Gate oxide structures in semiconductor devices
A semiconductor device with different gate structure configurations and a method of fabricating the same are disclosed. The method includes forming first and second nanostructured channel regions on first and second fin structures, forming first and second oxide layers with first and second thicknesses, forming a dielectric layer with first and second layer portions on the first and second oxide layers, forming first and second capping layers with first and second oxygen diffusivities on the first and second layer portions, growing the first and second oxide layers to have third and fourth thicknesses, and forming a gate metal fill layer over the dielectric layer. The first and second thicknesses are substantially equal to each other and the first and second oxide layers surround the first and second nanostructured channel regions. The second oxygen diffusivity is higher than the first oxygen diffusivity. The fourth thickness is greater than the third thickness.
1. A method, comprising:
forming first and second nanostructured channel regions on first and second fin structures, respectively;
forming first and second oxide layers with first and second thicknesses, respectively, wherein the first and second thicknesses are substantially equal to each other and wherein the first and second oxide layers surround the first and second nanostructured channel regions, respectively;
forming a high-k dielectric layer with first and second layer portions on the first and second oxide layers, respectively;
forming first and second capping layers with first and second oxygen diffusivities on the first and second layer portions, respectively, wherein the second oxygen diffusivity is higher than the first oxygen diffusivity;
growing the first and second oxide layers to have third and fourth thicknesses, wherein the fourth thickness is greater than the third thickness; and
forming a gate metal fill layer over the high-k dielectric layer.
2. The method of claim 1 , further comprising:
forming a first interfacial layer between the first capping layer and the first layer portion; and
forming a second interfacial layer between the second capping layer and the second layer portion.
3. The method of claim 1 , wherein the forming the first and second oxide layers comprises oxidizing exposed surfaces of the first and second nanostructured channel regions at substantially equal oxidation rates.
4. The method of claim 1 , wherein the growing the first and second oxide layers comprises oxidizing the first and second nanostructured channel regions through the first and second capping layers at first and second oxidation rates, respectively, and
wherein the second oxidation rate is greater than the first oxidation rate.
5. The method of claim 1 , wherein the forming the first and second capping layers comprises depositing first and second nitride layers with first and second thicknesses, respectively, and
wherein the first and second thicknesses are substantially equal to each other.
6. The method of claim 1 , wherein the forming the first and second capping layers comprises depositing first and second nitride layers with first and second thicknesses, respectively, and
wherein the second thickness is greater than the first thickness.
7. The method of claim 1 , wherein the forming the first and second capping layers comprises depositing first and second layers of materials that are different from each other and have thicknesses substantially equal to each other.
8. The method of claim 1 , wherein the forming the first and second capping layers comprises depositing first and second layers of a same material with thicknesses that are different from each other.
9. The method of claim 1 , further comprising:
forming a third oxide layer between the first capping layer and the first layer portion; and
forming a fourth oxide layer between the second capping layer and the second layer portion,
wherein the third and fourth oxide layers have materials different from each other.
10. The method of claim 1 , further comprising:
forming a third oxide layer with a first oxygen diffusivity between the first capping layer and the first layer portion; and
forming a fourth oxide layer with a second oxygen diffusivity between the second capping layer and the second layer portion,
wherein the second oxygen diffusivity is higher than the first oxygen diffusivity.
11. A method, comprising:
forming first and second nanostructured channel regions on first and second fin structures, respectively;
forming first and second gate oxide structures on the first and second nanostructured channel regions, respectively, wherein the forming the first and second gate oxide structures comprises:
forming first and second oxide layers of a same material with thicknesses that are substantially equal to each other,
forming first and second high-k dielectric layers of a same material,
forming first and second capping layers with oxygen diffusivities different from each other,
growing the first and second oxide layers to have thicknesses different from each other, and
removing the first and second capping layers; and
forming a gate metal fill layer over the first and second gate oxide structures.
12. The method of claim 11 , wherein the forming the first and second gate oxide structures comprises forming third and fourth oxide layers with oxygen diffusivities different from each other.
13. The method of claim 11 , wherein the forming the first and second gate oxide structures comprises forming third and fourth oxide layers with Gibbs energies different from each other.
14. The method of claim 11 , wherein the forming the first and second oxide layers comprises oxidizing the first and second nanostructured channel regions at a first oxidation temperature, and
wherein the growing the first and second oxide layers comprises oxidizing the first and second nanostructured channel regions at a second oxidation temperature that is higher than the first oxidation temperature.
15. The method of claim 11 , further comprising forming a work function metal layer between the first and second gate oxide structures and the gate metal fill layer.
16. The method of claim 11 , wherein the removing the first and second capping layers comprises etching the first and second capping layers with an atomic layer etch process.
17. A semiconductor device, comprising:
a substrate;
first and second fin structures disposed on the substrate;
first and second nanostructured channel regions disposed on the first and second fin structures, respectively, wherein dimensions of the second nanostructured channel region are smaller than dimensions of the first nanostructured channel region;
first and second gate oxide structures surrounding the first and second nanostructured channel regions, respectively, wherein the first and second gate oxide structures comprise:
first and second oxide layers of a same material with thicknesses that are different from each other,
first and second high-k dielectric layers disposed on the first and second oxide layers, respectively, and
third and fourth oxide layers of different materials with thicknesses that are substantially equal to each other, wherein the third and fourth oxide layers are disposed on the first and second high-k dielectric layers, respectively; and
first and second gate metal fill layers disposed over the first and second gate oxide structures, respectively.
18. The semiconductor device of claim 17 , wherein the third and fourth oxide layers have oxygen diffusivities different from each other.
19. The semiconductor device of claim 17 , wherein the third and fourth oxide layers have Gibbs energies different from each other.
20. The semiconductor device of claim 17 , wherein the first and second high-k dielectric layers comprise dopants of rare earth metals.