Substrate inspection device that inspects application quality of adhesive

1. A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device comprising:

a mounting table that comprises a motor and that can move the substrate placed on the mounting table in a horizontal direction;

an illumination device that irradiates the solder and the adhesive on the substrate with light;

an imaging device that takes an image of the irradiated solder and the irradiated adhesive and outputs the image; and

a control device that is electrically connected to and controls the motor, the illumination device, and the imaging device, and that is configured to:

generate: actual solder position information of a solder group that includes two or more solders and on which the electronic component is mounted based on the image, received from the imaging device, that was taken while the mounting table is moving the substrate; ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of each of the solders; and ideal adhesive inspection reference information indicating a reference inspection position and/or a reference inspection range of the adhesive, wherein the ideal solder inspection reference information and the ideal adhesive inspection reference information are based on design data or manufacturing data stored in a storage, and the adhesive has a curing temperature higher than a melting temperature of the solders,

inspect each of the solders based on actual inspection reference information obtained by shifting the ideal solder inspection reference information by mounting position adjustment information, while inspecting the adhesive based on the ideal adhesive inspection reference information, and

upon determining that a printing state of the solders and an application state of the adhesive do not meet a predetermined condition, output, to the component mounting machine, the actual inspection reference information and upon determining that at least one of the printing state and the application state meet the predetermined condition, output, to the component mounting machine, at least one of a printing failure signal, an application failure signal, and failed soldering signal, wherein

the mounting position adjustment information indicates an amount and direction of positional misalignment of an expected mounting position information, and

the expected mounting position information indicates an expected mounting position of the electronic component relative to an ideal mounting position information that indicates an ideal mounting position of the electronic component mounted on the solder group.

2. The substrate inspection device according to claim 1 , wherein

the adhesive is an insulating adhesive, and

prior to a predetermined reflow process, the control device:

calculates an area of an overlap region between each of the solders and the adhesive, and

determines successful or failed soldering based on the calculated area.

3. The substrate inspection device according to claim 2 , wherein

the adhesive is an insulating adhesive, and

prior to a predetermined reflow process, the control device:

calculates an area of an overlap region between:

an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and

the adhesive, and

determines successful or failed soldering based on the calculated area.

4. The substrate inspection device according to claim 1 , wherein

the adhesive is an insulating adhesive, and

prior to a predetermined reflow process, the control device:

calculates an area of an overlap region between:

an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and

the adhesive, and

determines successful or failed soldering based on the calculated area.

5. The substrate inspection device according to claim 1 , wherein

the predetermined condition is that a ratio of a range occupied by a region other than an actual solder region to the actual inspection reference information exceeds a predetermined threshold.

6. The substrate inspection device according to claim 1 , wherein

the predetermined condition is that a ratio of a range occupied by a region other than an actual adhesive region to the ideal adhesive inspection reference information exceeds a predetermined threshold.

7. The substrate inspection device according to claim 1 , wherein

the predetermined condition is that an area of a region where an actual solder region overlap with an actual adhesive region exceeds a predetermined threshold.

8. A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects a thermosetting adhesive applied on the substrate, the substrate inspection device comprising:

a mounting table that comprises a motor and that can move the substrate placed on the mounting table in a horizontal direction;

an illumination device that irradiates the solder and the adhesive on the substrate with light;

an imaging device that takes an image of the irradiated solder and the irradiated adhesive and outputs the image; and

a control device that is electrically connected to and controls the motor, the illumination device, and the imaging device, and is configured to:

generate actual solder position information of a solder group that includes two or more solders and on which the electronic component is mounted based on the image, received from the imaging device, that was taken while the mounting table is moving the substrate, and ideal adhesive inspection reference information indicating a reference inspection position and/or a reference inspection range of the adhesive, wherein the ideal adhesive inspection reference information is based on design data or manufacturing data stored in a storage, and the adhesive has a curing temperature higher than a melting temperature of the solders,

output, to the component mounting machine and as mounting position adjustment information, information based on an amount of positional misalignment and a direction of positional misalignment of the actual solder position information relative to ideal solder position information, and

inspect the adhesive based on the ideal adhesive inspection reference information, wherein

the ideal solder position information indicates a position of the solder group included in the design data or in the manufacturing data,

the mounting position adjustment information indicates an amount of positional misalignment and a direction of positional misalignment of an expected mounting position information, and

the expected mounting position information indicates an expected mounting position of the electronic component, relative to an ideal mounting position information indicating an ideal mounting position of the electronic component that is to be mounted on the solder group.

9. The substrate inspection device according to claim 8 , wherein

the adhesive is an insulating adhesive, and

prior to a predetermined reflow process, the control device:

calculates an area of an overlap region between each of the solders and the adhesive, and

determines successful or failed soldering based on the calculated area.

10. The substrate inspection device according to claim 9 , wherein

the adhesive is an insulating adhesive, and

prior to a predetermined reflow process, the control device:

calculates an area of an overlap region between:

an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and

the adhesive, and

determines successful or failed soldering based on the calculated area.

11. The substrate inspection device according to claim 8 , wherein

the adhesive is an insulating adhesive, and

prior to a predetermined reflow process, the control device:

calculates an area of an overlap region between:

an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and

the adhesive, and

determines successful or failed soldering based on the calculated area.