IP Library › Granted Patent US 11,448,663
Granted Patent B2
US 11,448,663 · App. 16/984,813 · Granted Sep 20, 2022

Pattern height information correction system and pattern height information correction method

Inventors: Kenji Yamasaki (Tokyo, JP); Hiroyuki Shindo (Tokyo, JP); Taeko Kashiwa (Tokyo, JP); Ryugo Kagetani (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
G01Q30/06G01B11/24G01Q60/38
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Quick Facts
Patent No.
US 11,448,663
App. No.
16/984,813
Granted
Sep 20, 2022
Kind
B2
Abstract

This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.

Claims (30)

1. A pattern height information correction system comprising:

contour line information of a pattern extracted from an acquired image including at least an atomic force microscope;

a design information database that stores design information including at least layer information; and

a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information,

wherein the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.

2. The pattern height information correction system according to claim 1 ,

wherein the computer system includes a first computer system and a second computer system interconnected via a network,

the first computer system acquires the contour line information of the pattern extracted from the acquired image including at least the atomic force microscope, and

when a value of a statistical value of the approximated curved surface exceeds a threshold value, the second computer system subtracts the approximated curved surface from the height information of the extracted pattern to obtain corrected pattern height information.

3. The pattern height information correction system according to claim 2 ,

wherein, when a shift amount is present in height information of a plurality of patterns after correction corresponding to the same layer information, the second computer system adjusts the height information of the plurality of patterns after correction so as to eliminate the shift amount.

4. The pattern height information correction system according to claim 2 ,

wherein the second computer system compares the value of the statistical value of the approximated curved surface with a threshold value designated in advance to determine whether or not correction of the height information of the pattern is necessary.

5. The pattern height information correction system according to claim 3 ,

wherein the second computer system compares the value of the statistical value of the approximated curved surface with a threshold value designated in advance to determine whether or not correction of the height information of the pattern is necessary.

6. A pattern height information correction method which is used in a pattern height information correction system including contour line information of a pattern extracted from an acquired image including at least an atomic force microscope, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, the pattern height information correction method comprising:

by the computer system,

specifying a horizontal region designated as horizontal in advance from the divided regions;

creating an approximated curved surface based on the specified horizontal region corresponding to the same layer information; and

correcting height information of the extracted pattern using the approximated curved surface.

7. The pattern height information correction method according to claim 6 ,

wherein the computer system includes a first computer system and a second computer system interconnected via a network,

the first computer system acquires the contour line information of a pattern extracted from the acquired image including at least the atomic force microscope, and

when a value of a statistical value of the approximated curved surface exceeds a threshold value, the second computer system subtracts the approximated curved surface from the height information of the extracted pattern to obtain corrected pattern height information.

8. The pattern height information correction method according to claim 7 ,

wherein, when a shift amount is present in the height information of a plurality of patterns after correction corresponding to the same layer information, the second computer system adjusts the height information of the plurality of patterns after correction so as to eliminate the shift amount.

9. The pattern height information correction method according to claim 7 ,

wherein the second computer system compares the value of the statistical value of the approximated curved surface with a threshold value designated in advance to determine whether or not correction of the height information of the pattern is necessary.

10. The pattern height information correction method according to claim 8 ,

wherein the second computer system compares the value of the statistical value of the approximated curved surface with a threshold value designated in advance to determine whether or not correction of the height information of the pattern is necessary.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2020
From: YAMASAKI, KENJI; SHINDO, HIROYUKI; KASHIWA, TAEKO; KAGETANI, RYUGO
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 053421/0675 →
Priority Claims (1)
JP JP2019-166105 · Sep 12, 2019 · national
Continuity (1)
Related Publication 20210080485A1 · Mar 18, 2021