Electronic package with multiple electronic components spaced apart by grooves
A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
1. An electronic package, comprising:
a carrying structure;
a first electronic component and a second electronic component disposed on the carrying structure and spaced apart from each other at an interval;
a filling material formed in the interval and acting as a spacer having a groove, wherein the spacer comprises a connection block disposed on a bottom of the groove, a first block and a second block spaced apart from each other and disposed on the connection block, and the carrying structure is not exposed from the groove, and wherein the first block is bonded to a lateral surface of the first electronic component, and the second block is bonded to a lateral surface of the second electronic component; and
an active layer formed in the groove, wherein the groove has an inclined lateral wall, and the first block and the second block of the spacer form a chamfer structure.
2. The electronic package of claim 1 , wherein the first electronic component and the second electronic component are electrically connected to the carrying structure.
3. The electronic package of claim 1 , wherein the first electronic component and the second electronic component are of the same type.
4. The electronic package of claim 1 , wherein the first electronic component and the second electronic component are in different types.
5. The electronic package of claim 1 , wherein the first electronic component and the second electronic component have upper surfaces being flush with an upper surface of the active layer and/or an upper surface of the spacer.
6. The electronic package of claim 1 , wherein the groove has a width being not constant from an opening of the groove to a bottom of the groove.
7. The electronic package of claim 1 , wherein the filling material is further formed between the carrying structure and the first electronic component and between the carrying structure and the second electronic component.
8. The electronic package of claim 1 , wherein the active layer has a Young's modulus less than a Young's modulus of the filling material.
9. The electronic package of claim 1 , wherein the inclined lateral wall extends to the first electronic component and/or the second electronic component.