Lateral mounting of optoelectronic chips on organic substrate

1. A method for manufacturing an OE (optoelectronic) chip packaging system comprising:

forming patterns of transmission lines and alignment marks for an OE chip and a lens array for the OE chip on a top surface of a substrate;

making vias to place solder for the OE chip and to connect to a driver IC (Integrated Circuit) chip for the OE chip;

filling the vias for the OE chip with solder;

making holes to mount the OE chip and the lens array on the top surface of the substrate;

mounting the OE chip on the holes for the OE chip and the driver IC chip on the vias filled with conductive material, and reflowing the solder filled the vias for the OE chip;

mounting the lens array on the holes for the lens array; and

applying an adhesive to the OE chip and the lens array and curing the adhesive to fix the OE chip and the lens array to the substrate.

2. The method of claim 1 , wherein the mounting the OE chip on the holes for the OE chip comprises mounting the OE chip on the holes for the OE chip so that an optically active (emission/detection) area of the OE chip may be directed laterally.

3. The method of claim 1 , wherein the lens array has inside a reflector reflecting light from lateral/downward direction to upward/lateral direction (emission/detection).

4. The method of claim 3 , wherein the reflector is a hollow portion which is formed inside the lens array for the OE chip and has an inclined surface reflecting light from the first direction to the second direction.

5. The method of claim 3 , wherein the lens array for the OE chip comprises a convex side surface facing to the optically active area of the OE chip and a planar top surface.

6. The method of claim 1 , further comprising mounting a lens array for an optical fiber for electrical communication with the lens array for the OE chip.

7. The method of claim 6 , wherein mounting the lens array for the optical fiber includes aligning with the lens array for the OE chip using guide pins.

8. The method of claim 1 , wherein making the vias comprises laser ablation.

9. The method of claim 1 , wherein making the holes uses the patterns of the alignment marks for the OE chip and the lens array formed on the top surface of the substrate.

10. The method of claim 1 , further comprising forming an insulating layer over the patterns of the transmission lines and the alignment marks, before making the vias.

11. The method of claim 1 , wherein the first lens array encapsulates a turning structure that includes a hollow reflector, corresponding to a void having a triangular shaped cross-section.

12. A method for manufacturing an OE (optoelectronic) chip packaging system comprising:

forming patterns of transmission lines and alignment marks for an OE chip and a lens array for the OE chip on a top surface of a substrate, wherein the first lens array encapsulates a turning structure that includes a hollow reflector, corresponding to a void having a triangular shaped cross-section;

making vias to place solder for the OE chip and to connect to a driver IC (Integrated Circuit) chip for the OE chip;

filling the vias for the OE chip with solder;

making holes to mount the OE chip and the lens array on the top surface of the substrate;

mounting the OE chip on the holes for the OE chip and the driver IC chip on the vias filled with conductive material, and reflowing the solder filled the vias for the OE chip;

mounting the lens array on the holes for the lens array; and

applying an adhesive to the OE chip and the lens array and curing the adhesive to fix the OE chip and the lens array to the substrate.

13. The method of claim 12 , further comprising mounting a lens array for an optical fiber for electrical communication with the lens array for the OE chip.

14. The method of claim 13 , wherein mounting the lens array for the optical fiber includes aligning with the lens array for the OE chip using guide pins.

15. The method of claim 12 , wherein making the vias comprises laser ablation.

16. The method of claim 12 , wherein making the holes uses the patterns of the alignment marks for the OE chip and the lens array formed on the top surface of the substrate.

17. The method of claim 12 , further comprising forming an insulating layer over the patterns of the transmission lines and the alignment marks, before making the vias.

18. A method for manufacturing an OE (optoelectronic) chip packaging system comprising:

forming patterns of transmission lines and alignment marks for an OE chip and a lens array for the OE chip on a top surface of a substrate;

forming an insulating layer over the patterns of the transmission lines and the alignment marks;

making vias to place solder for the OE chip and to connect to a driver IC (Integrated Circuit) chip for the OE chip by laser ablation;

filling the vias for the OE chip with solder, while using the patterns of the alignment marks for the OE chip and the lens array formed on the top surface of the substrate, making holes to mount the OE chip and the lens array on the top surface of the substrate;

mounting the OE chip on the holes for the OE chip and the driver IC chip on the vias filled with conductive material, and reflowing solder filled the vias for the OE chip;

mounting the lens array on the holes for the lens array; and

applying an adhesive to the OE chip and the lens array and curing the adhesive to fix the OE chip and the lens array to the substrate.

19. The method of 18 , wherein the mounting the OE chip on the holes for the OE chip comprises mounting the OE chip on the holes for the OE chip so that an optically active (emission/detection) area of the OE chip may be directed laterally.

20. The method of 18 , wherein the lens array has inside a reflector reflecting light from lateral/downward direction to upward/lateral direction (emission/detection).