IP Library › Granted Patent US 11,397,499
Granted Patent B2
US 11,397,499 · App. 17/309,659 · Granted Jul 26, 2022

Pressure-sensitive sensor and electronic apparatus

Inventors: Akira Ebisui (Tokyo, JP); Ken Kobayashi (Tokyo, JP); Yoshiaki Sakakura (Tokyo, JP); Hayato Hasegawa (Tokyo, JP); Manami Miyawaki (Tokyo, JP)
Assignee: SONY GROUP CORPORATION
G06F3/0447G06F3/0412G06F3/0445G06F3/0446G06F2203/04105
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Quick Facts
Patent No.
US 11,397,499
App. No.
17/309,659
Granted
Jul 26, 2022
Kind
B2
Abstract

[Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.

Claims (40)

1. A pressure-sensitive sensor, comprising:

a sensor section that includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer;

a clearance layer that is situated outside of the sensor section to face the first reference electrode layer; and

a push-in layer that is situated between the first reference electrode layer and the clearance layer, wherein the push-in layer is configured to push the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.

2. The pressure-sensitive sensor according to claim 1 , wherein

the push-in layer includes a first patterning structure that is situated between the first reference electrode layer and the clearance layer.

3. The pressure-sensitive sensor according to claim 2 , wherein

the first patterning structure includes a plurality of first pillar portions arranged in a direction horizontal to the layers.

4. The pressure-sensitive sensor according to claim 3 , wherein

the first deformable layer includes a second patterning structure that is situated between the sensor electrode layer and the first reference electrode layer.

5. The pressure-sensitive sensor according to claim 4 , wherein

the second patterning structure includes a plurality of second pillar portions arranged in the direction horizontal to the layers.

6. The pressure-sensitive sensor according to claim 5 , wherein

the first deformable layer includes a hollow portion in which there is not the second pillar portion of the plurality of second pillar portions, and

each of the plurality of first pillar portions is arranged at a position that corresponds to the hollow portion in a stacking direction vertical to the layers.

7. The pressure-sensitive sensor according to claim 3 , wherein

the sensor electrode layer includes a sensing portion, and

each of the plurality of first pillar portions is arranged at a position that corresponds to the sensing portion in a stacking direction vertical to the layers.

8. The pressure-sensitive sensor according to claim 1 , wherein

the clearance layer includes plastic foam.

9. The pressure-sensitive sensor according to claim 1 , wherein

the push-in layer is made of a material harder than a material of the clearance layer.

10. The pressure-sensitive sensor according to claim 1 , wherein

the sensor section further includes a second reference electrode layer that is arranged such that the sensor electrode layer is situated between the first reference electrode layer and the second reference electrode layer.

11. The pressure-sensitive sensor according to claim 10 , wherein

the sensor section further includes a second deformable layer that is situated between the sensor electrode layer and the second reference electrode layer.

12. The pressure-sensitive sensor according to claim 11 , wherein

the first deformable layer and the second deformable layer are different from each other in at least one of structure or material.

13. The pressure-sensitive sensor according to claim 12 , wherein

one of the first deformable layer and the second deformable layer includes a patterning structure.

14. The pressure-sensitive sensor according to claim 13 , wherein

the patterning structure includes a plurality of pillar portions arranged in a direction horizontal to the layers.

15. The pressure-sensitive sensor according to claim 13 , wherein

another of the first deformable layer and the second deformable layer includes plastic foam.

16. An electronic apparatus, comprising:

an exterior body; and

a pressure-sensitive sensor configured to detect an external force applied through the exterior body, wherein the pressure-sensitive sensor includes:

a sensor section that includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer,

a clearance layer that is situated outside of the sensor section to face the first reference electrode layer, and

a push-in layer that is situated between the first reference electrode layer and the clearance layer, wherein the push-in layer is configured to push the first reference electrode layer toward the sensor electrode layer in response to the external force to deform the first deformable layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2022
From: EBISUI, AKIRA; KOBAYASHI, KEN; SAKAKURA, YOSHIAKI; HASEGAWA, HAYATO; MIYAWAKI, MANAMI
To: SONY GROUP CORPORATION
Reel/Frame 058686/0932 →
Priority Claims (1)
JP JP2018-240191 · Dec 21, 2018 · national
Continuity (1)
Related Publication 20220027017A1 · Jan 27, 2022
Cited By (1)
US 12,203,817