IP Library › Granted Patent US 11,416,378
Granted Patent B2
US 11,416,378 · App. 16/411,052 · Granted Aug 16, 2022

Integrated circuit device with integrated fault monitoring system

Inventors: Jan-Peter Schat (Hamburg, DE); Xavier Hours (Tournefeuille, FR); Andres Barrilado Gonzalez (Toulouse, FR)
Assignee: NXP B.V.
G06F11/3672G01R31/3167G01R31/3181G06F11/261
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Quick Facts
Patent No.
US 11,416,378
App. No.
16/411,052
Granted
Aug 16, 2022
Kind
B2
Abstract

An integrated circuit device is disclosed. The device includes a circuit configured to perform a function, a fault management component, at least one user register, an analog test bus component, a built-in self-test component, a safety monitor component, and gating logic. Additionally, the circuit is separated from the fault management component, the at least one user register, the analog test bus component, the built-in self-test component, the safety monitor, and the gating logic.

Claims (39)

1. An integrated circuit (IC) device comprising:

a circuit configured to perform a function;

a fault management component configured to manage fault monitoring of the circuit;

at least one user register connected to receive control signals from the fault management component and connected to provide register values to the circuit to control an aspect of the circuit;

an analog test bus component configured to establish connections to nodes in the circuit to convey analog signals to the nodes and to communicate digital signals with the fault management component;

a built-in self-test component connected to the circuit to test the circuit and to communicate digital signals with the fault management component;

a safety monitor component connected to the circuit to receive a signal from the circuit and to output a safety monitor signal in response to the signal received from the circuit; and

gating logic configured to gate signals from the circuit and/or from the safety monitor in response to signals from the fault management component;

wherein the circuit is separated from the fault management component, the at least one user register, the analog test bus component, the built-in self-test component, the safety monitor, and the gating logic.

2. The IC device of claim 1 , wherein the fault management component is configured to process digital data.

3. The IC device of claim 2 , wherein the at least one user register receives digital control signals from the fault management component.

4. The IC device of claim 3 , wherein the digital control signals are used to control parameters in the circuit.

5. The IC device of claim 1 , wherein the analog test bus component is configured to inject analog signals to the circuit via an analog test bus.

6. The IC device of claim 5 , wherein the analog test bus component includes at least one of a digital-to-analog converter (DAC) to convert digital signals from the fault management component to analog signals for injection into the circuit, and an analog-to-digital converter (ADC) to convert analog signals from the circuit to digital signal for the fault management component.

7. The IC device of claim 1 , wherein the built-in self-test component is configured to test a safety-critical circuit for parametric deviations.

8. The IC device of claim 1 , wherein the safety monitor is configured to monitor at least one of temperature, supply voltage, supply noise, output signal level, inputs signal level, and frequency of a ring oscillator in response to a signal from the circuit.

9. The IC device of claim 1 , wherein:

the at least one user register receives digital control signals from the fault management component;

the analog test bus component includes an analog test bus, at least one of a digital-to-analog converter (DAC) to convert digital signals from the fault management component to analog signals for injection into the circuit, and an analog-to-digital converter (ADC) to convert analog signals from the circuit to digital signal for the fault management component;

the built-in self-test component is configured to test a safety-critical circuit for parametric deviations; and

the safety monitor is configured to monitor at least one of temperature, supply voltage, supply noise, output signal level, inputs signal level, and frequency of a ring oscillator in response to a signal from the circuit.

10. The IC device of claim 1 , wherein the function performed by the circuit is a safety-critical function.

11. The IC device of claim 1 , wherein the circuit is separated from the fault management component, the at least one user register, the analog test bus component, the built-in self-test component, the safety monitor, and the gating logic in that the circuit and the components of the fault monitoring system have at least one of separate power supply lines, separate power ground lines, separate clock signals, separate enable and/or reset signals, and separate test control signals.

12. A method for monitoring faults in an integrated circuit (IC) device, the method comprising:

at a fault management component of the IC device, controlling the injection of faults into a circuit of the IC device through user registers of the IC device, through an analog test bus component of the IC device, and through a built-in self-test component of the IC device; and

at the fault management component of the IC device, receiving outputs related to the injected faults, wherein outputs related to the injected faults are received as digital values from a safety monitor of the IC device.

13. The method of claim 12 , wherein controlling the injection of faults into the circuit of the IC device through user registers of the IC device comprises digitally controlling an aspect of the circuit through a register value of at least one user register of the user registers.

14. The method of claim 12 , wherein controlling the injection of faults into the circuit of the IC device through an analog test bus component of the IC device comprises digitally controlling at least one switch to inject a signal into the circuit via an analog test bus.

15. The method of claim 12 , wherein controlling the injection of faults into the circuit of the IC device through a built-in self-test component of the IC device comprises digitally controlling the built-in self-test component to inject a fault signal into the circuit using a built-in self-test circuit.

16. The method of claim 12 , wherein:

controlling the injection of faults into the circuit of the IC device through user registers of the IC device comprises digitally controlling an aspect of the circuit through a register value of at least one user register of the user registers;

controlling the injection of faults into the circuit of the IC device through an analog test bus component of the IC device comprises digitally controlling at least one switch to inject a signal into the circuit via an analog test bus; and

controlling the injection of faults into the circuit of the IC device through a built-in self-test component of the IC device comprises digitally controlling the built-in self-test component to inject a fault signal into the circuit using a built-in self-test circuit.

17. The method of claim 12 , wherein an output related to an injected fault is received as a digital state value from a safety monitor of the IC device, wherein the digital state values from the safety monitor reflect the state of an aspect of the circuit.

18. The method of claim 12 , wherein the circuit of the IC device performs a safety-critical function.

19. A method for monitoring faults in an integrated circuit (IC) device, the method comprising:

at a fault management component of the IC device, controlling the injection of faults into a circuit of the IC device through user registers of the IC device, through an analog test bus component of the IC device, and through a built-in self-test component of the IC device;

at the fault management component of the IC device, receiving outputs related to the injected faults; and

at least one of gating an output from a safety monitor of the IC device during fault injection and gating an output from the circuit of the IC device during fault injection.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2019
From: SCHAT, JAN-PETER; HOURS, XAVIER; BARRILADO GONZALEZ, ANDRES
To: NXP B.V.
Reel/Frame 049164/0348 →
Priority Claims (1)
EP 18306142 · Aug 29, 2018 · regional
Continuity (1)
Related Publication 20200073786A1 · Mar 5, 2020