Encapsulation cover for an electronic package and fabrication process
An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
1. A process for fabricating at least one encapsulation cover for an electronic package, comprising:
placing at least one optical element through which light is able to pass and at least one metal insert into a cavity defined between opposite faces of two parts of a mold, with both the at least one optical element and the at least one metal insert in contact with a first face of the opposite faces of the mold and with at least a portion of the at least one optical element in contact with a second face of the opposite faces of the mold;
injecting a coating material into a remaining space of the cavity;
hardening the coating material to obtain a wall that is overmolded over the at least one optical element and the at least one metal insert, so as to produce at least one encapsulation cover including the at least one metal insert and the at least one optical element and in which the at least one optical element allows light to pass through from one face to another face of the wall; and
removing the at least one encapsulation cover from the mold.
2. The process according to claim 1 , further comprising, after removing, cutting through the overmolded wall at a distance from the at least one optical element and the at least one metal insert.
3. The process according to claim 1 , further comprising, prior to placing, mounting the at least one optical element in a through-passage in the at least one metal insert.
4. The process according to claim 1 , wherein placing comprises positioning the at least one optical element in the cavity of the mold spaced away from the at least one metal insert by a distance.
5. The process according to claim 1 , wherein for the placing the at least one metal insert is not in contact with the second face of the opposite faces of the mold.
6. The process according to claim 1 , wherein for the placing the at least one metal insert is in contact with the second face of the opposite faces of the mold.
7. The process according to claim 1 , wherein the second face of the opposite faces of the mold includes a groove, and wherein injecting the coating material comprises injecting the coating material into the groove, and wherein hardening the coating material comprises hardening the coating material to obtain a protruding portion of the at least one encapsulation cover.
8. The process according to claim 7 , further comprising, after removing, cutting through the protruding portion and the overmolded wall to form a peripheral wall of the at least one encapsulation cover.
9. A process for fabricating a plurality of encapsulation covers for electronic packages, comprising:
placing a first arrangement of a metal insert and an optical element through which light is able to pass into a cavity defined between opposite faces of two parts of a mold;
placing a second arrangement of a metal insert and an optical element through which light is able to pass into the cavity defined between the opposite faces of the two parts of the mold;
wherein the optical elements and the metal inserts are in contact with a first face of the opposite faces of the mold and wherein at least a portion of each optical element is in contact with a second face of the opposite faces of the mold;
injecting a coating material into a remaining space of the cavity;
hardening the coating material to obtain a wall that is overmolded over the first and second arrangements so as to produce an encapsulated structure;
removing the encapsulated structure from the mold; and
cutting through the encapsulated structure at a position between the first and second arrangement to produce corresponding first and second encapsulation covers.
10. The process according to claim 9 , wherein the metal insert of the first arrangement and the metal insert of the second arrangement are linked by a branch.
11. The process according to claim 10 , wherein cutting further comprises cutting through the branch.
12. The process according to claim 9 , further comprising, prior to placing, mounting the optical elements of the first and second arrangements, respectively, in through-passages in the metal inserts of the first and second arrangements.
13. The process according to claim 9 , wherein placing comprises positioning the optical elements of the first and second arrangements, respectively, in the cavity of the mold spaced away from the metal inserts of the first and second arrangements by a distance.
14. The process according to claim 9 , wherein for the placing the metal inserts of the first and second arrangements are not in contact with the second face of the opposite faces of the mold.
15. The process according to claim 9 , wherein for the placing the metal inserts of the first and second arrangements are in contact with the second face of the opposite faces of the mold.
16. The process according to claim 9 , wherein the second face of the opposite faces of the mold includes a plurality of grooves, and wherein injecting the coating material comprises injecting the coating material into the plurality of grooves, and wherein hardening the coating material comprises hardening the coating material to obtain a corresponding plurality of protruding portions of the encapsulated structure.
17. The process according to claim 16 , wherein cutting comprises cutting through the protruding portions to form a peripheral wall around each of the first and second encapsulation covers.