IP Library › Granted Patent US 11,440,837
Granted Patent B2
US 11,440,837 · App. 17/199,728 · Granted Sep 13, 2022

Articles having retained strength

Inventors: Heather Bossard Decker (Arkport, NY); Shandon Dee Hart (Elmira, NY); Guangli Hu (Berkeley Heights, NJ); Fei Li (Los Gatos, CA); James Joseph Price (Corning, NY); Chandan Kumar Saha (Franklin, MI)
Assignee: Corning Incorporated
C03C17/34C03C17/3417C03C17/3435C03C17/36C03C17/38C03C17/42C03C21/002G06F3/03C03C2217/425C03C2217/948Y10T428/2495Y10T428/24851Y10T428/24926Y10T428/24975Y10T428/24983Y10T428/24996Y10T428/24999
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Quick Facts
Patent No.
US 11,440,837
App. No.
17/199,728
Granted
Sep 13, 2022
Kind
B2
Abstract

One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article retains its average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. The bridging of a crack from one of the film or the glass substrate into the other of the film or the glass substrate can be prevented by inserting a crack mitigating layer between the glass substrate and the film.

Claims (50)

1. An article, comprising:

a substrate having a thickness from about 250 μm to about 2000 μm and opposing major surfaces including a first major surface and a second major surface;

a crack mitigating layer disposed on and directly in contact with the first major surface of the substrate, wherein the crack mitigating layer comprises a porous or non-porous polymeric or hybrid organic-inorganic material and has a thickness from about 0.01 μm to about 10 μm; and

a first film disposed on the crack mitigating layer having a thickness from about 0.01 μm to about 20 μm,

wherein an average strain-to-failure of the substrate is 0.5% or greater, as measured with the crack mitigating layer disposed on and directly in contact with the first major surface of the substrate and the first film disposed on the crack mitigating layer.

2. The article according to claim 1 , wherein the crack mitigating layer has a modulus that is less than a modulus of the first film and a modulus of the substrate and the thickness of the crack mitigating layer is from about 0.01 μm to less than 0.1 μm.

3. The article according to claim 1 , wherein the substrate is a glass substrate that is chemically strengthened and has a surface compressive stress of at least 500 MPa and a compressive depth of layer of at least 15 μm.

4. The article according to claim 1 , wherein the crack mitigating layer prevents cracks originating in one of the first film and the substrate from bridging to the other of the first film and the substrate.

5. The article according to claim 1 , wherein the first film further comprises one or more of an average strain-to-failure that is less than an average strain-to-failure of the substrate and a modulus that is greater than a modulus of the substrate, and wherein the first film is a layered structure.

6. The article according to claim 5 , wherein the first film comprises an anti-reflection (AR) film.

7. The article according to claim 1 , wherein the crack mitigating layer comprises a silicon-containing material.

8. The article according to claim 1 , wherein the article exhibits a reflectance of about 10% or less across a visible wavelength range from 400 nm to 700 nm.

9. A display device comprising the article of claim 1 , wherein the article serves as a protective cover for the display device.

10. The article of claim 1 , wherein the thickness of the crack mitigating layer is from about 35 nm to about 80 nm, and the thickness of the substrate is from about 300 μm to about 1000 μm.

11. An article, comprising:

a substrate having a thickness and opposing major surfaces including a first major surface and a second major surface;

a crack mitigating layer disposed on and directly in contact with the first major surface of the substrate, wherein the crack mitigating layer comprises a porous or non-porous polymeric or hybrid organic-inorganic material;

a first film disposed on the crack mitigating layer having a thickness from about 0.01 μm to about 20 μm; and

a further film disposed on and in direct contact with the second major surface of the substrate having a thickness from about 0.01 μm to about 20 μm,

wherein an average strain-to-failure of the substrate is 0.5% or greater, as measured with the crack mitigating layer disposed on and directly in contact with the first major surface of the substrate and the first film disposed on the crack mitigating layer.

12. The article according to claim 11 , wherein the further film is a layered structure, and further wherein the further film comprises a scratch-resistant layer.

13. The article according to claim 11 , wherein the further film comprises one or more of SiO 2 , Si 3 N 4 , SiO x N y , and combinations thereof.

