Electronic component mounting machine and electronic component mounting method

1. An electronic component mounting machine, configured to pick up a supplied electronic component and mount the electronic component on a conveyed circuit board, comprising:

a head main body,

a lifting and lowering section configured to move up and down with respect to the head main body,

a holder configured to move up and down with respect to the head main body as the lifting and lowering section moves up and down,

a component holding section configured to be attached to the holder and to hold the electronic component, and

a contact determination section configured to determine whether the electronic component, being held by the component holding section, has come in contact with the circuit board,

wherein the holder comprises:

a syringe configured to move up and down as the lifting and lowering section moves up and down,

a first displacement portion configured to move up and down with respect to the syringe and to which the component holding section is attached,

a first urging portion configured to urge the first displacement portion downward with respect to the syringe,

a second displacement portion, being provided separately from the first displacement portion, which is configured to move up and down with respect to the syringe and the first displacement portion, and

a second urging portion configured to urge the second displacement portion upward with respect to the syringe;

wherein the second displacement portion comprises:

an engaging portion configured to engage the first displacement portion urged downward by the first urging portion in a vertical direction, and

a target detection portion coupled to the engaging portion and disposed above the syringe,

wherein forces of the first urging portion and the second urging portion are collinear with a longitudinal axis of the syringe,

wherein the lifting and lowering section engages the syringe between the first urging portion and the second urging portion, and

wherein the contact determination section includes a contact-detecting sensor, being disposed above the lifting and lowering section, which is configured to detect displacement of the target detection portion with respect to the syringe, and the contact determination section determines that the electronic component has contacted the circuit board when displacement of the target detection portion is detected with the contact-detecting sensor.

2. The electronic component mounting machine of claim 1 ,

wherein the head main body is a rotary head that is indexed to multiple indexing angles by rotating about an axis parallel to the vertical direction,

wherein multiple holders are provided in the rotary head, and

wherein the contact-detecting sensor is provided in the lifting and lowering section.

3. The electronic component mounting machine of claim 2 ,

wherein the electronic component mounting machine includes a head driving device configured to move the head main body in a direction perpendicular to the vertical direction, and

wherein the rotary head is detachable from the head driving device.

4. An electronic component mounting method comprising: providing an electronic component mounting machine configured to pick up a supplied electronic component and mount the electronic component on a conveyed circuit board, the electronic component mounting machine comprising:

a head main body,

a lifting and lowering section configured to move up and down with respect to the head main body,

a holder configured to move up and down with respect to the head main body as the lifting and lowering section moves up and down,

a component holding section configured to be attached to the holder and to hold the electronic component, and

a contact-detecting sensor disposed above the lifting and lowering section;

wherein the holder comprises:

a syringe configured to move up and down as the lifting and lowering section moves up and down,

a first displacement portion configured to move up and down with respect to the syringe and to which the component holding section is attached,

a first urging portion configured to urge the first displacement portion downward with respect to the syringe,

a second displacement portion, being provided separately from the first displacement portion, which is configured to move up and down with respect to the syringe and the first displacement portion, and

a second urging portion configured to urge the second displacement portion upward with respect to the syringe;

wherein the second displacement portion comprises:

an engaging portion configured to engage the first displacement portion urged downward by the first urging portion in a vertical direction, and

a target detection portion coupled to the engaging portion and disposed above the syringe,

wherein forces of the first urging portion and the second urging portion are collinear with a longitudinal axis of the syringe,

wherein the lifting and lowering section engages the syringe between the first urging portion and the second urging portion, and

determining that an electronic component has come in contact with the circuit board when the contact-detecting sensor detects displacement of the target detection portion with respect to the syringe.