Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipment
This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1 A is composed of a copper layer 10 A and a stainless steel layer 20 A, in which thickness of the roll-bonded laminate 1 A is 0.02 mm to 0.4 mm, hardness of the copper layer 10 A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1 A is 6 N/20 mm or more.
1. A roll-bonded laminate composed of a copper layer and a stainless steel layer, wherein thickness of the roll-bonded laminate is 0.02 mm to 0.4 mm, hardness of the copper layer is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate is 6 N/20 mm or more.
2. The roll-bonded laminate according to claim 1 , wherein thickness of the copper layer is 0.01 mm to 0.38 mm, and thickness of the stainless steel layer is 0.01 mm to 0.38 mm.
3. The roll-bonded laminate according to claim 1 , wherein hardness of the stainless steel layer is 180 Hv or higher.
4. The roll-bonded laminate according to claim 1 , wherein 180° peel strength of the roll-bonded laminate is 8 N/20 mm or more.
5. The roll-bonded laminate according to claim 1 , which has a bi-layer structure composed of the copper layer and the stainless steel layer.
6. The roll-bonded laminate according to claim 1 , wherein the stainless steel layer is partially removed.
7. The roll-bonded laminate according to claim 1 , wherein the stainless steel layer is partially removed and the copper layer is exposed at a site where the stainless steel layer is removed.
8. The roll-bonded laminate according to claim 1 , wherein the copper layer is partially removed.
9. The roll-bonded laminate according to claim 1 , wherein the copper layer is partially removed and the stainless steel layer is exposed at a site where the copper layer is removed.
10. A heat radiation reinforcement member for electronic equipment comprising the roll-bonded laminate according to claim 1 .