IP Library › Granted Patent US 11,408,615
Granted Patent B2
US 11,408,615 · App. 16/749,745 · Granted Aug 9, 2022

Refrigeration cycle device

Inventor: Yoshiki Kato (Kariya, JP)
Assignee: DENSO CORPORATION
F24D17/0005B60H1/00921B60H1/32284F25B27/02F25B29/003F25B41/20F25B41/24B60H2001/00949F25B2339/047F25B2600/0261F25B2700/2117
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Quick Facts
Patent No.
US 11,408,615
App. No.
16/749,745
Granted
Aug 9, 2022
Kind
B2
Abstract

A refrigeration cycle device includes a compressor, a heating radiator, a heat medium radiator, a decompressor, an evaporator, and a radiation amount adjuster. The heating radiator is configured to allow a high-pressure refrigerant to release heat to a heat exchange target fluid. The heat medium radiator is configured to allow the high-pressure refrigerant to release heat to a high-temperature side heat medium. The radiation amount adjuster is configured to adjust heat radiation amount radiated from the high-pressure refrigerant to the heat exchange target fluid at the heating radiator. In a heating mode, the radiation amount adjuster is configured to adjust the heat radiation amount at the heating radiator to be larger than a heat radiation amount at the heat medium radiator. In a cooling mode, the radiation amount adjuster is configured to adjust the heat radiation amount at the heating radiator to be lower than that in the heating mode.

Claims (43)

1. A refrigeration cycle device comprising:

a compressor configured to compress a refrigerant and discharge the refrigerant;

a heating radiator configured to allow a high-pressure refrigerant discharged by the compressor to release heat to a heat exchange target fluid;

a heat medium radiator configured to allow the high-pressure refrigerant discharged by the compressor to release heat to a high-temperature side heat medium;

a decompressor configured to decompress the refrigerant on a downstream side of each of the heating radiator and the heat medium radiator;

an evaporator configured to allow the refrigerant decompressed by the decompressor to absorb heat of the heat exchange target fluid such that the refrigerant evaporates;

a radiation amount adjuster configured to adjust a heat radiation amount radiated from the high-pressure refrigerant to the heat exchange target fluid at the heating radiator;

a heater device configured to heat the high-pressure refrigerant flowing out of the heating radiator;

a high-temperature side heat medium passage in which the high-temperature side heat medium circulates;

an outside air temperature sensor configured to detect an outside air temperature; and

a controller coupled with the outside air temperature sensor, wherein

the heater device is disposed in the high-temperature side heat medium passage and is configured to heat the high-temperature side heat medium,

the high-temperature side heat medium passage has

a high-temperature side radiator configured to cause the high-temperature said heat medium to release heat through heat exchange with an outside air,

a high-temperature side bypass passage through which the high-temperature side heat medium flowing out of the heater bypasses the high-temperature side radiator, and

a high-temperature side valve controlled by the controller to switch a flow of the high-temperature side heat medium in the high-temperature side heat medium passage,

the controller is configured to control the high-temperature side valve such that the high-temperature side heat medium flows through the high-temperature side bypass passage to bypass the high-temperature side radiator when the outside air temperature is at or below a predetermined reference temperature,

in a heating mode for heating the heat exchange target fluid, the radiation amount adjuster is configured to adjust the heat radiation amount at the heating radiator to be larger than a heat radiation amount at the heat medium radiator, and

in a cooling mode for cooling the heat exchange target fluid, the radiation amount adjuster is configured to adjust the heat radiation amount at the heating radiator to be lower than that in the heating mode.

2. The refrigeration cycle device according to claim 1 , wherein

the heat medium radiator is configured to allow the refrigerant flowing out of the heating radiator to release heat to the high-temperature side heat medium, and

the radiation amount adjuster is configured to adjust a vapor quality of the refrigerant on an inlet side of the heat medium radiator in the heating mode to be lower than that in the cooling mode.

3. The refrigeration cycle device according to claim 2 , further comprising:

a liquid reservoir configured to store the refrigerant, wherein

the liquid reservoir is located on at least one of a downstream side of the heat medium radiator or an upstream side of the compressor.

4. The refrigeration cycle device according to claim 1 , wherein

the radiation amount adjuster is configured to adjust a flow rate of the heat exchange target fluid passing through the heating radiator, and

the radiation amount adjuster is configured to adjust the flow rate of the heat exchange target fluid passing through the heating radiator in the cooling mode to be smaller than that in the heating mode.

5. The refrigeration cycle device according to claim 1 , wherein

the radiation amount adjuster is configured to adjust

a flow rate of the high-pressure refrigerant discharged by the compressor and flowing into the heating radiator and

a flow rate of the high-pressure refrigerant discharged by the compressor and flowing into the heat medium radiator, and

the radiation amount adjuster is configured to adjust the flow rate of the high-pressure refrigerant flowing into the heating radiator in the cooling mode to be smaller than that in the heating mode.

6. The refrigeration cycle device according to claim 1 , further comprising:

a branch portion configured to divide a flow of the refrigerant flowing out of the heat medium radiator into one flow and another flow; and

a heating evaporator configured to exchange heat between the refrigerant of the one flow and a low-temperature side heat medium, wherein

the evaporator is configured to exchange heat between the refrigerant of the other flow and the heat exchange target fluid.

7. The refrigeration cycle device according to claim 6 , further comprising:

a low-temperature side heat medium passage in which the low-temperature side heat medium circulates; and

a heat source device disposed in the low-temperature side heat medium passage and configured to heat the low-temperature side heat medium.

8. The refrigeration cycle device according to claim 6 , further comprising:

a low-temperature side heat medium passage in which the low-temperature side heat medium circulates; and

a low-temperature side radiator disposed in the low-temperature side heat medium passage and configured to exchange heat between the low-temperature side heat medium and an outside air.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2020
From: KATO, YOSHIKI
To: DENSO CORPORATION
Reel/Frame 051589/0465 →
Priority Claims (1)
JP JP2017-148190 · Jul 31, 2017 · national
Continuity (2)
Continuation PCTJP2018025545 · Jul 5, 2018
Related Publication 20200166248A1 · May 28, 2020
Cited By (1)
US 12,257,880