Optical sensor arrangement and method for manufacturing an optical sensor arrangement

1. An optical sensor arrangement for time-of-flight measurement, the sensor arrangement comprising

a housing with a first and a second cavity separated by an optical barrier, and with a cover arrangement covering the first and the second cavity;

a measurement photodetector and a reference photo-detector both arranged in the second cavity and an optical emitter arranged in the first cavity; wherein

the cover arrangement comprises a translucent or transparent plate and one or more layers of material arranged on an inner main surface of the plate;

the one or more layers comprise an opaque coating with a first and a second aperture located above the first cavity, and with a third and a fourth aperture located above the second cavity;

the emitter is arranged and configured to emit light through the first aperture, and the measurement photodetector is arranged and configured to detect light entering the second cavity through the fourth aperture; and

the second and the third aperture establish a reference path for light from the emitter to the reference photodetector;

wherein a mutual arrangement of the emitter, the reference photodetector, the second aperture and the third aperture is adapted such that fractions of light emitted by the emitter enter the plate through the second aperture, are at least partially reflected at an outer main surface of the plate, enter the second cavity through the third aperture, and hit the reference photodetector.

2. The optical sensor arrangement according to claim 1 , wherein

the cover arrangement further comprises a mirror layer arranged on an outer main surface of the plate

covers at least a portion of the outer main surface located between the second and the third aperture.

3. The optical sensor arrangement according to claim 2 , wherein the mirror layer further covers portions of the outer main surface located directly above the second and/or the third aperture.

4. The optical sensor arrangement according to claim 1 , wherein

the cover arrangement further comprises an anti-reflective coating arranged on an outer main surface of the plate; and

the anti-reflective coating covers at least a portion of the outer main surface located directly above the first and/or the fourth aperture.

5. The optical sensor arrangement according to claim 1 , wherein

the one or more layers of material further comprise an optical filter layer covering at least a portion on the inner main surface corresponding to the fourth aperture; and

the optical filter layer is configured to pass light with a wavelength lying within an emission wavelength range of the emitter.

6. The optical sensor arrangement according to claim 5 , wherein the optical filter layer is configured to block or attenuate light with a wavelength lying outside of the emission wavelength range.

7. The optical sensor arrangement according to claim 1 , wherein the opaque coating comprises an ink.

8. The optical sensor arrangement according to claim 1 , wherein the housing comprises a frame body confining the first and the second cavity laterally.

9. The optical sensor arrangement according to claim 8 , wherein the frame body and the optical barrier are comprised by one continuous piece of material.

10. The optical sensor arrangement according to claim 8 , wherein the housing comprises a bottom plate on which the measurement photodetector, the reference photodetector and the emitter are arranged, the bottom plate confining the first and the second cavity on a side opposite to the cover arrangement.

11. The optical sensor arrangement according to claim 10 , wherein the frame body, the optical barrier and at least parts of the bottom plate are comprised by one continuous piece of material.

12. The optical sensor arrangement according to claim 1 , further comprising a control unit, wherein

the measurement photodetector is configured to generate a measurement signal in response to light detected by the measurement photodetector;

the reference photodetector is configured to generate a reference signal in response to light detected by the reference photodetector; and

the control unit is configured to compute a time-of-flight depending on the measurement signal and the reference signal.

13. The optical sensor arrangement according to claim 12 , wherein the control unit, the measurement photodetector and the reference photodetector are integrated on a single semiconductor die.

14. A method for manufacturing an optical sensor arrangement for time-of-flight measurement, the method comprising

providing a cover arrangement with a translucent or transparent plate and with one or more layers of material arranged on an inner main surface of the plate;

providing a housing body with a first and a second cavity separated by an optical barrier, wherein an optical emitter is arranged in the first cavity and a measurement photodetector and a reference photodetector are both arranged in the second cavity; and

attaching the cover arrangement to the housing body such that the cover arrangement covers the first and the second cavity; wherein

the one or more layers comprise an opaque coating with a first and a second aperture located above the first cavity, and with a third and a fourth aperture located above the second cavity;

the emitter is arranged and configured to emit light through the first aperture, and the measurement photodetector is arranged and configured to detect light entering the second cavity through the fourth aperture; and

the second and the third aperture establish a reference path for light from the emitter to the reference photodetector;

wherein a mutual arrangement of the emitter, the reference photodetector, the second aperture and the third aperture is adapted such that fractions of light emitted by the emitter enter the plate through the second aperture, are at least partially reflected at an outer main surface of the plate, enter the second cavity through the third aperture, and hit the reference photodetector.