Cooling systems adapted to be thermally connected to heat-generating equipment

1. A cooling device mountable on a heat-generating component, the cooling device comprising:

a first casing adapted for direct mounting on the heat-generating component; and

a second casing mounted on the first casing;

one of the first and second casings including an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel; and

another one of the first and second casings including a storage containing a phase change material, PCM, the PCM changing from a solid state to a liquid state to transfer thermal energy from the heat-generating component to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid;

wherein the first casing comprises:

a first closed face adapted for mounting on the heat-generating component,

a first closed peripheral structure extending from the first closed face, and

a first open face defined by edges of the first closed peripheral structure opposite from the first closed face; and

wherein the second casing comprises:

a second closed face adapted for being sealingly connected to the first closed peripheral structure of the first casing to seal the first open face of the first casing,

a second closed peripheral structure extending from the second closed face, and

an insulator plate sealingly connected to edges of the second closed peripheral structure opposite from the second closed face.

2. The cooling device of claim 1 , wherein the second casing is welded to the first casing.

3. The cooling device of claim 1 , wherein the first casing comprises an indentation adapted for mating with an outer periphery of the second casing.

4. The cooling device of claim 1 , wherein the first and second casings have a perimeter shape selected from a rectangle, a square and a circle.

5. The cooling device of claim 1 , wherein the heat-transfer fluid flowing in the internal channel is water.

6. The cooling device of claim 1 , wherein:

the internal channel is included in the first casing;

the storage containing the PCM is included in the second casing; and

the cold inlet and the hot outlet pass through the second casing to reach the internal channel in the first casing.

7. The cooling device of claim 1 , wherein:

the internal channel is located between the first closed face and the second closed face;

the storage containing the PCM is located between the second closed face and the insulator plate; and

the cold inlet and the hot outlet pass through the second closed peripheral structure to reach the internal channel in the first casing.

8. The cooling device of claim 1 , wherein:

the storage containing the PCM is included in the first casing; and

the internal channel is included in the second casing.

9. The cooling device of claim 1 , wherein:

the storage containing the PCM is located between the first closed face and the second closed face;

the internal channel is located between the second closed face and the insulator plate; and

the cold inlet and the hot outlet pass through the insulator plate.

10. The cooling device of claim 9 , further comprising a plurality of fins extending from the first closed face within the storage containing the PCM.

11. A cooling system, comprising:

at least one cooling device as defined in claim 1 , the PCM contained in the storage of each of the at least one cooling device being a first PCM having a first phase-change temperature value;

an external fluid cooling unit configured to receive a flow of the heat-transfer fluid from the at least one cooling device, the external fluid cooling unit being adapted to dissipate heat from the heat-transfer fluid;

a reservoir containing a second PCM, the reservoir being thermally connected to the external fluid cooling unit, the second PCM changing from a solid state to a liquid state when heat from the heat-transfer fluid causes a temperature of the second PCM to increase above a second phase-change temperature value of the second PCM, the second PCM changing from the liquid state to the solid state when the temperature of the second PCM decreases below the second phase-change temperature value of the second PCM; and

a cooling circuit connecting the at least one cooling device and the external fluid cooling unit.

12. The cooling system of claim 11 , further comprising a pump adapted to maintain the flow of the heat-transfer fluid circulating in the cooling circuit, allowing to transfer thermal energy from the at least one cooling device to the heat-transfer fluid and to transfer thermal energy from the heat-transfer fluid to the external fluid cooling unit.

13. A cooling arrangement configured for autonomous cooling of a rack hosting at least one heat-generating component, the cooling arrangement, comprising:

a closed loop cooling circuit comprising:

at least one cooling device as defined in claim 1 , the PCM contained in the storage of each of the at least one cooling device being a first PCM having a first phase-change temperature value, the at least one cooling device being thermally coupled to the at least one heat-generating component, the internal channel of the at least one cooling device being adapted for transferring heat from the at least one heat-generating component to a first fluid flowing in the internal channel,

a primary side of a fluid-to-fluid heat exchanger, the primary side being fluidly connected to the internal channel of the at least one cooling device, and

a pump fluidly connected between the primary side of the fluid-to-fluid heat exchanger and the at least one cooling device, the pump being adapted for causing the first fluid to flow within the closed loop cooling circuit; and

an open loop cooling circuit comprising:

a secondary side of the fluid-to-fluid heat exchanger, the secondary side being thermally coupled to the primary side for transfer of heat from the primary side to the secondary side when a temperature of the primary side is higher than a temperature of the secondary side, the secondary side being adapted to receive a second fluid from a cold supply line and to return the second fluid to a hot return line;

a reservoir containing a second PCM, the reservoir being thermally connected to a section of the closed loop cooling circuit, the second PCM changing from a liquid state to a solid state to transfer thermal energy from the second PCM to the closed loop cooling circuit when a temperature of the first fluid flowing in the section of the closed loop cooling circuit is less than a second phase change temperature value of the second PCM, the second PCM changing from the solid state to the liquid state to transfer thermal energy from the closed loop cooling circuit to the second PCM when the temperature of the first fluid flowing in the section of the closed loop cooling circuit reaches or exceeds the second phase change temperature value.

14. A method for cooling a heat-generating component, comprising:

mounting the cooling device of claim 1 on the heat-generating component;

initiating a flow of heat-transfer fluid in the internal channel; and

normally maintaining the flow of heat-transfer fluid in the internal channel;

wherein the PCM is adapted to temporarily absorb heat dissipated by the heat-generating component if the flow of heat-transfer fluid is stopped.

15. The cooling device of claim 1 , wherein the second closed face of the second casing is adapted for being welded to the first closed peripheral structure of the first casing.