High-voltage semiconductor device and method of forming the same
High-voltage semiconductor device and method of forming the same, the high-voltage semiconductor device includes a substrate, a gate structure, a drain, a first insulating structure and a drain doped region. The gate structure is disposed on the substrate. The drain is disposed in the substrate, at one side of the gate structure. The first insulating structure is disposed on the substrate, under the gate structure to partially overlap with the gate structure. The drain doped region is disposed in the substrate, under the drain and the first insulating structure, and the drain doped region includes a discontinuous bottom surface.
1. A high-voltage semiconductor device, comprising:
a substrate;
a gate structure, disposed on the substrate;
a drain, disposed in the substrate, at one side of the gate structure;
a first insulating structure, disposed on the substrate, the first insulating structure being disposed under the gate structure and partially overlapped with the gate structure; and
a drain doped region, disposed in the substrate, under the drain and the first insulating structure, wherein the drain doped region comprises a discontinuous bottom surface, and the discontinuous bottom surface extends between two opposite edges of the first insulating structure in a horizontal direction.
2. The high-voltage semiconductor device accordingly to claim 1 , wherein a depth of the drain doped region under the first insulating structure is smaller than a depth of other portions of the drain doped region.
3. The high-voltage semiconductor device accordingly to claim 1 , the drain doped region further comprising:
a first drain doped region, disposed under the drain and the first insulating structure; and
a second drain doped region, partially disposed under the gate structure and partially disposed under the drain, wherein the second drain doped region surrounds the drain.
4. The high-voltage semiconductor device accordingly to claim 3 , wherein a depth of the first drain doped region in the substrate is greater than a depth of the second drain doped region in the substrate.
5. The high-voltage semiconductor device accordingly to claim 3 , wherein a doping concentration of the first drain doped region is smaller than a doping concentration of the second drain doped region.
6. The high-voltage semiconductor device accordingly to claim 3 , wherein a portion of the second drain doped region is disposed between the drain and the first insulating structure.
7. The high-voltage semiconductor device accordingly to claim 3 , further comprising:
a third drain doped region disposed in the substrate, between the first drain doped region and the second drain doped region.
8. The high-voltage semiconductor device accordingly to claim 7 , wherein a doping concentration of the third drain doped region is between a doping concentration of the first drain doped region and a doping concentration of the second drain doped region.
9. The high-voltage semiconductor device accordingly to claim 7 , wherein the third drain doped region is disposed under the drain and the first insulating structure, and a vertical doping range of the third drain doped region under the first insulating structure is smaller than a vertical doping range of the third drain doped region under the drain.
10. The high-voltage semiconductor device accordingly to claim 1 , further comprising:
a source, disposed in the substrate, at another side of the gate structure; and
a source doped region, disposed in the substrate, under the source.
11. The high-voltage semiconductor device accordingly to claim 10 , wherein the source doped region is symmetric to the drain doped region.
12. The high-voltage semiconductor device accordingly to claim 10 , wherein the source doped region is asymmetric to the drain doped region.
13. The high-voltage semiconductor device accordingly to claim 10 , further comprising:
a second insulating structure, disposed on the substrate, the first insulating structure and the second insulating structure are disposed at two opposite sides of the source.
14. The high-voltage semiconductor device accordingly to claim 1 , further comprising:
a third insulating structure, disposed on the substrate, the first insulating structure and the third insulating structure are disposed at two opposite sides of the drain.