IP Library Granted Patent US 11,446,783
Granted Patent B2
US 11,446,783 · App. 16/294,382 · Granted Sep 20, 2022

Filtering during in-situ monitoring of polishing

Inventor: Sivakumar Dhandapani (San Jose, CA)
Assignee: Applied Materials, Inc.
B24B37/013B24B49/10B24B37/30G05B2219/49085
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Quick Facts
Patent No.
US 11,446,783
App. No.
16/294,382
Granted
Sep 20, 2022
Kind
B2
Abstract

A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, filtering a signal from the monitoring system to generate a filtered signal, and determining at least one of a polishing endpoint or an adjustment for a polishing rate from the filtered signal. The filtering includes modelling a plurality of periodic disturbances at a plurality of different frequencies using a plurality of disturbance states, modelling an underlying signal using a plant state, and applying a linear prediction filter to the plant state and the plurality of disturbance states to generate a filtered signal representing the underlying signal.

Claims (18)

1. A computer program product for controlling a polishing system, the computer program product comprising a non-transitory computer-readable medium having instructions which when executed cause one or more computers to:

receive, during polishing of a substrate, a signal from an in-situ monitoring system of the polishing system, the signal including a sequence of measured values;

filter the signal to generate a filtered signal, the filtered signal including a sequence of adjusted values, wherein the instructions to filter the signal include instructions to

model a plurality of periodic disturbances, using a plurality of disturbance states, at a plurality of different frequencies,

model an underlying signal, using a plant state, and

apply a linear prediction filter to the plant state and the plurality of disturbance states to generate the filtered signal representing the underlying signal; and

cause the polishing system to at least one of halt polishing of the substrate or adjust a polishing rate of the substrate based on the filtered signal.

2. The computer program product of claim 1 , wherein the plurality of periodic disturbances consists of two periodic disturbances.

3. The computer program product of claim 1 , wherein the plurality of periodic disturbances consists of three periodic disturbances.

4. The computer program product of claim 1 , wherein the plurality of periodic disturbances include a head sweep disturbance.

5. The computer program product of claim 1 , wherein the instructions to filter the signal include instructions to model the underlying signal using a plurality of plant states.

6. The computer program product of claim 5 , wherein the plurality of plant states include a filtered motor current and a motor current rate.

7. The computer program product of claim 5 , wherein the plurality of plant states include a filtered torque and a torque rate.

8. The computer program product of claim 1 , wherein the linear prediction filter comprises a Kalman filter.

9. The computer program product of claim 1 , wherein the plurality of periodic disturbances include a platen rotation disturbance.

10. The computer program product of claim 1 , wherein the instructions to model the plurality of periodic disturbances comprise instructions to model the plurality of periodic disturbances as a plurality of sinusoids.

11. The computer program product of claim 1 , wherein the plurality of different frequencies are preset values.

12. The computer program product of claim 1 , wherein a frequency of the plurality of different frequencies is a variable in a model used for modeling the plurality of periodic disturbance.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2019
From: DHANDAPANI, SIVAKUMAR
To: APPLIED MATERIALS, INC.
Reel/Frame 049090/0852 →
Continuity (2)
Provisional Application 62641950 · Mar 12, 2018
Related Publication 20190275633A1 · Sep 12, 2019