IP Library › Granted Patent US 11,426,571
Granted Patent B2
US 11,426,571 · App. 16/462,120 · Granted Aug 30, 2022

Microneedle array with composite formulation, and method for manufacturing same

Inventors: Hyung Il Jung (Seoul, KR); Hui Suk Yang (Seoul, KR)
Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
A61M37/0015A61K9/0021A61M2037/0023A61M2037/0053
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Quick Facts
Patent No.
US 11,426,571
App. No.
16/462,120
Granted
Aug 30, 2022
Kind
B2
Abstract

The present invention relates to a microneedle array and a method for manufacturing the same, the microneedle array comprising: a support; and a plurality of microneedles loaded with a solid-phase formulation which protrude from the upper portion of the support, wherein a liquid-phase formulation is applied or added dropwise onto an area of the upper portion of the support in which the microneedles are not formed, or in a case where one or more holes are formed in the support, the liquid-phase formulation is released, through the holes, onto the area of the upper portion of the support in which the microneedles are not formed.

Claims (24)

1. A microneedle array, comprising:

a support; and

a plurality of microneedles loaded with a solid-phase formulation material which protrude from an upper portion of the support, wherein the support and the plurality of microneedles are made of different material and the plurality of microneedles are dissolvable in a body of a subject,

wherein a liquid-phase formulation material is applied or added dropwise onto an area of the upper portion of the support in which the plurality of microneedles are not formed, or in a case where one or more holes are formed in the support, the liquid-phase formulation material is released, through the holes, onto the area of the upper portion of the support in which the microneedle is not formed.

2. The microneedle array according to claim 1 , wherein the plurality of microneedles are loaded with two or more solid-phase forming materials to form a multi-layer structure.

3. The microneedle array according to claim 1 , wherein a type of the liquid-phase formulation material is the same as or different from that of the solid-phase formulation material.

4. The microneedle array according to claim 3 , wherein in a case where the type of the liquid-phase formulation material is different from that of the solid-phase formulation material, the liquid-phase formulation material contains a fat-soluble material including one or more selected from the group consisting of horse oil, vitamin A and a derivative thereof, vitamin D and a derivative thereof, vitamin E and a derivative thereof, vitamin K and a derivative thereof, organic sunscreen, and a fat-soluble plant extract; or a water-soluble material including one or more selected from the group consisting of vitamin B and a derivative thereof, vitamin C and a derivative thereof, epigallocatechin gallate, a water-soluble plant extract, a water-soluble flavor, an enzyme, a microbial extract, and a mineral.

5. The microneedle array according to claim 3 , wherein in a case where the type of the liquid-phase formulation material is different from that of the solid-phase formulation material, the liquid-phase formulation material contains a material for dissolving the microneedles when the microneedles are applied to the body.

6. The microneedle array according to claim 3 , wherein in a case where the type of the liquid-phase formulation material is different from that of the solid-phase formulation material, the liquid-phase formulation material contains a material for protecting the skin from the microneedles when the microneedles are applied to the body.

7. The microneedle array according to claim 1 , wherein the liquid-phase formulation material is encapsulated.

8. The microneedle array according to claim 1 , further comprising:

a pressurizing means for releasing the liquid-phase formulation material.

9. The microneedle array according to claim 1 , further comprising:

an adhesive layer formed on a lower portion of the support.

10. A method for manufacturing a microneedle array, comprising:

(a) a step of preparing a support;

(b) a step of forming, on an upper portion of the support, a plurality of microneedles loaded with a solid-phase formulation material which protrude from the upper portion, by placing a plurality of viscous compositions on the upper portion of the support, and then performing molding and curing thereof to form, wherein the support and the plurality of microneedles are made of different material; and

(c) a step of applying or adding dropwise a liquid-phase formulation material comprising a material for dissolving the plurality of microneedles onto an area of the upper portion of the support in which the plurality of microneedles are not formed.

11. A method for manufacturing a microneedle array, comprising:

(a) a step of preparing a support having one or more holes formed therein;

(b) a step of forming, on an upper portion of the support, a plurality of microneedles loaded with a solid-phase formulation material which protrude from the upper portion, by placing a plurality of viscous compositions on the upper portion of the support, and then performing molding and curing thereof to form, wherein the support and the plurality of microneedles are made of different material; and

(c) a step of releasing a liquid-phase formulation material comprising a material for dissolving the plurality of microneedles, through the holes, onto an area of the upper portion of the support in which the plurality of microneedles are not formed.

12. The method according to claim 11 , further comprising, before or after the step (b):

a step of injecting the liquid-phase formulation material so as to be positioned in a lower portion or an inside of the support.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2019
From: JUNG, HYUNG II; YANG, HUI SUK
To: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
Reel/Frame 050462/0821 →
Priority Claims (1)
KR 10-2016-0154036 · Nov 18, 2016 · national
Continuity (1)
Related Publication 20200016388A1 · Jan 16, 2020