Surface light source, manufacturing method thereof and liquid crystal display device
A surface light source and a manufacturing method thereof and a liquid crystal display device. The surface light source includes a substrate; a plurality of light emitting diode dies arranged in an array along a row direction and a column direction on the substrate; a driving circuit on the substrate and electrically connected to the plurality of light emitting diode dies and the driving circuit being configured to control at least two of the plurality of light emitting diode dies to emit light independently of each other; and an encapsulation layer on a side of the plurality of light emitting diode dies away from the substrate. The encapsulation layer is a continuous film layer covering the plurality of light emitting diode dies.
1. A surface light source, comprising:
a substrate;
a plurality of light emitting diode dies arranged in an array along a row direction and a column direction on the substrate;
a driving circuit on the substrate and electrically connected to the plurality of light emitting diode dies, each light emitting diode die being an unpackaged die;
an encapsulation layer on a side of the plurality of light emitting diode dies away from the substrate,
wherein the encapsulation layer is a continuous film layer covering the plurality of light emitting diode dies,
in a direction of at least one of the row direction and the column direction, a distance between adjacent ones of the plurality of light emitting diode dies is in a range of 30 μm to 500 μm, and
in a direction perpendicular to the substrate, a thickness of the encapsulation layer on the side of the plurality of light emitting diode dies away from the substrate is in a range of 10 μm to 30 μm,
wherein the plurality of light emitting diode dies comprise a plurality of die groups arranged in the row direction and the column direction, the surface light source further comprises a plurality of integrated circuit controllers connected with the driving circuit, each integrated circuit controller is electrically connected to one die group, and the integrated circuit controller electrically connected to each die group is configured to control each light emitting diode die in the each die group to emit light independently,
wherein the encapsulation layer covers the driving circuit but does not cover the integrated circuit controllers.
2. The surface light source according to claim 1 , wherein the encapsulation layer is in direct contact with the plurality of light emitting diode dies.
3. The surface light source according to claim 1 , wherein the plurality of light emitting diode dies comprise a plurality of red light dies, a plurality of green light dies and a plurality of blue light dies, and the plurality of red light dies, the plurality of green light dies and the plurality of blue light dies are uniformly distributed to emit white light.
4. The surface light source according to claim 1 , wherein the substrate is a glass substrate.
5. The surface light source according to claim 1 , wherein each of the plurality of light emitting diode dies comprises pins, and the driving circuit comprises pads, the surface light source further comprises:
a buffer layer between the substrate and the plurality of light emitting diode dies,
wherein the buffer layer comprises a plurality of openings configured to expose the pads, and each pin of the plurality of light emitting diode dies is configured to be inserted into one of the plurality of openings so as to be electrically connected with a corresponding one of the pads.
6. The surface light source according to claim 1 , wherein a size of each of the plurality of light emitting diode dies in one of the row direction and the column direction is in a range of 30 μm to 200 μm, and a size of each of the plurality of light emitting diode dies in the other one of the row direction and the column direction is in a range of 30 μm to 600 μm.
7. The surface light source according to claim 1 , further comprising:
a reflective layer on a side of the plurality of light emitting diode dies facing the substrate, so that light emitted by the plurality of light emitting diode dies exits to the side of the plurality of light emitting diode dies away from the substrate.
8. A liquid crystal display device, comprising:
the surface light source according to claim 1 ; and
a display panel on a light exiting side of the surface light source,
wherein the display panel comprises an array substrate and an opposing substrate which are oppositely arranged, and the surface light source is on a side of the array substrate away from the opposing substrate.
9. A manufacturing method of a surface light source, comprising:
forming a driving circuit on a substrate;
disposing a plurality of light emitting diode dies on a side of the substrate on which the driving circuit is formed, wherein the plurality of light emitting diode dies are electrically connected to the driving circuit, the driving circuit is configured to control at least two of the plurality of light emitting diode dies to emit light independently of each other, and each light emitting diode die is an unpackaged die; and
forming an encapsulation layer on a side of the plurality of light emitting diode dies away from the substrate, wherein the encapsulation layer is a continuous film layer covering the plurality of light emitting diode dies, wherein
in a direction of at least one of the row direction and the column direction, a distance between adjacent ones of the plurality of light emitting diode dies is in a range of 30 μm to 500 μm, and
in a direction perpendicular to the substrate, a thickness of the encapsulation layer on the side of the plurality of light emitting diode dies away from the substrate is less than 30 μm,
wherein the plurality of light emitting diode dies comprise a plurality of die groups arranged in the row direction and the column direction, the surface light source further comprises a plurality of integrated circuit controllers connected with the driving circuit, each integrated circuit controller is electrically connected to one die group, and the integrated circuit controller electrically connected to each die group is configured to control each light emitting diode die in the each die group to emit light independently,
wherein the encapsulation layer covers the driving circuit but does not cover the integrated circuit controllers.
10. The manufacturing method according to claim 9 , wherein the driving circuit comprises pads, each of the plurality of light emitting diode dies comprises pins, before disposing the plurality of light emitting diode dies, the manufacturing method further comprises:
forming a buffer layer on the side of the substrate on which the driving circuit is formed;
forming a plurality of openings in the buffer layer, the plurality of the openings being configured to expose the pads between the buffer layer and the substrate;
forming adhesive units adhered to the pads in the plurality of openings;
disposing the plurality of light emitting diode dies comprises:
inserting the pins of each of the plurality of light emitting diode dies into the plurality of openings so as to be adhered to the adhesive units.
11. The surface light source according to claim 1 , wherein the driving circuit is configured to control at least two of the plurality of light emitting diode dies to emit light independently of each other.
12. The surface light source according to claim 5 , wherein the buffer layer comprises a mixture of at least an organic substance and a photo-initiator, and the organic substance includes propyl acetate or siloxane.
13. The manufacturing method according to claim 10 , wherein the buffer layer comprises a mixture of at least an organic substance and a photo-initiator, and the organic substance includes propyl acetate or siloxane.