Shield printed wiring board and method of manufacturing shield printed wiring board
Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10 , an insulating layer 22 , and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22 . The printed wiring board 10 includes a base 11 , a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13 . The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21 . The conductive adhesive layer 21 has an extension 21 a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.
1. A shielded printed wiring board, comprising:
a printed wiring board;
an insulating layer; and
a conductive adhesive layer disposed between the printed wiring board and the insulating layer,
the printed wiring board including:
a base;
a circuit pattern disposed on the base; and
an insulating protective layer covering the circuit pattern,
the shielded printed wiring board having a through-hole for external grounding, the through-hole penetrating the insulating layer and the conductive adhesive layer in a thickness direction,
the conductive adhesive layer having an extension extending toward the inside of the through-hole as compared with the insulating layer, and
wherein an angle formed by an underside and a topside of the extension at an ending edge of the extension is an acute angle.
2. A shielded printed wiring board, comprising:
a printed wiring board;
an insulating layer; and
a conductive adhesive layer disposed between the printed wiring board and the insulating layer,
the printed wiring board including:
a base;
a circuit pattern disposed on the base; and
an insulating protective layer covering the circuit pattern,
the shielded printed wiring board having a through-hole for external grounding, the through-hole penetrating the insulating layer and the conductive adhesive layer in a thickness direction,
the conductive adhesive layer having an extension extending toward the inside of the through-hole as compared with the insulating layer, and
wherein an angle formed by a topside of the extension and a plane perpendicular to an underside of the extension at a starting end of the extension is an acute angle.
3. A method for manufacturing a shielded printed wiring board, the method comprising:
a shielded printed wiring board main body preparation step of preparing a shielded printed wiring board main body, the main body including:
a printed wiring board having a circuit pattern;
an insulating layer; and
a first conductive adhesive layer with a loss tangent of 0.1 to 0.7 at 150° C. disposed between the printed wiring board and the insulating layer,
the main body having a through-hole for external grounding, the through-hole penetrating the insulating layer and the first conductive adhesive layer in a thickness direction;
an external-grounding connector lamination step of placing an external-grounding connector including a second conductive adhesive layer on a topside of the through-hole so as to bring the second conductive adhesive layer into contact with the shielded printed wiring board main body; and
a thermocompression bonding step of performing thermocompression bonding, thereby allowing the first conductive adhesive layer to extend toward the inside of the through-hole as compared with the insulating layer, and allowing the second conductive adhesive layer to flow into the through-hole, and whereby bringing the first conductive adhesive layer and the second conductive adhesive layer into contact with each other.