IP Library Granted Patent US 11,456,714
Granted Patent B2
US 11,456,714 · App. 17/154,264 · Granted Sep 27, 2022

Electronic device for processing radio signal and operating method thereof

Inventors: Hyosung Lee (Suwon-si, KR); Namjun Cho (Suwon-si, KR); Hyoseok Na (Suwon-si, KR); Hanyeop Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H03F3/245H01Q1/243H01Q21/065H03F1/56H04B1/0064H04B1/40H03F2200/294H03F2200/387H03F2200/451
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Quick Facts
Patent No.
US 11,456,714
App. No.
17/154,264
Granted
Sep 27, 2022
Kind
B2
Abstract

Various embodiments relate to an apparatus and a method for processing a radio signal in an electronic device. The electronic device may include: a communication processor; and a power amplifier electrically connected to the communication processor, the power amplifier including a first switch, an input port, a first output port, and a second output port, the power amplifier further including a first amplification circuit disposed on a first electrical path between the input port and the first switch, a second amplification circuit disposed on a second electrical path between the first switch and the first output port, and a third amplification circuit disposed on a third electrical path between the first switch and the second output port.

Claims (57)

1. An electronic device comprising:

at least one antenna module comprising at least one antenna, a first printed circuit board, and a second printed circuit board electrically connected to the first printed circuit board;

a communication processor; and

a power amplifier mounted on the at least one antenna module, electrically connected to the communication processor and including a first switch, an input port, a first output port, and a second output port, the power amplifier further including:

a first amplification circuit disposed on a first electrical path between the input port and the first switch,

a second amplification circuit disposed on a second electrical path between the first switch and the first output port, and

a third amplification circuit disposed on a third electrical path between the first switch and the second output port,

wherein the first printed circuit board includes a first antenna array including at least one first antenna,

wherein the second printed circuit board includes a second antenna array including at least one second antenna,

wherein the first amplification circuit and the second amplification circuit are disposed on the first printed circuit board,

wherein the second amplification circuit is electrically connected to the at least one first antenna through at least the first output port, and

wherein the third amplification circuit is disposed on the second printed circuit board, and is electrically connected to the at least one second antenna through at least the second output port.

2. The electronic device of claim 1 , wherein the first amplification circuit, the second amplification circuit, and the third amplification circuit are disposed in a same chip.

3. The electronic device of claim 2 , wherein the chip includes a semiconductor produced in a single element process or

a semiconductor produced in a compound process.

4. The electronic device of claim 3 , wherein the single element process includes one of silicon (Si) and germanium (Ge), and

wherein the compound process includes one of silicon-germanium (SiGe), gallium-arsenic (GaAs), indium-phosphorus (InP), gallium-phosphorus (GaP), cadmium sulfide (CdS), zinc telluride (ZnTe), or lead sulfide (PbS).

5. The electronic device of claim 1 , wherein the second amplification circuit and the third amplification circuit are configured to support different frequency bands and/or different amplification factors.

6. The electronic device of claim 1 ,

wherein the first output port is connected to the at least one first antenna of the plurality of antennas, and

the second output port is connected to the at least one second antenna different from the at least one first antenna.

7. The electronic device of claim 1 , further comprising a low noise amplifier electrically connected to the communication processor, the low noise amplifier including a second switch, an output port, a first input port, and a second input port, the low noise amplifier including:

a fourth amplification circuit disposed on a fourth electrical path between the second switch and the output port,

a fifth amplification circuit disposed on a fifth electrical path between the first input port and the second switch, and

a sixth amplification circuit disposed on a sixth electrical path between the second input port and the second switch.

8. The electronic device of claim 1 , wherein the communication processor is configured to control the first switch to connect the first amplification circuit to the second amplification circuit or the third amplification circuit based on the first output port or the second output port connected to an antenna configured to transmit a signal.

9. An electronic device comprising:

a plurality of antennas:

a communication processor;

a power amplifier electrically connected to the communication processor and including a first switch, an input port, a first output port, and a second output port, the power amplifier further including:

a first amplification circuit disposed on a first electrical path between the input port and the first switch,

a second amplification circuit disposed on a second electrical path between the first switch and the first output port, and

a third amplification circuit disposed on a third electrical path between the first switch and the second output port;

a low noise amplifier electrically connected to the communication processor, the low noise amplifier including a second switch, an output port, a first input port, and a second input port, the low noise amplifier including:

a fourth amplification circuit disposed on a fourth electrical path between the second switch and the output port,

a fifth amplification circuit disposed on a fifth electrical path between the first input port and the second switch, and

a sixth amplification circuit disposed on a sixth electrical path between the second input port and the second switch;

a third switch connecting a first antenna of the plurality of antennas to the first output port or the first input port; and

a fourth switch connecting a second antenna of the plurality of antennas to the second output port or the second input port.

10. The electronic device of claim 9 , further comprising at least one antenna module comprising at least one antenna,

wherein the power amplifier is mounted on the at least one antenna module.

11. The electronic device of claim 10 , wherein the at least one antenna module comprises a first printed circuit board and a second printed circuit board electrically connected to the first printed circuit board, and

wherein the first printed circuit board includes a first antenna array including at least one first antenna,

the second printed circuit board includes a second antenna array including at least one second antenna,

the first amplification circuit and the second amplification circuit are disposed on the first printed circuit board,

the second amplification circuit is electrically connected to the at least one first antenna through the first output port, and

the third amplification circuit is disposed on the second printed circuit board, and is electrically connected to the at least one second antenna through the second output port.

12. The electronic device of claim 9 , wherein the first amplification circuit and the third amplification circuit are disposed in a first chip, and

the second amplification circuit is disposed in a second chip different from the first chip.

13. An electronic device comprising:

a communication processor; and

at least one antenna module electrically connected to the communication processor, the at least one antenna module including a first antenna array including at least one first antenna, a second antenna array including at least one second antenna, a wireless communication circuit, a first printed circuit board a second printed circuit board electrically connected to the first printed circuit board,

wherein the first printed circuit board includes the first antenna array and the wireless communication circuit, and the second printed circuit board includes the second antenna array,

wherein the wireless communication circuit includes a power amplifier including a first switch, an input port, a first output port, and a second output port, the power amplifier including:

a first amplification circuit disposed on a first electrical path between the input port and the first switch,

a second amplification circuit disposed on a second electrical path between the at least one first antenna connected through the first output port and the first switch, and

a third amplification circuit disposed on a third electrical path between the at least one second antenna connected through the second output port and the first switch.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2021
From: LEE, HYOSUNG; CHO, NAMJUN; NA, HYOSEOK; LEE, HANYEOP
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 056711/0970 →
Priority Claims (1)
KR 10-2020-0009123 · Jan 23, 2020 · national
Continuity (1)
Related Publication 20210234522A1 · Jul 29, 2021