14. The article according to claim 11 , wherein the article further comprises:

one or more additional films disposed on the second major surface of the substrate comprising one or more of SiO x , SiN y , SiO x N y , and combinations thereof.

15. The article according to claim 11 , wherein the first film comprises an anti-reflection (AR) film and a fingerprint-resistant layer.

16. The article according to claim 15 , wherein the AR film is a layered structure comprising one or more of SiO 2 , TiO 2 and Nb 2 O 5 .

17. The article according to claim 11 , wherein the crack mitigating layer has a thickness from about 0.01 μm to about 10 μm.

18. The article according to claim 11 , wherein the crack mitigating layer has a thickness from about 0.01 μm to less than 0.1 μm.

19. The article according to claim 11 , wherein the crack mitigating layer has a modulus that is less than a modulus of the first film and a modulus of the substrate.

20. The article according to claim 11 , wherein the substrate is a glass substrate that is chemically strengthened and has a surface compressive stress of at least 500 MPa and a compressive depth of layer of at least 15 μm.

21. The article according to claim 11 , wherein the first film further comprises one or more of an average strain-to-failure that is less than an average strain-to-failure of the substrate and a modulus that is greater than a modulus of the substrate.

22. The article according to claim 11 , wherein the crack mitigating layer comprises a silicon-containing material.

23. The article according to claim 11 , wherein the article exhibits a reflectance of about 10% or less across a visible wavelength range from 400 nm to 700 nm.

24. A display device comprising the article of claim 11 , wherein the article serves as a protective cover for the display device.

25. The article of claim 11 , wherein the crack mitigating layer has a thickness from about 35 nm to about 80 nm, and the thickness of the substrate is from about 300 μm to about 1000 μm.

26. An article, comprising:

a glass substrate having a thickness and opposing major surfaces including a first major surface and a second major surface;

a crack mitigating layer disposed on and directly in contact with the first major surface of the glass substrate, wherein the crack mitigating layer comprises a polymeric material and has a thickness from about 0.01 μm to about 0.25 μm;

a first film disposed on the crack mitigating layer having a thickness from about 0.01 μm to about 20 μm; and

a further film disposed on and in direct contact with the second major surface of the glass substrate having a thickness from about 0.01 μm to about 20 μm,

wherein an average strain-to-failure of the glass substrate is 0.5% or greater, as measured with the crack mitigating layer disposed on and directly in contact with the first major surface of the glass substrate and the first film disposed on the crack mitigating layer,

wherein the first film comprises one or more of SiO 2 , Al 2 O 3 , Nb 2 O 5 , Ta 2 O 5 , TiO 2 , and combinations thereof,

wherein the further film is a layered structure that comprises a scratch-resistant layer and one or more of SiO 2 , SiO x , SiN y , Si 3 N 4 , SiO x N y , and combinations thereof, and

further wherein the glass substrate is chemically strengthened and has a surface compressive stress of at least 500 MPa and a compressive depth of layer of at least 15 μm.

27. The article according to claim 26 , wherein the crack mitigating layer further comprises a modulus that is less than a modulus of the first film and a modulus of the glass substrate, and the thickness of the crack mitigating layer is from about 0.01 μm to less than 0.1 μm.

28. The article according to claim 26 , wherein the crack mitigating layer comprises a fracture toughness of 0.5 MPa*m 1/2 or greater.

29. The article according to claim 26 , wherein the first film further comprises a modulus of at least 25 GPa and a hardness of at least 1.75 GPa.

30. The article according to claim 26 , wherein the article exhibits a reflectance of about 10% or less across a visible wavelength range from 400 nm to 700 nm.

31. The article according to claim 26 , wherein the first film comprises a layered anti-reflection (AR) film comprising one or more of SiO 2 , TiO 2 and Nb 2 O 5 .

32. The article of claim 26 , wherein the thickness of the crack mitigating layer is from about 35 nm to about 80 nm, and the thickness of the glass substrate is from about 300 μm to about 1000 μm.

Continuity (5)
Continuation 16597296 · Oct 9, 2019
Division 14052055 · Oct 11, 2013
Provisional Application 61820395 · May 7, 2013
Provisional Application 61712908 · Oct 12, 2012
Related Publication 20210221733A1 · Jul 22, 2021
Cited By (1)
US 12,656,532