IP Library › Granted Patent US 11,437,922
Granted Patent B2
US 11,437,922 · App. 14/900,432 · Granted Sep 6, 2022

Printed circuit board power cell

Inventors: Abdelnassir Abdalla (Monroeville, PA); John B. Balicki, Jr. (Pittsburgh, PA); Edward Alan Cheesman (Chicora, PA); Mukul Rastogi (Murrysville, PA)
Assignee: Siemens Aktiengesellschaft
H02M7/003H02M5/458H02M5/4585H02M7/49H05K1/0265H05K7/209H05K1/0262
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Quick Facts
Patent No.
US 11,437,922
App. No.
14/900,432
Granted
Sep 6, 2022
Kind
B2
Abstract

A printed circuit board power cell having a printed circuit board including a DC bus disposed within the printed circuit board. The printed circuit board power cell includes a plurality of capacitors connected to the DC bus, a three-phase AC input disposed on the printed circuit board and a single-phase AC output disposed on the printed circuit board. The printed circuit board power cell also includes a power module connected to the DC bus, the three-phase AC input and the single-phase AC output, wherein the power module receives three phase AC input power via the three-phase AC input and responsively outputs a single-phase AC power via the single-phase AC output.

Claims (35)

1. A printed circuit board power cell comprising:

a printed circuit board including a DC bus disposed within the printed circuit board;

a plurality of capacitors connected to the DC bus;

a plurality of resistors, wherein each of the plurality of resistors is connected to at least one of the plurality of capacitors;

a three-phase AC input disposed on the printed circuit board;

a single-phase AC output disposed on the printed circuit board that is connected in series to outputs of other printed circuit board power cells in a phase group;

a heat sink;

a power module connected to the DC bus; and

a control section disposed on the printed circuit board,

wherein the three-phase AC input and the single-phase AC output are connected to the heat sink by the power module,

wherein the power module receives three phase AC input power via the three-phase AC input and responsively outputs a single-phase AC power via the single-phase AC output,

wherein the heat sink is configured to dissipate heat generated by the power module,

wherein the control section communicates with a master controller via an interface comprising fiber-optic cables,

wherein the control section receives instructions from the master controller regarding an operation of the printed circuit board power cell via the interface, and

wherein the control section produces and communicates diagnostic data of the printed circuit board power cell to the master controller via the interface.

2. The printed circuit board power cell of claim 1 , wherein the power module includes an H-Bridge inverter connected to the single-phase AC output.

3. The printed circuit board power cell of claim 1 , wherein the power module includes at least one of a diode bridge converter and an active-front-end converter connected to the three-phase AC input.

4. A multi-cell power supply for receiving power from a source and delivering power at an output terminal to a load, the multi-cell power supply comprising:

a master controller; and

a plurality of printed circuit board power cells coupled to the source and providing a first output voltage, each of the plurality of printed circuit board power cells comprising:

a printed circuit board including a DC bus disposed within the printed circuit board;

a plurality of capacitors connected to the DC bus;

a plurality of resistors, wherein each of the plurality of resistors is connected to at least one of the plurality of capacitors;

a three-phase AC input disposed on the printed circuit board, wherein the three-phase AC input is coupled to the source;

a single-phase AC output disposed on the printed circuit board that is connected in series to outputs of other printed circuit board power cells in a phase group;

a heat sink;

a power module connected to the DC bus, the three-phase AC input, the single-phase AC output and the heat sink; and

a control section disposed on the printed circuit board,

wherein the power module of each of the plurality of printed circuit board power cells receives input power via the three-phase AC input and responsively outputs the first output voltage via the respective single-phase AC output,

wherein the heat sink of each of the plurality of printed circuit board power cells is configured to dissipate heat generated by the respective power module,

wherein the control section of each of the plurality of printed circuit board power cells communicates with the master controller via an interface comprising fiber-optic cables,

wherein the control section of each of the plurality of printed circuit board power cells receives instructions from the master controller regarding an operation of the respective printed circuit board power cell of the plurality of the printed circuit board power cells via the interface, and

wherein the control section of each of the plurality of printed circuit board power cells produces and communicates diagnostic data of the respective printed circuit board power cell of the plurality of the printed circuit board power cells to the master controller via the interface.

5. The multi-cell power supply of claim 4 , wherein the power module of each of the plurality of printed circuit board power cells includes at least one of an H-Bridge inverter, a single half-bridge converter, and a double half-bridge converter connected to the single-phase AC output.

6. The multi-cell power supply of claim 4 , wherein the power module of each of the plurality of printed circuit board power cells includes at least one of a diode bridge converter and an active-front-end converter connected to the three-phase AC input.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2023
From: SIEMENS AKTIENGESELLSCHAFT
To: INNOMOTICS GMBH
Reel/Frame 065612/0733 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2016
From: SIEMENS INDUSTRY, INC
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 040381/0063 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2016
From: ABDALLA, ABDELNASSIR; BALICKI, JOHN B., JR.; CHEESMAN, EDWARD ALAN; RASTOGI, MUKUL
To: SIEMENS INDUSTRY, INC.
Reel/Frame 037448/0810 →
Continuity (2)
Provisional Application 61839430 · Jun 26, 2013
Related Publication 20160141973A1 · May 19, 2016