IP Library › Granted Patent US 11,397,254
Granted Patent B2
US 11,397,254 · App. 16/535,445 · Granted Jul 26, 2022

Ultrasonic device and ultrasonic sensor

Inventor: Koji Ohashi (Matsumoto, JP)
Assignee: SEIKO EPSON CORPORATION
G01S7/521
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Quick Facts
Patent No.
US 11,397,254
App. No.
16/535,445
Granted
Jul 26, 2022
Kind
B2
Abstract

An ultrasonic device includes a substrate having a first surface and a second surface having a front and back relationship with the first surface, and provided with an opening penetrating the second surface from the first surface; a vibration film provided over the first surface of the substrate so as to close the opening; a vibration element provided at a position overlapping the opening in the vibration film; and a sound absorbing portion provided over the second surface of the substrate.

Claims (12)

1. An ultrasonic device comprising:

a substrate having a first surface and a second surface having a front and back relationship with the first surface, the substrate including an opening formed to penetrate from the first surface through the second surface;

a vibration film provided over the first surface of the substrate so as to close the opening;

a vibration element positioned to overlap the opening and the vibration film; and

a plurality of sound absorbing portions configured to directly receive and absorb ultrasonic waves, the plurality of sound absorbing portions respectively disposed on an end of each wall of a plurality of walls formed in the second surface of the substrate, such that the sound absorbing portions are located on an outermost surface of the ultrasonic device, each wall extending from the first surface to the second surface to form inner surfaces of the opening, and each sound absorbing portion having a semi-circular shape as viewed in a cross-section.

2. The ultrasonic device according to claim 1 , wherein:

the substrate includes a plurality of the openings, which includes the opening formed in the substrate, and the substrate has a wall portion supporting the vibration film and surrounding the plurality of openings, and

the plurality of sound absorbing portions are provided over an end surface of the wall portion on a side opposite to a vibration film side.

3. The ultrasonic device according to claim 1 , wherein each sound absorbing portion has a curved surface that projects from the substrate.

4. An ultrasonic sensor comprising:

the ultrasonic device according to claim 1 ; and

a controller controlling the ultrasonic device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2019
From: OHASHI, KOJI
To: SEIKO EPSON CORPORATION
Reel/Frame 050000/0657 →
Priority Claims (1)
JP JP2018-150136 · Aug 9, 2018 · national
Continuity (1)
Related Publication 20200049806A1 · Feb 13, 2020
Cited By (1)
US 12,449,523