IP Library › Granted Patent US 11,431,830
Granted Patent B2
US 11,431,830 · App. 16/977,617 · Granted Aug 30, 2022

Circuit board including conductive structure for electrically connecting wires, and electronic device including same

Inventors: Junghoon Park (Suwon-si, KR); Dongyup Lee (Suwon-si, KR); Hyunseok Kim (Suwon-si, KR); Yongseung Yi (Suwon-si, KR); Hoyeong Lim (Suwon-si, KR); Seunggoo Kang (Suwon-si, KR); Dongil Son (Suwon-si, KR); Hyangbok Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H04M1/026G06F1/1652H05K1/02
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Quick Facts
Patent No.
US 11,431,830
App. No.
16/977,617
Granted
Aug 30, 2022
Kind
B2
Abstract

Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.

Claims (14)

1. A circuit board comprising: at least one wiring line disposed in the circuit board; at least one conductive structure disposed on the circuit board to reinforce the circuit board; and at least one conductive member disposed in the circuit board and electrically connecting the at least one wiring line and the at least one conductive structure, wherein the at least one wiring line includes a first wiring line and a second wiring line spaced apart from the first wiring line, and wherein the first wiring line and the second wiring line are formed to be electrically separated inside the circuit board, and wherein the at least one wiring line comprises at least one of a power signal wiring line, a control signal wiring line, or a communication signal wiring line.

2. The circuit board of claim 1 , wherein the at least one conductive structure comprises a reinforcing part to reinforce the circuit board.

3. The circuit board of claim 2 , wherein the reinforcing part comprises steel use stainless (SUS) or lead.

4. The circuit board of claim 1 , wherein the at least one conductive member comprises at least one of at least one via hole or at least one connection wiring line.

5. The circuit board of claim 1 , wherein the at least one conductive structure comprises at least one bonding member to attach the conductive structure onto the circuit board.

6. The circuit board of claim 1 , wherein a surface of the at least one conductive structure comprises at least one of an insulating cover part or an insulating printing layer that covers the conductive structure to insulate the conductive structure.

7. The circuit board of claim 6 , wherein the at least one conductive structure comprises at least one first bonding member to attach the conductive structure onto the circuit board, and

wherein the insulating cover part comprises a second bonding member to attach the insulating cover part onto the circuit board.

8. The circuit board of claim 1 , wherein a spacing space is disposed between the at least one conductive structure and the circuit board.

9. The circuit board of claim 8 , wherein at least one electronic component is disposed in the spacing space.

10. The circuit board of claim 9 , wherein the at least one conductive structure comprises a shield member configured to shield the at least one electronic component.

11. An electronic device, comprising: a housing comprising a front plate, a rear plate facing a direction that is opposite to the front plate, and a side surface surrounding a space between the front plate and the rear plate; a circuit board located in the interior of the housing and comprising at least one electronic component; at least one wiring line disposed in the circuit board; at least one conductive structure disposed on the circuit board to reinforce the circuit board; and at least one conductive member disposed in the circuit board and electrically connecting the at least one wiring line and the at least one conductive structure, wherein the at least one wiring line includes a first wiring line and a second wiring line spaced apart from the first wiring line, and the first wiring line and the second wiring line are formed to be electrically separated inside the circuit board, and wherein the at least one wiring line comprises at least one of a power signal wiring line, a control signal wiring line, or a communication signal wiring line.

12. The electronic device of claim 11 , wherein the at least one conductive structure comprises a reinforcing part to reinforce the circuit board.

13. An electronic device comprising the circuit board of claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2020
From: PARK, JUNGHOON; LEE, DONGYUP; KIM, HYUNSEOK; YI, YONGSEUNG; LIM, HOYEONG; KANG, SEUNGGOO; SON, DONGIL; LEE, HYANGBOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 053674/0138 →
Priority Claims (1)
KR 10-2018-0027309 · Mar 8, 2018 · national
Continuity (1)
Related Publication 20210044681A1 · Feb 11, 2021
Cited By (3)
US 12,422,891 US 12,568,592 US 12,706,417