IP Library Granted Patent US 11,450,346
Granted Patent B2
US 11,450,346 · App. 17/151,401 · Granted Sep 20, 2022

Thermal management of laser diode mode hopping for heat assisted media recording

Inventors: Karim Tatah (Eden Prairie, MN); Mourad Benakli (Eden Prairie, MN); James Gary Wessel (Savage, MN)
Assignee: Seagate Technology LLC
G11B7/1263G11B5/02G11B5/09G11B5/40G11B5/455H01S5/0261H01S5/0612H01S5/0651H01S5/06804H01S5/06808G11B2005/0021H01S5/02453H01S5/0617H01S5/06216
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Quick Facts
Patent No.
US 11,450,346
App. No.
17/151,401
Granted
Sep 20, 2022
Kind
B2
Abstract

A method and apparatus provide for determining a temperature at a junction of a laser diode when the laser diode is operated in a lasing state that facilitates heat-assisted magnetic recording, comparing the junction temperature and an injection current supplied during the lasing state to stored combinations of junction temperature and injection current, and determining a likelihood of mode hopping occurring for the laser diode during the lasing state based on the comparison to stored combinations of junction temperature and injection current.

Claims (42)

1. An apparatus, comprising:

a slider configured to facilitate heat assisted magnetic recording (HAMR);

a laser diode disposed in the slider;

a read element and a write element respectively situated at an air bearing surface (ABS) of the slider;

a near-field transducer (NFT) situated at the ABS proximate the write element;

an optical waveguide configured to couple light from the laser diode to the NFT; and

a heater arrangement disposed in, along, or adjacent the laser diode and configured to heat a junction of the laser diode during one or both of at least a portion of the non-lasing state and at least a portion of the lasing state of the laser diode.

2. The apparatus of claim 1 , wherein the heater arrangement is configured to heat the junction of the laser diode during at least the portion of the non-lasing state and at least the portion of the lasing state of the laser diode.

3. The apparatus of claim 1 , wherein the heater arrangement is disposed in the laser diode.

4. The apparatus of claim 1 , wherein the slider has a laser-in-slider (LIS) configuration.

5. The apparatus of claim 1 , comprising a temperature sensing arrangement configured to determine a temperature of a junction of the laser diode.

6. The apparatus of claim 1 , comprising:

a temperature sensing arrangement coupled to the laser diode and configured to determine a temperature of a junction of the laser diode;

wherein the temperature sensing arrangement is configured to calculate a temperature of the laser diode junction based on a voltage differential between a non-steady lasing state of the laser diode and a steady state lasing state of the laser diode.

7. The apparatus of claim 1 , comprising:

a heater control coupled to the heater arrangement; and

a laser control coupled to the laser diode;

wherein the heater control and the laser control define independently controllable circuits.

8. The apparatus of claim 1 , wherein the heater arrangement is electrically coupled to the laser diode.

9. The apparatus of claim 1 , wherein the heater arrangement comprises one or more of a diode, a resistive element, and a thermistor.

10. The apparatus of claim 1 , wherein the heater arrangement is configured to heat the laser diode junction to achieve a junction temperature associated with a reduced likelihood of laser diode mode hopping.

11. An apparatus, comprising:

a slider configured to facilitate heat assisted magnetic recording (HAMR);

a submount disposed on the slider and configured to support a laser diode;

a read element and a write element respectively situated at an air bearing surface (ABS) of the slider;

a near-field transducer (NFT) situated at the ABS proximate the write element;

an optical waveguide configured to couple light from the laser diode to the NFT; and

a heater arrangement disposed on the submount at a location in, along, or adjacent the laser diode, the heater arrangement configured to heat the junction of the laser diode during one or both of at least a portion of the non-lasing state and at least a portion of the lasing state of the laser diode.

12. The apparatus of claim 11 , wherein the heater arrangement is configured to heat the junction of the laser diode during at least the portion of the non-lasing state and at least the portion of the lasing state of the laser diode.

13. The apparatus of claim 11 , wherein the heater arrangement is disposed in the laser diode.

14. The apparatus of claim 11 , wherein the slider has a laser-on-slider (LOS) configuration.

15. The apparatus of claim 11 , comprising a temperature sensing arrangement configured to determine a temperature of a junction of the laser diode.

16. The apparatus of claim 11 , comprising:

a temperature sensing arrangement coupled to the laser diode and configured to determine a temperature of a junction of the laser diode;

wherein the temperature sensing arrangement is configured to calculate a temperature of the laser diode junction based on a voltage differential between a non-steady lasing state of the laser diode and a steady state lasing state of the laser diode.

17. The apparatus of claim 11 , comprising:

a heater control coupled to the heater arrangement; and

a laser control coupled to the laser diode;

wherein the heater control and the laser control define independently controllable circuits.

18. The apparatus of claim 11 , wherein the heater arrangement is electrically coupled to the laser diode.

19. The apparatus of claim 11 , wherein the heater arrangement comprises one or more of a diode, a resistive element, and a thermistor.

20. The apparatus of claim 11 , wherein the heater arrangement is configured to heat the laser diode junction to achieve a junction temperature associated with a reduced likelihood of laser diode mode hopping.

Continuity (6)
Continuation 16714962 · Dec 16, 2019
Continuation 16399095 · Apr 30, 2019
Continuation 15947319 · Apr 6, 2018
Continuation 15061166 · Mar 4, 2016
Continuation 14492802 · Sep 22, 2014
Related Publication 20210166727A1 · Jun 3, 2021
Cited By (3)
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