IP Library Granted Patent US 11,443,897
Granted Patent B2
US 11,443,897 · App. 17/243,961 · Granted Sep 13, 2022

Electronic component

Inventors: Toshihiro Iguchi (Tokyo, JP); Norihisa Ando (Tokyo, JP); Kenya Tamaki (Tokyo, JP); Kayou Matsunaga (Tokyo, JP)
Assignee: TDK CORPORATION
H01G4/2325H01G2/065H01G4/005H01G4/30H05K3/3426
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Quick Facts
Patent No.
US 11,443,897
App. No.
17/243,961
Granted
Sep 13, 2022
Kind
B2
Abstract

An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

Claims (23)

1. An electronic component comprising:

an element body;

an external electrode disposed on the element body; and

a metal terminal including a connection part opposing the external electrode and connected to the external electrode with solder, and a leg part extending from the connection part, wherein

each of the connection part and the leg part includes:

a base including a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface;

a first metal layer disposed on the first surface and connected to the solder;

a second metal layer disposed on the second surface; and

a coating layer disposed on each of the third surfaces,

the first metal layer and the second metal layer each include an outermost layer containing Sn, and

each coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

2. The electronic component according to claim 1 , wherein

the outermost layer of the coating layer is made of an oxide film.

3. The electronic component according to claim 2 , wherein

the base is made of stainless steel.

4. The electronic component according to claim 1 , wherein

an end edge of the metal terminal protrudes further than an end edge of the external electrode when viewed in a direction opposite to a direction in which the leg part extends from the connection part.

5. The electronic component according to claim 1 , wherein

the metal terminal includes a ridge part at a position corresponding to a ridge defined by the first surface and each of the third surfaces, the ridge part protruding in a direction from the second surface toward the first surface.

6. The electronic component according to claim 1 , wherein

a ratio of an area of the solder to an area of the element body is equal to or less than 90% when viewed in a direction in which the first surface and the second surface oppose each other.

7. The electronic component according to claim 1 , wherein

when viewed in a direction in which the first surface and the second surface oppose each other, an outermost peripheral edge of the solder is located inside an outermost edge of the metal terminal and separate from the outermost edge in a direction in which the pair of third surfaces oppose each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2021
From: IGUCHI, TOSHIHIRO; ANDO, NORIHISA; TAMAKI, KENYA; MATSUNAGA, KAYOU
To: TDK CORPORATION
Reel/Frame 056083/0023 →
Priority Claims (1)
JP JP2020-085931 · May 15, 2020 · national
Continuity (1)
Related Publication 20210358690A1 · Nov 18, 2021