Semiconductor memory device
A semiconductor memory device includes a first chip and a second chip overlaid on the first chip. The second chip includes a memory cell array provided between a second semiconductor substrate and the first chip in a first direction, and first and second wires between the memory cell array and the first chip. The memory cell array includes three or more stacked bodies regularly arranged in a second direction perpendicular to the first direction and semiconductor layers extending in the stacked bodies in the first direction. Each of the stacked bodies includes gate electrodes stacked in the first direction. The first and second wires are aligned in the second direction with a gap therebetween.
1. A semiconductor memory device, comprising:
a first chip including a first semiconductor substrate and a first transistor and a second transistor that are provided on the first semiconductor substrate; and
a second chip stuck to the first chip, the second chip including a memory cell array and a first wiring layer provided between the memory cell array and the first chip in a first direction, the first wiring layer including a first wire and a second wire;
a first pad provided on a surface of the first chip that is stuck to the second chip, the first pad electrically connecting the first transistor to the first wire; and
a second pad provided on a surface of the first chip that is stuck to the second chip, the second pad electrically connecting the second transistor to the second wire, wherein
the memory cell array includes:
a first region, a second region, and a third region arranged in order in a second direction perpendicular to the first direction, each of which includes a plurality of gate electrodes stacked in the first direction;
a fourth region between the first region and the second region, the fourth region including an insulator and extending in the first direction and a third direction that is perpendicular to the first direction and the second direction;
a fifth region between the second region and the third region, the fifth region including an insulator and extending in the first direction and the third direction;
a first semiconductor layer extending in the first region of the memory cell array in the first direction;
a second semiconductor layer extending in the second region of the memory cell array in the first direction; and
a third semiconductor layer extending in the third region of the memory cell array in the first direction,
the first wire and the second wire are aligned with each other in the second direction with a gap between the first wire and the second wire in the second direction,
the first wire is electrically connected to the first semiconductor layer,
no wire in the first wiring layer is electrically connected to the second semiconductor layer, and
the second wire is electrically connected to the third semiconductor layer.
2. The semiconductor memory device according to claim 1 , wherein the gate electrodes in the first region and the gate electrodes in the second region are word lines.
3. The semiconductor memory device according to claim 1 , wherein the first wire is a bit line, and the second wire is a bit line.
4. The semiconductor memory device according to claim 1 , wherein
the first wire is between the first region of the memory cell array and the first chip in the first direction, and
the second wire is between the second region of the memory cell array and the first chip in the first direction.
5. The semiconductor memory device according to claim 1 , wherein a length of the gap in the second direction is greater than a width of the first region in the second direction and less than twice the width of the first region in the second direction.
6. The semiconductor memory device according to claim 1 , wherein a length of the gap in the second direction is greater than twice a width of the first region in the second direction and less than three times the width of the first region in the second direction.
7. The semiconductor memory device according to claim 1 , wherein a length of the gap in the second direction is less than a width of the first region in the second direction.
8. The semiconductor memory device according to claim 1 , wherein
the second chip includes a second semiconductor substrate that includes a first semiconductor region and a second semiconductor region electrically isolated from each other,
the first semiconductor region is electrically connected to the first semiconductor layer, and not to the second semiconductor layer and the third semiconductor layer, and
the second semiconductor region is electrically connected to the third semiconductor layer, and not to the first semiconductor layer and the second semiconductor layer.
9. The semiconductor memory device according to claim 8 , wherein
the second semiconductor substrate includes a first insulating region extending from a first surface of the second semiconductor substrate to a second surface of the second semiconductor substrate opposite to the first surface in the first direction, and
the first insulating region surrounds the first semiconductor region.
10. The semiconductor memory device according to claim 9 , wherein the first insulating region also surrounds the second semiconductor region.
11. The semiconductor memory device according to claim 9 , wherein
the second semiconductor substrate also includes a second insulating region extending from the first surface to the second surface, and
the second insulating region is separated from the first insulating region and surrounds the second semiconductor region.
12. The semiconductor memory device according to claim 1 , wherein
the first transistor is included in a first sense amplifier circuit, and
the second transistor is included in a second sense amplifier circuit.