IP Library Granted Patent US 11,460,520
Granted Patent B2
US 11,460,520 · App. 16/575,646 · Granted Oct 4, 2022

Sensor test system

Inventors: Kazunari Suga (Tokyo, JP); Daisuke Takano (Tokyo, JP); Satoshi Hanamura (Tokyo, JP); Michiro Chiba (Tokyo, JP); Hisao Nishizaki (Tokyo, JP); Atsushi Hayakawa (Tokyo, JP)
Assignee: ADV ANTEST Corporation
G01R33/077G01D5/145G01R33/31G01R33/095
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Quick Facts
Patent No.
US 11,460,520
App. No.
16/575,646
Granted
Oct 4, 2022
Kind
B2
Abstract

A sensor test system having excellent throughput is provided. The sensor test system 1 includes a test apparatus group 20 including a plurality of sensor test apparatuses 30 A to 30 D coupled to each other so that the sensor 90 can be transferred, and each of the sensor test apparatuses 30 A to 30 D includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies a pressure to the sensor 90 , a test unit 35 which tests the sensor 90 via the socket 445 , and a conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Claims (52)

1. A sensor test system which tests a sensor which detects a first physical quantity, the sensor test system comprising a test apparatus group including a plurality of sensor test apparatuses coupled to each other so that the sensor can be transferred,

each of the sensor test apparatuses comprising:

an application unit comprising at least one application device including

a socket to which the sensor is electrically connected, and

a first application part which applies the first physical quantity to the sensor;

a test unit which tests the sensor via the socket; and

a first conveying device which conveys the sensor into and out of the application unit, wherein

each of the sensor test apparatuses comprises an apparatus main body which houses the application unit, the test unit and the first conveying device,

the apparatus main body has

a first opening through which the sensor is supplied to a first position in the sensor test apparatus, and

a second opening through which the sensor is discharged from a second position in the sensor test apparatus,

the sensor test apparatuses include first and second sensor test apparatuses adjacent to each other, and

the second opening of the first sensor test apparatus and the first opening of the second sensor test apparatus face each other.

2. The sensor test system according to claim 1 , wherein

the test apparatus group includes a second conveying device which moves from the second position of the first sensor test apparatus to the first position of the second sensor test apparatus, and

the second conveying device transfers the sensor from the first sensor test apparatus to the second sensor test apparatus through the second opening of the first sensor test apparatus and the first opening of the second sensor test apparatus.

3. The sensor test system of claim 1 , wherein

each of the sensor test apparatuses comprises a control unit which controls the application unit, the test unit and the first conveying device, and

the control unit of one of the sensor test apparatuses controls the control units of the remaining sensor test apparatuses.

4. The sensor test system according to claim 1 , wherein

the sensor test system comprises:

a supply device which supplies the untested sensor to the test apparatus group, and

a discharge device which discharges the tested sensor from the test apparatus group.

5. The sensor test system according to claim 1 , wherein

the first physical quantity is a pressure,

the first application part is a pressure application part which applies a pressure to the sensor, and

the sensor detects the pressure and outputs an electrical signal according to the detection result.

6. The sensor test system according to claim 1 , wherein

the first physical quantity is a pressure difference between two kinds of pressures,

the first application part is a differential pressure application part which applies two kinds of pressures to the sensor, and

the sensor detects a pressure difference between the two kinds of pressures and outputs an electric signal according to the detection result.

7. The sensor test system according to claim 1 , wherein

the first physical quantity is a magnitude of a magnetic field,

the first application part is a magnetic field application part which applies a magnetic field to the sensor, and

the sensor detects a magnitude of the magnetic field and outputs an electric signal according to the detection result.

8. The sensor test system according to claim 1 , wherein

the application device includes a second application part which applies a second physical quantity different from the first physical quantity to the sensor, and

the sensor test apparatuses include:

a sensor test apparatus which applies the second physical quantity of a first value to the sensor; and

a sensor test apparatus which applies the second physical quantity of a second value different from the first value to the sensor.

9. The sensor test system according to claim 8 , wherein the second application part is a temperature adjustment part which applies a thermal stress to the sensor to adjust the temperature of the sensor.

10. A sensor test system which tests a sensor which detects a first physical quantity, the sensor test system comprising a test apparatus group including a plurality of sensor test apparatuses coupled to each other so that the sensor can be transferred,

each of the sensor test apparatuses comprising:

an application unit comprising at least one application device including

a socket to which the sensor is electrically connected, and

a first application part which applies the first physical quantity to the sensor;

a test unit which tests the sensor via the socket; and

a first conveying device which conveys the sensor into and out of the application unit, wherein

the application device includes a second application part which applies a second physical quantity different from the first physical quantity to the sensor,

the second application part is a temperature adjustment part which applies a thermal stress to the sensor to adjust the temperature of the sensor,

the application device includes a pusher which contacts the sensor and presses the sensor against the socket, and

the temperature adjustment part is disposed in the pusher.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2019
From: SUGA, KAZUNARI; TAKANO, DAISUKE; HANAMURA, SATOSHI; CHIBA, MICHIRO; NISHIZAKI, HISAO; HAYAKAWA, ATSUSHI
To: ADVANTEST CORPORATION
Reel/Frame 051219/0507 →
Priority Claims (1)
JP JP2018-234116 · Dec 14, 2018 · national
Continuity (1)
Related Publication 20200191886A1 · Jun 18, 2020