System-on-chip camera with integrated light sensor(s) and method of producing a system-on-chip camera

1. A system-on-chip camera, comprising:

a sensor substrate comprising semiconductor material;

sensor elements arranged in the sensor substrate according to an array of pixels;

a light sensor in the sensor substrate apart from the sensor elements; and

a surface of incidence above the sensor elements and the light sensor;

the sensor substrate being connected to a semiconductor body comprising an integrated circuit, and the sensor substrate being arranged between the semiconductor body and the surface of incidence;

a metallization layer between the semiconductor body and the sensor substrate;

an optical component above the surface of incidence; and

a through-substrate interconnection electrically connecting the metallization layer and the optical component; and

each of the sensor elements being provided with a further component arranged between a respective sensor element and the surface of incidence, the further component being a stack of further sensor elements arranged in the sensor substrate and providing a different spectral sensitivity than the sensor elements, and the sensor elements and the further sensor elements being arranged at different distances from the surface of incidence.

2. The system-on-chip camera according to claim 1 , further comprising:

metal spacers laterally arranged at the further sensor elements.

3. The system-on-chip camera according to claim 1 , further comprising:

a filter layer arranged between the light sensor and the surface of incidence, the filter layer being a band-pass filter for either red, green or blue light.

4. The system-on-chip camera according to claim 1 , further comprising:

a lens or an array of lenses formed by an oxide of semiconductor material arranged on the surface of incidence.

5. The system-on-chip camera according to claim 4 , further comprising:

a molding material covering the lens or array of lenses, and

a diffusor formed above the light sensor by a modified region of the molding material.

6. The system-on-chip camera according to claim 1 , further comprising:

a metallization layer between the semiconductor body and the sensor substrate;

a contact pad, the semiconductor body being arranged between the metallization layer and the contact pad;

a via hole in the semiconductor body; and

a metallization in the via hole, the metallization electrically connecting the metallization layer and the contact pad.

7. The system-on-chip camera according to claim 1 , further comprising:

an optical via penetrating the semiconductor body, and

an optical component opposite the optical via on a side facing away from the sensor substrate.

8. The system-on-chip camera according to claim 1 , wherein the light sensor is a sensor selected from the group consisting of an ambient light sensor, a color sensor, a hyperspectral sensor with multiple pixels or bands, an infrared sensor and a UV sensor.

9. The system-on-chip camera according to claim 1 , further comprising:

a proximity sensor, a gesture sensor or a time-of-flight sensor including a light source.

10. The system-on-chip camera according to claim 1 , wherein the light sensor comprises an array of light sensors serving as a further camera.

11. A method of producing a system-on-chip camera, comprising:

providing a semiconductor body with an integrated circuit;

providing a sensor substrate with sensor elements, the sensor elements forming an array of pixels, and with a light sensor apart from the sensor elements;

fastening the sensor substrate to the semiconductor body; and

forming at least two groups of filter elements, each of the groups of filter elements being formed by:

arranging a respective continuous filter layer on a respective planar surface above the sensor substrate,

applying a respective mask on the filter layer, the mask covering areas provided for the group of filter elements,

structuring the filter layer using the mask such that a respective non-planar surface is formed, and

planarizing the non-planar surface such that a respective planarized surface is formed.

12. The method of claim 11 , further comprising:

arranging an ultraviolet (UV) infrared (IR) blocking filter layer on one of the planarized surfaces after the last filter layer is structured;

applying a further mask on the UV IR blocking filter layer so that a further non-planar surface is formed;

structuring the UV IR blocking filter layer using the further mask; and

planarizing the further non-planar surface such that a further planarized surface is formed.

13. The method of claim 11 , further comprising:

arranging a lens layer above the sensor substrate;

applying a transfer mask on the lens layer, the transfer mask having a shape of a lens or an array of lenses; and

forming the lens or an array of lenses by transferring the shape of the transfer mask to the lens layer.

14. The method of claim 13 , further comprising:

applying a molding material covering the lens or array of lenses; and

forming a diffusor above the light sensor by modifying the molding material in a region above the light sensor.

15. The method of claim 11 , further comprising:

forming metal spacers at the filter elements by etching trenches in at least one of the planarized surfaces and filling the trenches with a metal.

16. The method of claim 11 , wherein planarizing the non-planar surface comprises filling gaps at the non-planar surface with a material.

17. The method of claim 11 , wherein filter elements of a first type are arranged at a distance from a surface of incidence that is different from (i) a distance from filter elements of a second type from the surface of incidence and/or (ii) a distance from filter elements of a third type from the surface of incidence.

18. A method of producing a system-on-chip camera, comprising:

providing a semiconductor body with an integrated circuit;

providing a sensor substrate with sensor elements, the sensor elements forming an array of pixels, and with a light sensor apart from the sensor elements such that a surface of incidence is above the sensor elements and the light sensor;

providing a further component arranged between each of the sensor element and the surface of incidence, the further component being a stack of further sensor elements arranged in the sensor substrate, wherein the sensor elements and the further sensor elements are arranged at different respective distances from the surface of incidence and wherein the sensor elements provide a different spectral sensitivity than the further sensor elements;

providing an optical component above the surface of incidence;

fastening the sensor substrate to the semiconductor body such that the sensor substrate is arranged between the semiconductor body and the surface of incidence and a metallization layer is arranged between the semiconductor body and the sensor substrate;

arranging a lens or an array of lenses above the sensor substrate; and

arranging a through-substrate interconnection electrically connecting the metallization layer and the optical component.