IP Library › Granted Patent US 11,456,110
Granted Patent B2
US 11,456,110 · App. 16/486,716 · Granted Sep 27, 2022

Coil device

Inventors: Kenji Nishimura (Tokyo, JP); Motonao Niizuma (Tokyo, JP)
Assignee: IHI CORPORATION
H01F27/2876B60L53/12H01F38/14H02J50/10
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Quick Facts
Patent No.
US 11,456,110
App. No.
16/486,716
Granted
Sep 27, 2022
Kind
B2
Abstract

A coil device includes a coil unit for stowing a coil part, and a heat dissipation unit thermally connected to the coil unit. The heat dissipation unit has a heat dissipation body, a heat dissipation fin movable relative to the heat dissipation body, and a fin drive mechanism for driving the heat dissipation fin. The heat dissipation unit has a heat dissipation configuration in which the heat dissipation fin projects from the heat dissipation body in a direction intersecting a winding axis, and a stowed configuration in which the heat dissipation fin is stowed in the heat dissipation body.

Claims (19)

1. A coil device, comprising:

a coil unit having a coil part and a housing configured to accommodate the coil part that has a main surface; and

a heat dissipation unit thermally connected to the coil unit,

wherein the heat dissipation unit includes a heat dissipation body thermally connected to the main surface and having an accommodation part, a heat dissipation member configured to be movable relative to the heat dissipation body in a direction orthogonal to a winding axis of the coil part where a winding of the coil part is wound around the winding axis and thermally connected to the heat dissipation body and a driver configured to move the heat dissipation member, and

wherein the heat dissipation unit has a first configuration in which the heat dissipation member projects from the heat dissipation body in a direction along the main surface, and a second configuration in which the heat dissipation member is stowed in the accommodation part of the heat dissipation body.

2. The coil device according to claim 1 , wherein when the coil part is being supplied with an electric current, the heat dissipation unit is in the first configuration.

3. The coil device according to claim 2 , wherein when the heat dissipation unit is in the first configuration, a length of the heat dissipation member projecting from the heat dissipation body is a predetermined desired projection length.

4. The coil device according to claim 2 , wherein the coil device supplies power to a paired coil device or receives power from the paired coil device, and

when the heat dissipation unit is in the first configuration, the length of the heat dissipation member projecting from the heat dissipation body is determined based on an amount of misalignment between the coil part of the coil device and a coil part of the paired coil device.

5. The coil device according to claim 1 , wherein the coil unit further has a ferrite plate disposed between the coil part and the housing.

6. The coil device according to claim 1 , wherein the heat dissipation member has a pair of heat dissipation fins,

the heat dissipation body has a housing connection surface in contact with the main surface of the housing, a road connection surface opposite to the housing connection surface and a pair of side surfaces, and

each of the pair of heat dissipation fins protrude from a respective surface of the pair of side surfaces when in the first mode.

7. The coil device according to claim 6 , wherein the pair of heat dissipation fins are switched reciprocally between the first configuration and the second configuration by the driver.

8. The coil device according to claim 6 , wherein a first heat dissipation fin of the pair of heat dissipation fins is switched reciprocally between the first configuration and the second configuration by a first portion of the driver, and

a second heat dissipation fin of the pair of heat dissipation fins is switched reciprocally between the first configuration and the second configuration by a second portion of the driver differing from the first portion of the driver.

9. The coil device according to claim 1 , wherein the pair of heat dissipation fins have an uneven structure extending along a movement direction for switching reciprocally between the first configuration and the second configuration.

10. The coil device according to claim 1 , wherein the pair of heat dissipation fins have an uneven structure extending along a direction orthogonal to a movement direction for switching reciprocally between the first configuration and the second configuration.

11. The coil device according to claim 1 , wherein the heat dissipation member has a pair of first heat dissipation members configured to move along a first direction orthogonal to the winding axis of the coil part and a pair of second heat dissipation members configured to move along a second direction orthogonal to the first direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2019
From: NISHIMURA, KENJI; NIIZUMA, MOTONAO
To: IHI CORPORATION
Reel/Frame 050096/0444 →
Priority Claims (1)
JP JP2017-122068 · Jun 22, 2017 · national
Continuity (1)
Related Publication 20200020478A1 · Jan 16, 2020