Method of manufacturing display device, display device, display module, and electronic device
A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.
1. A method for manufacturing a display device comprising:
forming a separation layer over a support substrate;
forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion;
forming, over the inorganic insulating layer, a display element to be overlapped with the first portion;
forming, over the inorganic insulating layer, a connection electrode to be overlapped with the second portion;
sealing the display element;
separating the support substrate and the inorganic insulating layer using the separation layer;
attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and
etching the second portion using the substrate as a mask to expose the connection electrode.
2. The method for manufacturing a display device according to claim 1 ,
wherein the substrate has a stacked-layer structure of a flexible substrate and a protective layer,
wherein the flexible substrate is positioned closer to the inorganic insulating layer than the protective layer is, and
wherein the flexible substrate and the protective layer are separated from each other after the connection electrode is exposed.
3. The method for manufacturing a display device according to claim 1 ,
wherein by a dry etching method, the second portion is etched and a sidewall including a reaction product is formed on a side surface of the substrate.
4. The method for manufacturing a display device according to claim 1 ,
wherein the display element is a light-emitting element including a light-emitting organic compound.
5. The method for manufacturing a display device according to claim 1 ,
wherein the separation layer comprises a resin or tungsten.
6. A method for manufacturing a display device comprising:
forming a separation layer over a support substrate;
forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion;
forming, over the inorganic insulating layer, a transistor and a display element electrically connected to the transistor to be overlapped with the first portion;
forming, over the inorganic insulating layer, a connection electrode to be overlapped with the second portion;
sealing the display element;
separating the support substrate and the inorganic insulating layer using the separation layer;
attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and
etching the second portion using the substrate as a mask to expose the connection electrode.
7. The method for manufacturing a display device according to claim 6 ,
wherein the connection electrode is formed using a material and a process which are the same as those of at least one of electrodes included in the transistor.
8. The method for manufacturing a display device according to claim 6 ,
wherein the transistor comprises a metal oxide in a semiconductor layer.
9. The method for manufacturing a display device according to claim 6 ,
wherein the transistor comprises silicon in a semiconductor layer.