Ceramic electronic device and manufacturing method of the same
A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding.
1. A ceramic electronic device comprising:
a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face,
a first external electrode provided on the first end face;
a second external electrode provided on the second end face; and
an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding
wherein a small molecule cyclic siloxane Dn (n≥3) is released from the organic compound at a temperature which is equal to 300 degrees C. or more.
2. The ceramic electronic device as claimed in claim 1 , wherein a small molecule cyclic siloxane D3 (n≥3) is released from the organic compound so that a released amount peak appears at a temperature which is equal to 300 degrees C. or more.
3. The ceramic electronic device as claimed in claim 1 , wherein when a molecular weight of the small molecule cyclic siloxane Dn (n≥3) is smaller, a released amount of the small molecule cyclic siloxane Dn (n≥3) is larger.
4. The ceramic electronic device as claimed in claim 1 , wherein the organic compound is adhered to the surface of the multilayer chip between the first external electrode and the second external electrode.
5. The ceramic electronic device as claimed in claim 1 , wherein a released amount of a small molecule cyclic siloxane D3 per a unit area of the surface of the ceramic electronic device is 0.50 ppm/cm 2 or more from 300 degrees C. to 600 degrees C.
6. The ceramic electronic device as claimed in claim 1 , wherein a released amount of a small molecule cyclic siloxane D3 per a unit area of the surface of the ceramic electronic device is 30 ppm/cm 2 or less from 300 degrees C. to 600 degrees C.
7. The ceramic electronic device as claimed in claim 1 further comprising:
a silane film that is formed on at least the part of the region including the surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and the surfaces of the first external electrode and the second external electrode,
wherein the organic compound is provided on the silane film.
8. The ceramic electronic device as claimed in claim 1 , wherein the first external electrode and the second external electrode include a conductive resin layer including a metal component.
9. A ceramic electronic device comprising:
a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face,
a first external electrode provided on the first end face;
a second external electrode provided on the second end face; and
an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding,
wherein a small molecule cyclic siloxane D3 (n≥3) is released from the organic compound so that a released amount peak appears at a temperature which is equal to 300 degrees C. or more.
10. The ceramic electronic device as claimed in claim 9 , wherein when a molecular weight of the small molecule cyclic siloxane Dn (n≥3) is smaller, a released amount of the small molecule cyclic siloxane Dn (n≥3) is larger.
11. The ceramic electronic device as claimed in claim 9 , wherein the organic compound is adhered to the surface of the multilayer chip between the first external electrode and the second external electrode.
12. The ceramic electronic device as claimed in claim 9 further comprising:
a silane film that is formed on at least the part of the region including the surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and the surfaces of the first external electrode and the second external electrode,
wherein the organic compound is provided on the silane film.
13. The ceramic electronic device as claimed in claim 9 , wherein the first external electrode and the second external electrode include a conductive resin layer including a metal component.
14. A ceramic electronic device comprising:
a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face,
a first external electrode provided on the first end face;
a second external electrode provided on the second end face; and
an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding,
wherein a released amount of a small molecule cyclic siloxane D3 per a unit area of the surface of the ceramic electronic device is 0.50 ppm/cm′ or more from 300 degrees C. to 600 degrees C.
15. A ceramic electronic device comprising:
a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face,
a first external electrode provided on the first end face;
a second external electrode provided on the second end face; and
an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding,
wherein a released amount of a small molecule cyclic siloxane D3 per a unit area of the surface of the ceramic electronic device is 30 ppm/cm′ or less from 300 degrees C. to 600 degrees C.