Powder film forming method and powder film forming device
A powder film forming method includes the steps of: filling an opening with a powder, the opening being formed in a screen plate; and forming the powder film by generating an electric potential difference between the screen plate and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.
1. A method of forming a powder film, comprising the steps of:
(a) filling an opening with a powder such that the powder is retained in the opening, the opening being formed in a powder filling member on a side facing a substrate, a shape of the opening corresponding to a shape of a powder film to be formed; and
(b) forming the powder film by generating an electric potential difference between the powder filling member and the substrate so as to cause the powder retained in the opening to move to the substrate,
wherein the powder filling member includes
a porous body, and
a covering part provided on one surface of the porous body;
wherein the covering part has the opening;
wherein, in the step (b), the covering part is provided on the side facing the substrate; and
wherein filling the powder in the opening comprises providing the powder on the porous body from a side opposite to the opening causing the powder to pass through the porous body into the opening and retained in the opening.
2. The method according to claim 1 , wherein, in the step (a), the powder is rubbed by a rubbing body so as to fill the opening.
3. The method according to claim 1 , wherein, in the step (a), the powder is vibrated so as to fill the opening.
4. The method according to claim 1 , wherein, in the step (a), the powder to fill the opening is charged.
5. The method according to claim 4 , wherein, in the step (a), the powder, which is charged, is caused to fill the powder filling member by spraying with use of an electrostatic spray.
6. The method according to claim 1 , wherein, in the step (b), the powder is rubbed by a rubbing body so as to move to the substrate.
7. The method according to claim 1 , wherein, in the step (b), the powder is vibrated so as to move to the substrate.
8. The method according to claim 1 , further comprising covering the opening with a holding plate disposed on the side facing the substrate, the holding plate preventing the powder from falling out of the opening during filling of the opening.
9. A method of forming a powder film, comprising the steps of:
(a) filling an opening with a powder by vibrating the powder such that the powder is retained in the opening, the opening being formed in a powder filling member on a side facing a substrate, a shape of the opening corresponding to a shape of the powder film to be formed; and
(b) forming the powder film by causing the powder retained in the opening to move to the substrate,
wherein the powder filling member includes
a porous body, and
a covering part provided on one surface of the porous body;
wherein the covering part has the opening;
wherein, in the step (b), the covering part is provided on the side facing the substrate; and
wherein filling the powder in the opening comprises providing the powder on the porous body from a side opposite to the opening causing the powder to pass through the porous body into the opening and retained in the opening.
10. The method according to claim 9 , wherein, in the step (b), the powder is rubbed by a rubbing body so as to move to the substrate.
11. The method according to claim 9 , wherein, in the step (b), the powder is vibrated so as to move to the substrate.
12. A method of forming a powder film, comprising the steps of:
(a) filling an opening with a powder, the opening being formed in a powder filling member on a side facing a substrate, a shape of the opening corresponding to a shape of a powder film to be formed, the opening being filled with the powder from a side opposite to a porous body of the powder filling member, the porous body facing the substrate;
(b) inverting the powder filling member while the opening is being blocked with a holding plate so that the porous body faces away from the substrate; and
(c) removing the holding plate from the opening and forming the powder film by generating an electric potential difference between the powder filling member and the substrate so as to cause the powder retained in the opening to move to the substrate.