Enhanced etch resistance for insulator layers implanted with low energy ions
In one embodiment, a method may include providing a substrate, comprising a plurality of surface features, an isolation layer, disposed between the plurality of surface features, and a substrate base, disposed subjacent the isolation layer and the plurality of surface features, wherein the plurality of surface features extend above a surface of the isolation layer. The method may include directing a low energy ion beam to the substrate, when the substrate is heated at a targeted temperature, wherein an altered layer is formed within an outer portion of the isolation layer, and wherein an inner portion of the isolation layer is not implanted.
1. A method, comprising:
providing a substrate, the substrate comprising a plurality of surface features, an isolation layer, disposed between the plurality of surface features, and a substrate base, disposed subjacent the isolation layer and the plurality of surface features, wherein the plurality of surface features extend above a surface of the isolation layer; and
directing a low energy ion beam to the substrate, when the substrate is heated at a targeted temperature, wherein an altered layer is formed within an outer portion of the isolation layer, and wherein an inner portion of the isolation layer is not implanted;
wherein an energy of the low energy ion beam is in a range of 100 eV to 500 eV.
2. The method of claim 1 , wherein the isolation layer comprises a flowable oxide.
3. The method of claim 1 , wherein the plurality of surface features comprise an array of semiconductor fins.
4. The method of claim 3 , wherein the array of semiconductor fins comprise a Si/SiGe heterostructure.
5. The method of claim 1 , wherein the altered layer comprises a thickness of 5 urn less.
6. The method of claim 1 , wherein the low energy ion beam comprises silicon ions.
7. The method of claim 6 , wherein the low energy ion beam implants a dose of 1E15 cm 2 to 1E16 cm 2 of silicon ions.
8. The method of claim 1 , further comprising processing the substrate to generate a plurality of transistor devices using the plurality of surface features, after the directing the low energy ion beam.
9. The method of claim 1 , wherein the targeted temperature is 400° C. to 700° C.
10. A method of forming a fin-type device comprising:
providing a substrate, the substrate comprising:
a plurality of semiconductor fins;
an isolation layer, comprising a flowable oxide disposed between the plurality of semiconductor fins;
and a substrate base, disposed subjacent the isolation layer and the plurality of semiconductor fins, wherein the plurality of semiconductor fins extend above a surface of the isolation layer; and
directing a low energy silicon ion beam to the substrate, when the substrate as heated at a targeted temperature, wherein the low energy comprises an ion energy in a range of 100 eV to 500 eV.
11. The method of claim 10 , wherein the low energy silicon ion beam implants a dose of 1E15 cm 2 to 3.3E15 cm 2 of silicon ions.
12. The method of claim 10 , further comprising processing the substrate to generate a plurality of transistor devices on the plurality of semiconductor fins, after the directing the low energy silicon ion beam, wherein the directing the low energy silicon ion beam causes a reduction in etch rate of the fiowable oxide.
13. The method of claim 10 , wherein the targeted temperature is 400° C. to 700° C.
14. A method of forming a gate all around (GA) device, comprising:
providing a substrate, the substrate comprising a plurality of semiconductor fins, an isolation layer, disposed between the plurality of semiconductor fins, and a substrate base, disposed subjacent the isolation layer and the plurality of semiconductor fins, wherein the plurality of semiconductor fins comprise a Si/SiGe heterostructure and extend above a surface of the isolation layer; and
directing a low energy silicon ion beam to the substrate, when the substrate as heated at a temperature in a range of 400° C. to 700° C., wherein the low energy comprises an ion energy in a range of 100 eV to 500 eV.
15. The method of claim 14 , wherein the isolation layer comprises a flowable oxide.
16. The method of claim 14 , wherein an altered layer is formed within an outer portion of the isolation layer, and wherein an inner portion of the isolation layer is not implanted, wherein the altered layer comprises a thickness of 5 nm or less.
17. The method of claim 14 , wherein the low energy silicon ion beam comprises an implant dose of 1E15 cm 2 to 1E16 cm 2 of silicon ions.
18. The method of claim 17 , wherein the implant dose is between 1E15 cm 2 to 3.3E15 cm 2 .
19. The method of claim 14 , wherein the ion energy is 200 eV.