Plasma processing system
View Patent ↗A plasma processing system is provided. The plasma processing system includes an edge ring assembly that includes a dielectric ring and a coil. The coil is embedded within the dielectric ring. The coil generates a magnetic field that affects the ions in the proximity of the plasma sheath and in turn increases the fabrication yield of the semiconductor process.
1. A plasma processing system for processing a wafer, comprising:
an electrostatic chuck (ESC); and
an edge ring assembly surrounding the ESC, the edge ring assembly comprising:
a dielectric ring having a top surface, a bottom surface opposite the top surface, and a protrusion upward-extending from the top surface; and
a coil embedded in the protrusion of the dielectric ring, the coil having a plurality of loops, each of the plurality of loops having a different distance with respect to the bottom surface of the dielectric ring;
wherein the plurality of loops are correspondingly embedded within a plurality of dielectric layers, the plurality of dielectric layers are stacked on top of each other to form the dielectric ring.
2. The system of claim 1 , further comprising:
a tuning ring coupleable over the top surface of the dielectric ring and covers the protrusion of the dielectric ring.
3. The system of claim 1 , wherein a height of the protrusion of the dielectric ring is greater than or substantially equal to a thickness of a wafer.
4. The system of claim 1 , wherein the plurality of loops of the coil are ring shaped metals coupled to each other to form a cylindrical helix shape.
5. The system of claim 1 , wherein the plurality of loops of the coil are ring shaped metals coupled to each other to form a conical helix shape.
6. The system of claim 1 , wherein a pitch between the plurality of loops of the coil ranges between about 100 μm and about 300 μm.
7. The system of claim 1 , wherein a number of the plurality of loops of the coil is greater than or equal to three.
8. The system of claim 2 , wherein a material of the tuning ring includes silicon.
9. The system of claim 1 , wherein the coil is coupled to a DC voltage source, wherein a supplied voltage of the DC voltage source ranges from 24 volts to +24 volts.
10. The system of claim 8 , further comprising:
a voltage terminal disposed through the ESC and electrically coupled to a DC voltage source.
11. A plasma processing chamber, comprising:
an electrostatic chuck (ESC) having a step edge on a periphery, the step edge of the ESC having a step wall perpendicular to a step base; and
an edge ring assembly surrounding the ESC, the edge ring assembly comprising:
a first quartz ring surrounding the periphery of the ESC, the first quartz ring having a step edge on an inner periphery, the step edge of the first quartz ring having a step wall perpendicular to a step base;
a second quartz ring disposed over the first quartz ring, the second quartz ring having a step edge on an inner periphery, the step edge of the second quartz ring having a step wall perpendicular to a step base;
a dielectric ring disposed over the step base of the ESC and the step base of the first quartz ring, the dielectric ring having a step edge on an inner periphery, the step edge of the dielectric ring having a step wall perpendicular to a step base;
a coil embedded in the dielectric ring and formed along the step wall of the dielectric ring, the coil having a plurality of loops, each loop of the plurality of loops having a different distance corresponding to the step base of the dielectric ring; and
a tuning ring disposed over the step base of the dielectric ring and the step base of the second quartz ring, the tuning ring having a top surface, a bottom surface opposite the top surface, and a cavity formed along the bottom surface, the cavity capping a portion of the dielectric ring protruding from the step base of the dielectric ring.
12. The system of claim 11 , wherein the plurality of loops of the coil are ring shaped metals coupled to each other to form a cylindrical helix shape or a conical helix shape.
13. The system of claim 11 , wherein the plurality of loops are correspondingly embedded within a plurality of dielectric layers, the plurality of dielectric layers are stacked on top of each other to form the dielectric ring.
14. The system of claim 11 , wherein a material of the dielectric ring includes ceramic, and a material of the coil includes Molybdenum-Manganese.
15. The system of claim 11 , further comprising:
a quartz filler disposed between the edge ring assembly and the ESC.