Semiconductor package device with integrated inductor and manufacturing method thereof
A semiconductor device includes a semiconductor substrate, an interconnect structure, and a permalloy device. The interconnect structure is disposed over the semiconductor substrate. The interconnect structure includes a conductive coil. The conductive coil includes horizontally-extending metal lines, and vertically-extending vias electrically connecting the metal lines. The permalloy device is disposed in the interconnector structure and wound around by the conductive coil and insulated by the conductive coil, wherein the permalloy device and the conductive coil in combination define an inductor, and the permalloy device serves as a magnetic core of the inductor.
1. A method of manufacturing a semiconductor package device, the method comprising:
forming a first patterned metal layer of an interconnect structure over a substrate;
disposing a permalloy device by performing a pick and place operation to attach the permalloy device to the first patterned metal layer through a die attach film (DAF);
subsequent to the attaching of the permalloy device, forming a second patterned metal layer of the interconnect structure in the same tier as the permalloy device;
forming a third patterned metal layer of the interconnect structure over the second patterned metal layer and the permalloy device, wherein the first patterned metal layer, the second patterned metal layer and the third patterned metal layer collectively form a coil winding around the permalloy device; and
bonding a semiconductor die to the interconnect structure.
2. The method according to claim 1 , wherein forming the coil of the interconnect structure further comprises:
forming a patterned dielectric layer over the substrate; and
forming the first patterned metal layer in the patterned dielectric layer.
3. The method according to claim 1 , further comprising:
forming a dielectric layer surrounding the second patterned metal layer and the permalloy device.
4. The method according to claim 1 , further comprising forming a conductive bump on a surface of the substrate opposite the interconnect structure and electrically coupled to the semiconductor die.
5. A method of manufacturing a semiconductor device, the method comprising:
receiving a semiconductor substrate;
forming an interconnect structure over the semiconductor substrate, comprising:
forming a first patterned metal layer over the semiconductor substrate;
performing a pick and place operation to attach a permalloy device to the first patterned metal layer through a die attach film (DAF);
subsequent to the attaching of the permalloy device, forming a second patterned metal layer in the same tier as the permalloy device; and
forming a third patterned metal layer over the second patterned metal layer and the permalloy device,
wherein the interconnect structure comprising a conductive coil including horizontally-extending metal lines; and vertically-extending vias electrically connecting the horizontally-extending metal lines,
wherein the permalloy device is wound around by and insulated from the conductive coil, wherein the permalloy device and the conductive coil in combination define an inductor, and the permalloy device serves as a magnetic core of the inductor.
6. The method according to claim 5 , wherein the interconnect structure further comprises:
a dielectric material configured to electrically insulate the permalloy device from the conductive coil, wherein the dielectric material comprises at least one of oxide, nitride or carbide.
7. The method according to claim 5 , wherein the conductive coil comprises copper.
8. The method according to claim 5 , wherein the permalloy device is aligned with a predetermined location of the first patterned metal layer through a mark prior to performing the pick and place operation.
9. The method according to claim 5 , wherein the permalloy device comprises NiFe.
10. The method according to claim 5 , wherein the permalloy device comprises a permeability coefficient between from about 1,000 to about 1,000,000 H/m.
11. The method according to claim 5 , wherein the conductive coil comprises the first patterned metal layer, the second patterned metal layer and the third patterned metal layer, and the permalloy device is disposed at the same tier of the second patterned metal layer, wherein the second patterned metal layer is disposed between the first patterned metal layer and the third patterned metal layer.
12. The method according to claim 11 , wherein the second patterned metal layer is a metal-2 (M2) layer.
13. The method according to claim 11 , wherein the conductive coil further comprises:
a via layer coupled between the first patterned metal layer and the second patterned metal layer, wherein a first metal line of the first patterned metal layer has a width greater than that of the via of the via layer.
14. The method according to claim 13 , wherein a distance between the permalloy device and a second metal line of the second patterned metal layer equals to that between the permalloy device and a third metal line of the second patterned metal layer, wherein the permalloy device is disposed between the second metal line and the third metal line of the second patterned metal layer.
15. A method of manufacturing a semiconductor device, the method comprising:
receiving a substrate;
providing a first semiconductor die and a second semiconductor die over the substrate, wherein an interconnect structure is disposed between the substrate and the first semiconductor die;
forming a plurality of patterned metal layers and a plurality of via layers of the interconnect structure over the substrate, comprising:
forming a first layer of the plurality of patterned metal layers over the substrate;
disposing a permalloy device on the first layer of the plurality of patterned metal layers by performing a pick and place operation to attach the permalloy device to the first layer of the plurality of patterned metal layers through a die attach film (DAF);
subsequent to the attaching of the permalloy device, forming a second layer of the plurality of patterned metal layers in the same tier as the permalloy device; and
forming a third layer of the plurality of patterned metal layers over the second layer of the plurality of patterned metal layers and the permalloy device; and
forming a plurality of via layers of the interconnect structure over the substrate, wherein the patterned metal layers and the via layers comprise an interconnection path and metal features, wherein the metal features form a coil of an inductor.
16. The method according to claim 15 , wherein the permalloy device is aligned with a predetermined location of the first patterned metal layer through a mark prior to performing the pick and place operation.
17. The method according to claim 15 , further comprising:
a conductive bump on a surface of the substrate opposite the interconnect structure, the conductive bump being electrically coupled to the first semiconductor die and the second semiconductor die through the interconnect structure.
18. The method according to claim 15 , wherein the permalloy device is electrically isolated from the metal features.
19. The method according to claim 15 , further comprising:
a conductive connector electrically coupling the interconnect structure with the first semiconductor die.
20. The method according to claim 19 , further comprising:
a dielectric material encapsulating the interconnect structure, the first semiconductor die and the conductive connector.