; and
a through electrode that passes through the mounting substrate, wherein
the transmission power amplifier is connected to the ground terminal via the through electrode.
9. The radio-frequency module according to claim 3 ,
wherein, in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, a footprint of the transmission power amplifier does not overlap a footprint of the antenna switch.
10. The radio-frequency module according to claim 3 , further comprising:
a plurality of external connection terminals arranged on the second main face, the plurality of external connection terminals includes a ground terminal; and
a through electrode that passes through the mounting substrate, wherein
the transmission power amplifier is connected to the ground terminal via the through electrode.
11. The radio-frequency module according to claim 1 , further comprising:
a plurality of external connection terminals arranged on the second main face and electrically connected to the external substrate.
12. The radio-frequency module according to claim 11 , further comprising:
a through electrode that passes through the mounting substrate, wherein
the plurality of external connection terminals includes a ground terminal, and
the transmission power amplifier is connected to the ground terminal via the through electrode.
13. The radio-frequency module according to claim 12 ,
wherein the transmission power amplifier includes a transistor-based amplifier having a bipolar transistor with a base terminal, a collector terminal, and an emitter terminal, wherein
at least the base terminal and the collector terminal are arranged on the first main face,
in an active state, collector current flows in the bipolar transistor from the collector terminal to the emitter terminal, and
the emitter terminal is connected to the ground terminal via the through electrode.
14. The radio-frequency module according to claim 13 ,
wherein, in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, a footprint of the through electrode at least partially overlaps a footprint of the ground terminal.
15. The radio-frequency module according to claim 1 , further comprising:
a transmission filter mounted on the first main face; and
a reception filter mounted on the first main face,
wherein, in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, the transmission filter is arranged between the transmission power amplifier and the reception filter.
16. The radio-frequency module according to claim 15 ,
wherein, in a plan view of the radio-frequency module in the direction vertical to the first main face and the second main face, a footprint of the low noise reception amplifier at least partially overlaps a footprint of the reception filter.
17. A communication apparatus comprising:
an external substrate; and
radio-frequency circuitry including
a mounting substrate having a first main face and a second main face, which are opposed to each other,
a transmission power amplifier mounted on the first main face, a low noise reception amplifier mounted on the second main face,
a transmission filter mounted on the first main face, and
a reception filter mounted on the first main face, wherein
in a plan view of the radio-frequency module in a direction vertical to the first main face and the second main face, a footprint of the low noise reception amplifier at least partially overlaps a footprint of the reception filter,
a footprint of the transmission power amplifier does not overlap a footprint of the low noise reception amplifier, and
the external substrate has an external ground electrode electrically connected to a ground terminal, the ground terminal being one of a plurality of external connection terminals arranged on the second main face of the mounting substrate.