Electronic component and method of producing electronic component
An electronic component includes a glass base in which through holes are formed passing through both surfaces thereof; an insulating resin layer laminated on each of both surfaces of the glass base and including a copper plated layer formed therein; and a capacitor including a lower electrode formed on the copper plated layer, a dielectric layer laminated on the lower electrode, and an upper electrode laminated on the dielectric layer. In the electronic component, the upper electrode has a region that is parallel to the copper plated layer and is formed so as to be smaller than a region of the dielectric layer parallel to the surface of the copper plated layer or a region of the lower electrode parallel to the surface of the copper plated layer.
1. An electronic component, comprising:
a glass base having a first surface and a second surface opposite to the first surface, the glass base comprises through holes extending between the first surface and the second surface,
a first layer laminated on the first surface of the glass base, the first layer comprises (a) an insulating resin; (b) a copper plated layer on the first surface of the glass base and (c) a capacitor on the copper plated layer,
a second layer laminated on the first layer opposite to the glass base, the second layer comprises (a) an insulating resin and (b) a conductor circuit,
a third layer laminated on the second surface of the glass base, the third layer comprises (a) an insulating resin; (b) a copper plated layer on the second surface of the glass base and (c) a capacitor on the copper plated layer, and
a fourth layer laminated on the third layer opposite to the glass base, the third layer comprises (a) an insulating resin and (b) a conductor circuit,
wherein in each of the first layer and the third layer, the capacitor comprises a lower electrode, a dielectric layer on the lower electrode and an upper electrode laminated on the dielectric layer,
the upper electrode of the capacitor in the first layer has electric contact with the conductor circuit of the second layer;
the upper electrode of the capacitor in the third layer has electric contact with the conductor circuit of the fourth layer;
in each of the first layer and the third layer, a surface area of the upper electrode parallel to the first surface or the second surface of the glass base is smaller than a respective surface area of the dielectric layer and a respective surface area of the lower electrode and a surface area of the copper plated layer parallel to the first surface or the second surface of the glass base is greater than a respective surface area of the lower electrode.
2. The electronic component of claim 1 , wherein the conductor circuit, the lower electrode, the upper electrode, and the upper conductor are formed by laminating one or more metals selected from at least copper, nickel, palladium and titanium.
3. The electronic component of claim 1 , wherein the dielectric layer is selected from alumina, silica, silicon nitride, tantalum oxide, titanium oxide, calcium titanate, barium titanate, and strontium titanate.
4. The electronic component of claim 1 , wherein a coefficient of linear expansion of the glass base is 1.0 ppm/K or more and 4.0 ppm/K or less.