Electronic device

1. An electronic device, comprising:

an enclosure;

an output component, wherein the output component is mounted on the enclosure, and the output component comprises a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell comprises a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate; and the infrared supplementary lighting lamp and the proximity infrared lamp are capable of emitting infrared light out of the packaging shell with different power;

a display screen, wherein the display screen is arranged on the enclosure, and the display screen is provided with a non-opaque entity region and comprises a front surface capable of displaying a picture and a back surface back on to the front surface; and

an optical sensor, wherein the optical sensor is arranged on a side, where the back surface is positioned, of the display screen; the optical sensor corresponds to the non-opaque entity region, and the optical sensor is arranged to receive light incident onto the optical sensor and output a target light intensity of the light.

2. The electronic device of claim 1 , further comprising a main board, an imaging component and a proximity sensor; wherein

the main board is mounted in the enclosure and provided with a mounting notch;

the imaging component is mounted in the enclosure and corresponds to the mounting notch;

the proximity sensor is connected to the main board and extends into the mounting notch from an edge of the mounting notch; and the proximity sensor is partially overlapped with the imaging component in a depth direction of the mounting notch.

3. The electronic device of claim 1 , further comprising an imaging component and a proximity sensor; wherein the imaging component is mounted on the enclosure, and the proximity sensor is mounted on the imaging component.

4. The electronic device of claim 3 , wherein the imaging component comprises a camera shell and a lens component; a top surface of the camera shell is a stepped surface and comprises a first top subsurface and a second top subsurface which is connected with the first top subsurface; the second top subsurface is inclined relative to the first top subsurface and forms a cut with the first top subsurface; the top surface is provided with a light output through hole, and the lens component is accommodated in the camera shell and corresponds to the light output through hole; and the proximity sensor is arranged at the first top subsurface.

5. The electronic device of claim 3 , wherein the imaging component comprises a camera shell and two lens components, and a cut is formed in a top surface of the camera shell to form a stepped top surface; the top surface comprises a first stepped surface and a second stepped surface at a level lower than that of the first stepped surface, two light output through holes are formed in the first stepped surface, and the light output through holes correspond to the lens components; and the proximity sensor is arranged at the second stepped surface.

6. The electronic device of claim 3 , wherein the imaging component comprises a lens mount, a lens barrel mounted on the lens mount and a substrate partially arranged in the lens mount; and the proximity sensor is arranged on the substrate.

7. The electronic device of claim 1 , further comprising a proximity sensor, and the proximity sensor are combined with the output component; the infrared supplementary lighting lamp, the proximity infrared lamp and the proximity sensor are all packaged in the packaging shell and born on the packaging substrate; and the proximity sensor is arranged to receive the infrared light reflected by an object to detect a distance between the object and the electronic device.

8. The electronic device of claim 1 , wherein the output component further comprises a chip, and the infrared supplementary lighting lamp and the proximity infrared lamp are formed on the same chip.

9. The electronic device of claim 8 , wherein the packaging shell further comprises a packaging sidewall and a packaging top; the packaging sidewall extends from the packaging substrate and is connected between the packaging top and the packaging substrate; a supplementary lighting window and a proximity window are formed in the packaging top, the supplementary lighting window corresponds to the infrared supplementary lighting lamp, and the proximity window corresponds to the proximity infrared lamp.

10. The electronic device of claim 8 , wherein the output component further comprises at least one of a supplementary lighting lamp lens or a proximity lamp lens; wherein the supplementary lighting lamp lens is arranged in the packaging shell and corresponds to the infrared supplementary lighting lamp; and

the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.

11. The electronic device of claim 8 , wherein the output component further comprises a metal baffle plate, and the metal baffle plate is positioned in the packaging shell and positioned between the infrared supplementary lighting lamp and the proximity infrared lamp.

12. The electronic device of claim 1 , wherein the output component further comprises an optical sealing cover made from a non-opaque material; the optical sealing cover is formed on the packaging substrate and positioned in the packaging shell, and the optical sealing cover wraps the infrared supplementary lighting lamp and the proximity infrared lamp.

13. The electronic device of claim 12 , wherein the output component further comprises a light output baffle plate, and the light output baffle plate is formed in the optical sealing cover and positioned between the infrared supplementary lighting lamp and the proximity infrared lamp.

14. The electronic device of claim 1 , further comprising a non-opaque cover plate, wherein the enclosure is provided with an enclosure proximity through hole and an enclosure supplementary lighting through hole; the proximity infrared lamp corresponds to the enclosure proximity through hole, the infrared supplementary lighting lamp corresponds to the enclosure supplementary lighting through hole, and the cover plate is arranged on the enclosure.

15. The electronic device of claim 7 , wherein the output component further comprises a chip; and the infrared supplementary lighting lamp, the proximity infrared lamp and the proximity sensor are all formed on the same chip.

16. The electronic device of claim 15 , wherein the packaging shell further comprises a packaging sidewall and a packaging top; the packaging sidewall extends from the packaging substrate and is connected between the packaging top and the packaging substrate; a supplementary lighting window, a proximity window and a proximity light receiving window are formed in the packaging top; the supplementary lighting window corresponds to the infrared supplementary lighting lamp, the proximity window corresponds to the proximity infrared lamp, and the proximity light receiving window corresponds to the proximity sensor.

17. The electronic device of claim 15 , wherein the output component further comprises at least one of a supplementary lighting lamp lens, a proximity lamp lens or a proximity sensing lens; wherein the supplementary lighting lamp lens is arranged in the packaging shell and corresponds to the infrared supplementary lighting lamp;

the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp; and

the proximity sensing lens is arranged in the packaging shell and corresponds to the proximity sensor.

18. The electronic device of claim 15 , wherein the output component further comprises multiple metal baffle plates, and the multiple metal baffle plates are positioned in the packaging shell and positioned between any two of the infrared supplementary lighting lamp, the proximity infrared lamp and the proximity sensor respectively.

19. The electronic device of claim 7 , wherein the output component further comprises an optical sealing cover made from a non-opaque material; the optical sealing cover is formed on the packaging substrate and positioned in the packaging shell, and the optical sealing cover wraps the infrared supplementary lighting lamp, the proximity infrared lamp and the proximity sensor;

wherein the output component further comprises multiple light output baffle plates, and the multiple light output baffle plates are formed in the optical sealing cover and positioned between any two of the infrared supplementary lighting lamp, the proximity infrared lamp and the proximity sensor respectively.

20. An electronic device, comprising: an output component,

wherein the output component comprises a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell comprises a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate; and the infrared supplementary lighting lamp and the proximity infrared lamp are capable of emitting infrared light out of the packaging shell with different power.