Semiconductor package
According to one embodiment, a semiconductor package includes a semiconductor chip, a sealing resin that has a flat plate shape and seals the semiconductor chip inside, a first electrode that includes a first mounting surface exposed on a first main face of the sealing resin, a second electrode that includes a second mounting surface exposed on the first main face, and a groove provided on the first main face. The first mounting surface includes a first end portion arranged in an inner region of the first main face and opposed to the second electrode. The groove includes a first connection portion connected to the first end portion, and a second connection portion connected to a lateral face of the sealing resin.
1. A semiconductor package comprising:
a semiconductor chip;
a sealing resin that has a flat plate shape and seals the semiconductor chip inside;
a first electrode that includes a first mounting surface exposed on a first main face of the sealing resin;
a second electrode that includes a second mounting surface exposed on the first main face; and
a groove provided on the first main face,
wherein
the first mounting surface includes a first end portion arranged in an inner region of the first main face and opposed to the second electrode, and
the groove includes
a first connection portion connected to the first end portion, and
a second connection portion connected to a lateral face of the sealing resin.
2. The semiconductor package according to claim wherein
the groove includes a first groove extending in contact with the first end portion and along the first end portion,
the first connection portion includes one end portion of the first groove in a transverse direction, and
the second connection portion includes one end portion of the first groove in an extending direction.
3. The semiconductor package according to claim 2 , wherein the second connection portion includes opposite end portions of the first groove in the extending direction.
4. The semiconductor package according to claim wherein
the groove includes a second groove that includes
a main groove extending along the first end portion, at a position distant from the first end portion, and
a sub-groove extending from the main groove to the first end portion,
the first connection portion includes one end portion of the sub-groove, which extends to the first end portion, and
the second connection portion includes one end portion of the main groove in an extending direction.
5. The semiconductor package according to claim 4 , wherein the second connection portion includes opposite end portions of the main groove in the extending direction.
6. The semiconductor package according to claim 1 , wherein the first mounting surface has an area larger than that of the second mounting surface.
7. The semiconductor package according to claim wherein
the first electrode is a drain electrode, and
the second electrode is a source electrode.
8. The semiconductor package according to claim wherein
the first mounting surface includes a second end portion arranged in the inner region and opposed to an end portion of the first main face,
the groove includes a third groove extending from an end portion of the first main face to the second end portion,
the first connection portion includes one end portion of the third groove, which extends to the second end portion, and
the second connection portion includes another end portion of the third groove.
9. The semiconductor package according to claim 8 , wherein
the first end portion extends in a predetermined direction, and
the second end portion extends in a direction intersecting with an extending direction of the first end portion.
10. The semiconductor package according to claim 9 , wherein the second end portion is arranged on each side in the extending direction of the first end portion.
11. The semiconductor package according to claim 8 , wherein
the first end portion extends in a predetermined direction, and
the second end portion extends in a direction along the extending direction of the first end portion.
12. The semiconductor package according to claim 1 , wherein the groove has a depth smaller than a thickness of the second electrode.
13. The semiconductor package according to claim 1 , wherein
the groove includes a lateral surface and a bottom surface, and
the lateral surface is connected to the bottom surface by a curved surface.
14. The semiconductor package according to claim 1 , further comprising a third electrode that includes a third mounting surface exposed on the first main face and is opposed to the first end portion from a side of the second electrode.
15. The semiconductor package according to claim 14 , wherein the first mounting surface has an area larger than that of the third mounting surface.
16. The semiconductor package according to claim 14 , wherein the third electrode is a gate electrode.
17. The semiconductor package according to claim 1 , wherein the semiconductor chip is a power semiconductor chip.
18. The semiconductor package according to claim 1 , wherein the semiconductor package is a surface mount type package.