Methods for forming recesses in source/drain regions and devices formed thereof
Embodiments disclosed herein relate generally to methods for forming recesses in epitaxial source/drain regions for forming conductive features. In some embodiments, the recesses are formed in a two-step etching process including an anisotropic etch to form a vertical opening and an isotropic etch to expand an end portion of the vertical opening laterally and vertically. The recesses can have increased contact area between the source/drain region and the conductive feature, and can enable reduced resistance therebetween.
1. A method for semiconductor processing, the method comprising:
forming a source/drain region on a substrate;
forming a dielectric layer over the source/drain region;
forming an opening through the dielectric layer and partially into the source/drain region using a first etch process;
laterally and vertically expanding the opening in the source/drain region using a second etch process different than the first etch process to form an expanded end portion, wherein a widest dimension of the expanded end portion of the opening is at an uppermost surface of the source/drain region in a cross-section perpendicular to longitudinal axis of a gate structure; and
forming a conductive feature in the expanded end portion of the opening.
2. The method of claim 1 , wherein the first etch process comprises an anisotropic etch process and the second etch process comprises an isotropic etch process.
3. The method of claim 1 , wherein the second etch process comprises an inductively coupled plasma etch process.
4. The method of claim 3 , wherein an etchant gas comprises a fluorocarbon-based gas, a fluorine-based gas, a chlorine-based gas, or a bromine-based gas.
5. The method of claim 3 , wherein an RF power of a plasma generator during the inductively coupled plasma etch process is in a range from about 100 W to about 2000 W.
6. The method of claim 3 , wherein a chamber pressure for the inductively coupled plasma etch process is in a range from about 30 mTorr to about 800 mTorr.
7. The method of claim 3 , wherein a bias voltage for the inductively coupled plasma etch process is in a range from about 0 volt to about 200 volt.
8. The method of claim 3 , wherein the second etch process is performed for a duration in a range from about 5 seconds to about 100 seconds.
9. A method for semiconductor processing, the method comprising:
forming a dummy gate stack;
forming a source/drain region adjacent the dummy gate stack;
forming one or more dielectric layers over the source/drain region;
forming a first opening through the one or more dielectric layers using a first anisotropic etch process, the first opening extending into the source/drain region to a first depth, the first opening having a first width in the source/drain region in a first cross-section;
expanding the first opening to form an expanded opening in the source/drain region using a first isotropic etch process, the expanded opening in the source/drain region having a second depth and a second width, the second depth being greater than the first depth, the second width being greater than the first width, wherein the expanded opening exposes a lower surface of a bottom dielectric layer of the one or more dielectric layers; and
forming a conductive element in the expanded opening.
10. The method of claim 9 , wherein a distance from the lower surface of the bottom dielectric layer to a bottom of the expanded opening is in a range from 10% to 50% of a height of the source/drain region.
11. The method of claim 9 , wherein a width of the expanded opening in the source/drain region is in a range from 5% to 50% more than a width of the expanded opening in the bottom dielectric layer.
12. The method of claim 9 further comprising, prior to forming the conductive element, forming a silicide layer along a surface of the source/drain region.
13. The method of claim 12 , wherein the silicide layer contacts the bottom dielectric layer.
14. The method of claim 9 , wherein a portion of the bottom dielectric layer extends along a lower surface of the source/drain region.
15. The method of claim 9 further comprising:
replacing the dummy gate stack with a replacement gate stack, wherein a portion of the source/drain region is interposed between expanded opening and an upper surface of the source/drain region along a line parallel with a sidewall of the replacement gate stack.
16. A method for semiconductor processing, the method comprising:
forming an epitaxial source/drain region over a fin;
forming a gate stack over the fin;
forming one or more dielectric layers over the epitaxial source/drain region, the one or more dielectric layers having a bottommost layer directly contacting the epitaxial source/drain region;
performing a first etch process to form a first recess extending through the one or more dielectric layers and partially into the epitaxial source/drain region;
performing a second etch process to laterally and vertically expand the first recess in the epitaxial source/drain region to form a second recess, the second recess extending along an underside surface of the bottommost layer; and
forming a conductive element in the second recess.
17. The method of claim 16 further comprising forming a silicide layer over the epitaxial source/drain region, the silicide layer contacting the underside surface of the bottommost layer.
18. The method of claim 17 , wherein the conductive element contacts the underside surface of the bottommost layer.
19. The method of claim 16 , wherein the second etch process laterally expands the first recess by an amount in a range from 2 nm to 20 nm and vertically expands the first recess by an amount in a range from 2 nm to 20 nm.
20. The method of claim 16 , wherein the second etch process comprises performing a dry etch process using an etchant including at least one of carbon tetrafluoride (CF4), trifluoromethane (CHF3), nitrogen trifluoride (NF3), sulfur hexafluoride (SF6), chlorine gas (C12), or hydrogen bromide (HBr).
21. The method of claim 16 , wherein the second etch process comprises performing a wet etching process using an etch solution of ammonium hydroxide, hydrogen peroxide, and water in a ratio in a range from 1:1:8000 to 1:1:100 (ammonium hydroxide:hydrogen peroxide:water).