Ear wearable device

1. An ear wearable device comprising:

a housing including a nonconductive cover;

a speaker positioned in the housing;

a structure positioned in the housing and including a nonconductive supporting member facing the nonconductive cover and positioned in the housing, and a first conductive pattern positioned on the nonconductive supporting member;

a nonconductive bonding member positioned between the structure and the nonconductive cover; and

a touch sensor integrated circuit (IC) positioned in the housing and electrically connected with the first conductive pattern.

2. The ear wearable device of claim 1 , wherein the first conductive pattern is formed on the nonconductive supporting member through laser direct structuring (LDS).

3. The ear wearable device of claim 1 , wherein at least a portion of the nonconductive bonding member overlaps the first conductive pattern.

4. The ear wearable device of claim 3 , wherein:

the nonconductive cover includes at least one protrusion protruding toward the nonconductive supporting member,

the nonconductive supporting member includes at least one recess in which the at least one protrusion is inserted, and

the nonconductive bonding member extends between the at least one protrusion and the at least one recess.

5. The ear wearable device of claim 1 , wherein:

the nonconductive supporting member includes a recess facing the nonconductive cover, and

the first conductive pattern is positioned in the recess.

6. The ear wearable device of claim 5 , wherein the nonconductive cover includes a protrusion at least partially inserted in the recess.

7. The ear wearable device of claim 1 , wherein:

the nonconductive supporting member includes a first surface facing the nonconductive cover and a second surface facing an opposite direction to the first surface,

the first conductive pattern includes a first conductive portion positioned on the first surface and a second conductive portion extending from the first conductive portion and positioned on the second surface, and

the second conductive portion is electrically connected with the touch sensor IC.

8. The ear wearable device of claim 7 , further comprising a first printed circuit board positioned in the housing,

wherein the second conductive portion is electrically connected with the first printed circuit board through a flexible conductive member positioned between the second conductive portion and the first printed circuit board.

9. The ear wearable device of claim 8 , further comprising a second supporting member positioned between the nonconductive supporting member and the first printed circuit board and connected with the housing,

wherein the second conductive portion is electrically connected with the first printed circuit board through an opening formed at the second supporting member.

10. The ear wearable device of claim 8 , further comprising a battery positioned in the housing,

wherein the first printed circuit board is positioned between the nonconductive supporting member and the battery.

11. The ear wearable device of claim 8 , further comprising a microphone positioned on the first printed circuit board.

12. The ear wearable device of claim 8 , further comprising a second printed circuit board positioned between the speaker and a battery and electrically connected with the first printed circuit board,

wherein the speaker is electrically connected with the second printed circuit board.

13. The ear wearable device of claim 12 , wherein the touch sensor IC is positioned on the first printed circuit board or the second printed circuit board.

14. The ear wearable device of claim 1 , further comprising a communication module positioned in the housing,

wherein the structure further includes a second conductive pattern positioned on the nonconductive supporting member, and

wherein the second conductive pattern is physically separated from the first conductive pattern and is electrically connected with the communication module.

15. The ear wearable device of claim 14 , wherein the first conductive pattern is at least partially surrounded by the second conductive pattern.

16. An electronic device comprising:

a housing including a nonconductive region exposed to an outside;

a structure positioned in the housing and including a nonconductive supporting member facing the nonconductive region and positioned in the housing, and a first conductive pattern positioned on the nonconductive supporting member;

a nonconductive bonding member positioned between the structure and the nonconductive region; and

a touch sensor integrated circuit (IC) positioned in the housing and electrically connected with the first conductive pattern.

17. The electronic device of claim 16 , wherein the first conductive pattern is formed on the nonconductive supporting member through laser direct structuring (LDS).

18. The electronic device of claim 16 , wherein at least a portion of the nonconductive bonding member overlaps the first conductive pattern.

19. The electronic device of claim 16 , wherein:

the nonconductive region includes at least one protrusion protruding toward the nonconductive supporting member,

the nonconductive supporting member includes at least one recess in which the at least one protrusion is inserted, and

the nonconductive bonding member extends between the at least one protrusion and the at least one recess.

20. The electronic device of claim 16 , further comprising a communication module positioned in the housing,

wherein the structure further includes a second conductive pattern positioned on the nonconductive supporting member, and

wherein the second conductive pattern is physically separated from the first conductive pattern and is electrically connected with the communication module.